GB1225860A - - Google Patents
Info
- Publication number
- GB1225860A GB1225860A GB1225860DA GB1225860A GB 1225860 A GB1225860 A GB 1225860A GB 1225860D A GB1225860D A GB 1225860DA GB 1225860 A GB1225860 A GB 1225860A
- Authority
- GB
- United Kingdom
- Prior art keywords
- polyamide
- sept
- aqueous solution
- copper ion
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004952 Polyamide Substances 0.000 abstract 5
- 229920002647 polyamide Polymers 0.000 abstract 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- 239000007864 aqueous solution Substances 0.000 abstract 2
- 229910001431 copper ion Inorganic materials 0.000 abstract 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 abstract 1
- 150000003951 lactams Chemical class 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 239000000376 reactant Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyamides (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
1,225,860. Stabilized polyamides. ALLIED CHEMICAL CORP. 26 Sept., 1968 [28 Sept., 1967], No. 45871/68. Heading C3R. A polyamide is heat stabilized by addition of 30-300 p.p.m. of copper ion, 0À05-0À4% HI or NH 4 I and 0À05-2% KI. The polyamide may be prepared from a diamine-dicarboxylic acid salt or a C 6-12 lactam, e.g. epsilon caprolactam. The copper ion and NH 4 I or HI may be added in aqueous solution to the polyamide forming reactants before or during polymerization. The copper may be CuCl 2 . The polyamide may be impregnated with an aqueous solution of KI.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67268167A | 1967-09-28 | 1967-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1225860A true GB1225860A (en) | 1971-03-24 |
Family
ID=24699570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1225860D Expired GB1225860A (en) | 1967-09-28 | 1968-09-26 |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE721457A (en) |
| DE (1) | DE1794227A1 (en) |
| FR (1) | FR1581934A (en) |
| GB (1) | GB1225860A (en) |
| NL (1) | NL6813863A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3435658B2 (en) | 1993-02-19 | 2003-08-11 | バイエル アクチェンゲゼルシャフト | Heat stable copper-containing polyamide molding compound |
| WO2006074912A1 (en) * | 2005-01-12 | 2006-07-20 | Dsm Ip Assets B.V. | Heat stabilized moulding composition |
| JP2008530290A (en) * | 2005-02-08 | 2008-08-07 | ビーエーエスエフ ソシエタス・ヨーロピア | Heat aging polyamide |
| US8772394B2 (en) | 2005-01-17 | 2014-07-08 | Dsm Ip Assets B.V. | Heat stabilized moulding composition |
| CN111912801A (en) * | 2020-08-21 | 2020-11-10 | 平顶山神马工程塑料有限责任公司 | A kind of determination method of copper ion content in polyamide chips |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0063687A3 (en) * | 1981-04-24 | 1983-04-13 | Allied Corporation | Nylon composition for use in rotational molding |
-
1968
- 1968-09-26 GB GB1225860D patent/GB1225860A/en not_active Expired
- 1968-09-26 BE BE721457D patent/BE721457A/xx unknown
- 1968-09-26 DE DE19681794227 patent/DE1794227A1/en active Pending
- 1968-09-27 NL NL6813863A patent/NL6813863A/xx unknown
- 1968-09-27 FR FR1581934D patent/FR1581934A/fr not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3435658B2 (en) | 1993-02-19 | 2003-08-11 | バイエル アクチェンゲゼルシャフト | Heat stable copper-containing polyamide molding compound |
| WO2006074912A1 (en) * | 2005-01-12 | 2006-07-20 | Dsm Ip Assets B.V. | Heat stabilized moulding composition |
| EA012906B1 (en) * | 2005-01-12 | 2010-02-26 | ДСМ АйПи АССЕТС Б.В. | Thermoplastic moulding compositions, use thereof, process for making moulded part and a part |
| CN101103067B (en) * | 2005-01-12 | 2012-07-04 | 帝斯曼知识产权资产管理有限公司 | heat stable molding composition |
| US8772397B2 (en) | 2005-01-12 | 2014-07-08 | Dsm Ip Assets B.V. | Heat stabilized moulding composition |
| US8975325B2 (en) | 2005-01-12 | 2015-03-10 | Dsm Ip Assets B.V. | Heat stabilized moulding composition |
| US8772394B2 (en) | 2005-01-17 | 2014-07-08 | Dsm Ip Assets B.V. | Heat stabilized moulding composition |
| US8969460B2 (en) | 2005-01-17 | 2015-03-03 | Dsm Ip Assets B.V. | Heat stabilized moulding composition |
| JP2008530290A (en) * | 2005-02-08 | 2008-08-07 | ビーエーエスエフ ソシエタス・ヨーロピア | Heat aging polyamide |
| CN111912801A (en) * | 2020-08-21 | 2020-11-10 | 平顶山神马工程塑料有限责任公司 | A kind of determination method of copper ion content in polyamide chips |
| CN111912801B (en) * | 2020-08-21 | 2023-02-24 | 平顶山神马工程塑料有限责任公司 | A method for measuring copper ion content in polyamide chips |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1581934A (en) | 1969-09-19 |
| BE721457A (en) | 1969-03-03 |
| NL6813863A (en) | 1969-04-01 |
| DE1794227A1 (en) | 1971-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |