GB1265489A - - Google Patents
Info
- Publication number
- GB1265489A GB1265489A GB1265489DA GB1265489A GB 1265489 A GB1265489 A GB 1265489A GB 1265489D A GB1265489D A GB 1265489DA GB 1265489 A GB1265489 A GB 1265489A
- Authority
- GB
- United Kingdom
- Prior art keywords
- styrene
- vinyl acetate
- methacrylic acid
- butadiene
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 10
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract 5
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 abstract 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 4
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- -1 polypropylene Polymers 0.000 abstract 3
- NBNGHXWJFSMASY-UHFFFAOYSA-N 2,3,4-tris(dimethylamino)phenol Chemical compound CN(C)C1=CC=C(O)C(N(C)C)=C1N(C)C NBNGHXWJFSMASY-UHFFFAOYSA-N 0.000 abstract 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000005977 Ethylene Substances 0.000 abstract 2
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000002775 capsule Substances 0.000 abstract 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 abstract 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005062 Polybutadiene Substances 0.000 abstract 1
- 239000004743 Polypropylene Substances 0.000 abstract 1
- 239000004793 Polystyrene Substances 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229920006322 acrylamide copolymer Polymers 0.000 abstract 1
- 229920006222 acrylic ester polymer Polymers 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 229910001234 light alloy Inorganic materials 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 abstract 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 abstract 1
- 229920002857 polybutadiene Polymers 0.000 abstract 1
- 229920006254 polymer film Polymers 0.000 abstract 1
- 229920001155 polypropylene Polymers 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
- 229920002689 polyvinyl acetate Polymers 0.000 abstract 1
- 239000011118 polyvinyl acetate Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
1,265,489. Laminates. DUNLOP HOLDINGS Ltd. 16 July, 1969 [17 July, 1968], No. 33973/68. Heading B5N. [Also in Division C3] A method of bonding two surfaces together comprises applying to at least one of the surfaces to be bonded an adhesive composition comprising (a) a curable resin and (b) a curing agent therefor, at least one of (a) and (b) being contained in capsules dispersed in a liquid filmforming polymer composition, and pressing to rupture the capsules dispersed in the polymer film. Alternatively the adhesive composition may be cast on a substrate, e.g. polypropylene film, to form an unsupported foil which may be placed between the surfaces to be bonded. The resin may be an epoxide resin and the curing agent an amine, e.g. tetraethylene pentamine, tri - (dimethylamino) phenol and benzyldimethylamine. The film-forming polymer may be an ethylene/vinyl acetate, vinyl acetate/ acrylic ester, butadiene/styrene/acrylic ester, butadiene/styrene/unsaturated acid or styrene/ acrylic ester/methacrylic acid copolymer, polybutadiene, polyvinyl acetate or polystyrene, preferably in aqueous dispersion. In examples, light alloy test-pieces are bonded by pressing together surfaces coated with, or with a pre-cast foil therebetween formed from, compositions comprising encapsulated epoxy resin, tetraethylene pentamine arid lances of (I) ethylene/ vinyl acetate, (II) ethyl acrylate/styrene/2- ethylhexyl acrylate/methacrylic acid, (III) vinyl acetate/2-ethylhexyl acrylate, (IV) butadiene/ styrono/itaconic acid, (V) ethyl acrylate/styrene/ methacrylic acid/N-methylol acrylamide and (VI) 2-ethylhexyl acrylate/methacrylic acid/ N-methylol acrylamide copolymers. The curing agent may be replaced by tri-(dimethylamino) phenol or benzyldimethylamine.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3397368 | 1968-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1265489A true GB1265489A (en) | 1972-03-01 |
Family
ID=10359760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1265489D Expired GB1265489A (en) | 1968-07-17 | 1968-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1265489A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0063475A1 (en) * | 1981-04-21 | 1982-10-27 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| US4536524A (en) * | 1981-04-21 | 1985-08-20 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| GB2155938A (en) * | 1984-03-20 | 1985-10-02 | Westinghouse Electric Corp | Aqueous epoxy resin impregnatng composition |
| EP0209080A1 (en) * | 1985-07-10 | 1987-01-21 | The Oakland Corporation | Packaged adhesive |
| US4764579A (en) * | 1985-07-10 | 1988-08-16 | The Oakland Corporation | Packaged adhesive |
| GB2201681A (en) * | 1987-03-06 | 1988-09-07 | Swift Adhesives Ltd | Heat and pressure activated adhesive compositions |
| GB2224739A (en) * | 1988-08-30 | 1990-05-16 | Japan Synthetic Rubber Co Ltd | Modified epoxy compositions |
| EP0672707A3 (en) * | 1994-03-15 | 1996-07-03 | Toray Industries | Microencapsulated curing agent for thermosetting resin compositions. |
| WO2004024841A3 (en) * | 2002-09-11 | 2004-07-15 | Henkel Loctite Deutschland Gmb | An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener |
| WO2005104744A3 (en) * | 2004-04-28 | 2006-02-02 | L & L Products Inc | Method for forming structures using an encapsulated adhesive material |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| EP2792724A1 (en) * | 2013-04-15 | 2014-10-22 | Samsung Display Co., Ltd. | Adhesive, adhesive tape and pre-product of an organic light emitting display device comprising an adhesive layer formed by the adhesive |
| CN105646797A (en) * | 2016-04-01 | 2016-06-08 | 烟台德邦科技有限公司 | Method for synthesizing acrylic ester modified epoxy toughening agents |
-
1968
- 1968-07-17 GB GB1265489D patent/GB1265489A/en not_active Expired
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0063475A1 (en) * | 1981-04-21 | 1982-10-27 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| US4536524A (en) * | 1981-04-21 | 1985-08-20 | Capsulated Systems, Inc. | Microencapsulated epoxy adhesive system |
| GB2155938A (en) * | 1984-03-20 | 1985-10-02 | Westinghouse Electric Corp | Aqueous epoxy resin impregnatng composition |
| EP0209080A1 (en) * | 1985-07-10 | 1987-01-21 | The Oakland Corporation | Packaged adhesive |
| US4764579A (en) * | 1985-07-10 | 1988-08-16 | The Oakland Corporation | Packaged adhesive |
| GB2201681A (en) * | 1987-03-06 | 1988-09-07 | Swift Adhesives Ltd | Heat and pressure activated adhesive compositions |
| GB2224739A (en) * | 1988-08-30 | 1990-05-16 | Japan Synthetic Rubber Co Ltd | Modified epoxy compositions |
| GB2224739B (en) * | 1988-08-30 | 1992-09-23 | Japan Synthetic Rubber Co Ltd | Modified epoxy composition |
| EP0672707A3 (en) * | 1994-03-15 | 1996-07-03 | Toray Industries | Microencapsulated curing agent for thermosetting resin compositions. |
| WO2004024841A3 (en) * | 2002-09-11 | 2004-07-15 | Henkel Loctite Deutschland Gmb | An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener |
| WO2005104744A3 (en) * | 2004-04-28 | 2006-02-02 | L & L Products Inc | Method for forming structures using an encapsulated adhesive material |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| US9688050B2 (en) | 2004-06-18 | 2017-06-27 | Zephyros, Inc. | Panel structure |
| US10647083B2 (en) | 2004-06-18 | 2020-05-12 | Zephyros, Inc. | Panel structure |
| EP2792724A1 (en) * | 2013-04-15 | 2014-10-22 | Samsung Display Co., Ltd. | Adhesive, adhesive tape and pre-product of an organic light emitting display device comprising an adhesive layer formed by the adhesive |
| CN105646797A (en) * | 2016-04-01 | 2016-06-08 | 烟台德邦科技有限公司 | Method for synthesizing acrylic ester modified epoxy toughening agents |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |