GB1260896A - Curable epoxide resin compositions - Google Patents
Curable epoxide resin compositionsInfo
- Publication number
- GB1260896A GB1260896A GB4458069A GB4458069A GB1260896A GB 1260896 A GB1260896 A GB 1260896A GB 4458069 A GB4458069 A GB 4458069A GB 4458069 A GB4458069 A GB 4458069A GB 1260896 A GB1260896 A GB 1260896A
- Authority
- GB
- United Kingdom
- Prior art keywords
- dimethyl
- urea
- curing
- nucleus
- methylphenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract 7
- 238000001723 curing Methods 0.000 abstract 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 abstract 2
- 150000000182 1,3,5-triazines Chemical class 0.000 abstract 1
- ROHTVIURAJBDES-UHFFFAOYSA-N 2-n,2-n-bis(prop-2-enyl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N(CC=C)CC=C)=N1 ROHTVIURAJBDES-UHFFFAOYSA-N 0.000 abstract 1
- CVKGSDYWCFQOKU-UHFFFAOYSA-N 2-n-butyl-1,3,5-triazine-2,4,6-triamine Chemical compound CCCCNC1=NC(N)=NC(N)=N1 CVKGSDYWCFQOKU-UHFFFAOYSA-N 0.000 abstract 1
- 239000004606 Fillers/Extenders Substances 0.000 abstract 1
- 229920000877 Melamine resin Polymers 0.000 abstract 1
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000003710 aryl alkyl group Chemical group 0.000 abstract 1
- 125000000753 cycloalkyl group Chemical group 0.000 abstract 1
- -1 dimethylcarbamoyl Chemical group 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 125000005843 halogen group Chemical group 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000013007 heat curing Methods 0.000 abstract 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- RECCURWJDVZHIH-UHFFFAOYSA-N para-chlorophenylurea Natural products NC(=O)NC1=CC=C(Cl)C=C1 RECCURWJDVZHIH-UHFFFAOYSA-N 0.000 abstract 1
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
- C08G59/5086—Triazines; Melamines; Guanamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
1,260,896. Curing epoxy resins. CIBA (A.R.L.) Ltd. 19 Aug., 1970 [9 Sept., 1969], No. 44580/69. Addition to 1,153,639. Heading C3B. Curable compositions comprise: (I) an epoxy resin, (II) as heat-curing agent a polyhydric phenol or a compound containing at least two primary amino groups attached to a 1,3,5- triazine nucleus, and (III) as curing accelerator a compound containing directly attached to an aromatic nucleus at least one residue in which R<SP>1</SP> is alkyl, alkenyl, cycloalkyl or aralkyl, R<SP>2</SP> either has the same definition as R<SP>1</SP> or is alkoxy; R<SP>1</SP> and R<SP>2</SP> may be substituted by halogen, OH or CN; R<SP>1</SP> and R<SP>2</SP> together with the nitrogen atom may form a heterocyclic ring; X is O or S. Not more than two such residues may be attached to any one aromatic nucleus (preferably a phenyl nucleus). Specific curing agents are resorcinol, hydroquinone, bisphenol A, a phenol novolac, melamine, N - (n - butyl)melamine, N,N - diallylmelamine and laurylguanamine. Accelerators exemplified are N,N - dimethyl - N<SP>1</SP> - (4 - chlorophenyl)urea; N,N - dimethyl - N<SP>1</SP> - (3 - chloro- 4 - methylphenyl)urea; N,N - dimethyl - N<SP>1</SP> - (4 - ethoxyphenyl)urea; N,N - dimethyl - N<SP>1</SP> - (3 - chloro - 4 - methylphenyl)thiourea; N,N<SP>1</SP>- bis - (dimethylcarbamoyl) - 2,4 - or 2,6 - toluidine and bis - [4 - (N,N - dimethylureido)- phenyl]-methane. The accelerator may be used at 0À01-10 parts by wt. per 100 parts by wt. of epoxy resin. Conventional fillers, extenders and solvents may be present.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE755863D BE755863A (en) | 1969-09-09 | CURING COMPOSITIONS OF EPOXIDIZED RESINS | |
| GB4458069A GB1260896A (en) | 1969-09-09 | 1969-09-09 | Curable epoxide resin compositions |
| CH1314670A CH539094A (en) | 1969-09-09 | 1970-09-03 | Curable epoxy resin composition |
| FR7032447A FR2061055A5 (en) | 1969-09-09 | 1970-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4458069A GB1260896A (en) | 1969-09-09 | 1969-09-09 | Curable epoxide resin compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1260896A true GB1260896A (en) | 1972-01-19 |
Family
ID=10433947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4458069A Expired GB1260896A (en) | 1969-09-09 | 1969-09-09 | Curable epoxide resin compositions |
Country Status (4)
| Country | Link |
|---|---|
| BE (1) | BE755863A (en) |
| CH (1) | CH539094A (en) |
| FR (1) | FR2061055A5 (en) |
| GB (1) | GB1260896A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283520A (en) | 1979-04-20 | 1981-08-11 | Ciba-Geigy Corporation | Storage-stable, homogeneous mixture containing epoxide resin, curing agent and curing accelerator, and the use of the mixture for producing cured products |
| JPH0360056A (en) * | 1989-07-28 | 1991-03-15 | Tomoegawa Paper Co Ltd | Solid state image sensing device sealing adhesive |
| EP0728789A3 (en) * | 1995-02-27 | 1997-10-22 | Matsushita Electric Works Ltd | Epoxy resin compound for use in laminated sheet |
| US6231959B1 (en) * | 1995-02-27 | 2001-05-15 | Matsushita Electric Works, Ltd. | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
| JP3339240B2 (en) | 1995-02-27 | 2002-10-28 | 松下電工株式会社 | Manufacturing method of prepreg |
| EP3118238A1 (en) * | 2012-08-02 | 2017-01-18 | AlzChem AG | Liquid hardeners for curing epoxy resins (i) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5949225A (en) * | 1982-09-16 | 1984-03-21 | Hitachi Ltd | Heat-resistant flame-retardant resin composition |
| US5064881A (en) * | 1989-01-18 | 1991-11-12 | Mitsui Petrochemical Industries, Ltd. | Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica |
-
0
- BE BE755863D patent/BE755863A/en unknown
-
1969
- 1969-09-09 GB GB4458069A patent/GB1260896A/en not_active Expired
-
1970
- 1970-09-03 CH CH1314670A patent/CH539094A/en not_active IP Right Cessation
- 1970-09-07 FR FR7032447A patent/FR2061055A5/fr not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283520A (en) | 1979-04-20 | 1981-08-11 | Ciba-Geigy Corporation | Storage-stable, homogeneous mixture containing epoxide resin, curing agent and curing accelerator, and the use of the mixture for producing cured products |
| JPH0360056A (en) * | 1989-07-28 | 1991-03-15 | Tomoegawa Paper Co Ltd | Solid state image sensing device sealing adhesive |
| EP0728789A3 (en) * | 1995-02-27 | 1997-10-22 | Matsushita Electric Works Ltd | Epoxy resin compound for use in laminated sheet |
| US6231959B1 (en) * | 1995-02-27 | 2001-05-15 | Matsushita Electric Works, Ltd. | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
| JP3339240B2 (en) | 1995-02-27 | 2002-10-28 | 松下電工株式会社 | Manufacturing method of prepreg |
| EP3118238A1 (en) * | 2012-08-02 | 2017-01-18 | AlzChem AG | Liquid hardeners for curing epoxy resins (i) |
Also Published As
| Publication number | Publication date |
|---|---|
| BE755863A (en) | 1971-03-08 |
| FR2061055A5 (en) | 1971-06-18 |
| CH539094A (en) | 1973-07-15 |
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