GB1255941A - Improvements in or relating to the manufacture of microminiature integrated circuit arrangements and structures - Google Patents

Abstract

1,255,941. Welding by pressure. MARCONI CO. Ltd. 14 Jan., 1969 [19 Feb., 1968], No. 7928/68. Heading B3R. [Also in Division H1] In a process for manufacturing microminiature integrated or similar circuit arrangements wherein two or more aluminium conductors mounted on electrically insulating substrates are required to be electrically and mechanically bonded, such bonding is achieved by pressing the conductors directly together and raising the temperature of each by the application of an external source of heat to a value at which bonding takes place without substantial deformation of any of the conductors. In bonding the raised pads 6 of aluminium conductors 1 on a glass substrate 2 to the aluminium conductors 3 on a silicon substrate.4, the substrates are pressed together with-the conductors in contact by pressing tools 7, 8 and the tool 7 is heated, preferably to at least 450‹ C. Although both tools may have planar pressing surfaces, where one substrate is substantially undeformable a probe with a rounded tip maybe used, as shown, to press that substrate. The pressure is preferably 20,000 p.s.i. Although both sets of conductors may be heated to the same temperature, it is stated that a better bond results when one set is at a slightly higher temperature than the other. A theory explaining the working of the process is advanced.