GB1131375A - Copper brazing paste - Google Patents
Copper brazing pasteInfo
- Publication number
- GB1131375A GB1131375A GB2215067A GB2215067A GB1131375A GB 1131375 A GB1131375 A GB 1131375A GB 2215067 A GB2215067 A GB 2215067A GB 2215067 A GB2215067 A GB 2215067A GB 1131375 A GB1131375 A GB 1131375A
- Authority
- GB
- United Kingdom
- Prior art keywords
- brazing paste
- solvent
- solution
- copper brazing
- polystyrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 238000005219 brazing Methods 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- 239000002904 solvent Substances 0.000 abstract 4
- 239000004793 Polystyrene Substances 0.000 abstract 2
- 229920002223 polystyrene Polymers 0.000 abstract 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2215067A GB1131375A (en) | 1967-05-12 | 1967-05-12 | Copper brazing paste |
| DE19681758319 DE1758319A1 (de) | 1967-05-12 | 1968-05-11 | Loetpaste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2215067A GB1131375A (en) | 1967-05-12 | 1967-05-12 | Copper brazing paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1131375A true GB1131375A (en) | 1968-10-23 |
Family
ID=10174737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2215067A Expired GB1131375A (en) | 1967-05-12 | 1967-05-12 | Copper brazing paste |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1758319A1 (de) |
| GB (1) | GB1131375A (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995000285A1 (en) * | 1993-06-28 | 1995-01-05 | W.R. Grace & Co.-Conn. | Solderable anisotropically conductive composition and method of using same |
| CN102764939A (zh) * | 2012-07-18 | 2012-11-07 | 熊进 | 一种醇溶性铜焊膏 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3510000A1 (de) * | 1985-03-20 | 1986-10-02 | Ka We electronic GmbH & Co KG, 4796 Salzkotten | Thermoplastisches loetmittel und verfahren und vorrichtung zu dessen verwendung |
-
1967
- 1967-05-12 GB GB2215067A patent/GB1131375A/en not_active Expired
-
1968
- 1968-05-11 DE DE19681758319 patent/DE1758319A1/de active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995000285A1 (en) * | 1993-06-28 | 1995-01-05 | W.R. Grace & Co.-Conn. | Solderable anisotropically conductive composition and method of using same |
| CN102764939A (zh) * | 2012-07-18 | 2012-11-07 | 熊进 | 一种醇溶性铜焊膏 |
| CN102764939B (zh) * | 2012-07-18 | 2014-08-20 | 熊进 | 一种醇溶性铜焊膏 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1758319A1 (de) | 1971-01-07 |
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