GB1055243A - Improvements in or relating to electroplating - Google Patents
Improvements in or relating to electroplatingInfo
- Publication number
- GB1055243A GB1055243A GB30313/63A GB3031363A GB1055243A GB 1055243 A GB1055243 A GB 1055243A GB 30313/63 A GB30313/63 A GB 30313/63A GB 3031363 A GB3031363 A GB 3031363A GB 1055243 A GB1055243 A GB 1055243A
- Authority
- GB
- United Kingdom
- Prior art keywords
- paste
- additives
- mixture
- added
- diethylenetriamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009713 electroplating Methods 0.000 title abstract 2
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical compound S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 abstract 6
- 239000000654 additive Substances 0.000 abstract 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 abstract 4
- 229920002134 Carboxymethyl cellulose Polymers 0.000 abstract 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 4
- 239000001768 carboxy methyl cellulose Substances 0.000 abstract 4
- 235000010948 carboxy methyl cellulose Nutrition 0.000 abstract 4
- 239000008112 carboxymethyl-cellulose Substances 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 abstract 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 239000000969 carrier Substances 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- FSSPGSAQUIYDCN-UHFFFAOYSA-N 1,3-Propane sultone Chemical compound O=S1(=O)CCCO1 FSSPGSAQUIYDCN-UHFFFAOYSA-N 0.000 abstract 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- 238000013019 agitation Methods 0.000 abstract 2
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 abstract 2
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 abstract 2
- 239000000047 product Substances 0.000 abstract 2
- 238000010992 reflux Methods 0.000 abstract 2
- 235000013162 Cocos nucifera Nutrition 0.000 abstract 1
- 244000060011 Cocos nucifera Species 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract 1
- 229910021529 ammonia Inorganic materials 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 239000008280 blood Substances 0.000 abstract 1
- 210000004369 blood Anatomy 0.000 abstract 1
- 238000009835 boiling Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000007859 condensation product Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- 150000002191 fatty alcohols Chemical class 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229920002689 polyvinyl acetate Polymers 0.000 abstract 1
- 239000011118 polyvinyl acetate Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000002002 slurry Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 230000008961 swelling Effects 0.000 abstract 1
- 239000002562 thickening agent Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
- C07D295/16—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms
- C07D295/20—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms by radicals derived from carbonic acid, or sulfur or nitrogen analogues thereof
- C07D295/21—Radicals derived from sulfur analogues of carbonic acid
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/04—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
- C07D233/28—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
- C07D233/30—Oxygen or sulfur atoms
- C07D233/42—Sulfur atoms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Automation & Control Theory (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Filtering Materials (AREA)
- Chemically Coating (AREA)
Abstract
In electroplating using acid baths, organic bath additives which do not readily dissolve are provided by dissolution from carriers coated with a pasty mass of a mixture of the additive and a solvent therefor, swelling and/or thickening agents. The carriers may be perforated plastic discs, Raschig rings, balls or filter discs and may be placed in a column in the bath or an electrolyte circulating pump system or in a dissolving cage in such a circulating system after the dirt-catching filter. The additives may be compounds including N- and S-containing groups as in the parent Specification and may be made into a paste with carboxymethylcellulose for use in Cu and Zn baths containing an addition product formed from ethylene oxide and coconut fatty alcohols, or may be blood albumen made into a slurry with carboxymethyl cellulose and ammonia for a simple acid copper bath. In other examples the additive is made into a paste with polyvinyl acetate and ethanol, while additives formed by reacting diethylenetriamine or dipropylenetriamine with epichlorhydrin, carbon disulphide, propane sultone and benzoyl chloride for Cu and Sn baths are also disclosed, such additives being applied to the carriers either by making them brushable with acetone or by forming a paste with carboxymethyl cellulose.ALSO:An aqueous solution of diethylenetriamine and epichlorhydrin are slowly mixed at 100 DEG C. and then heated under reflux with agitation for four hours whereupon after cooling, sodium hydroxide is added and carbon disulphide is added during gentle heating at 45 DEG C. The mixture is then heated at 65 DEG C. with agitation, cooled, unreacted carbon disulphide vacuum distilled off, ethanol added warmed at 65 DEG C., and a mixture of propane sultone and benzoyl chloride added, followed by boiling under reflux. The mixture separates into two layers and the lower layer remaining after pouring off the upper layer is washed with acidified water and acetone leaving a yellow viscous mass. A similar process using dipropylenetriamine instead of diethylenetriamine yields a bright yellow powder condensation product. The copper salt of this product may be mixed with aqueous carboxymethyl cellulose solution to form a paste.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DED36777A DE1224111B (en) | 1961-08-10 | 1961-08-10 | Acid galvanic copper and nickel baths and process for depositing the coatings |
| DED0039520 | 1962-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1055243A true GB1055243A (en) | 1967-01-18 |
Family
ID=25971309
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB26837/62A Expired GB941823A (en) | 1961-08-10 | 1962-07-12 | Improvements in or relating to electroplating |
| GB30313/63A Expired GB1055243A (en) | 1961-08-10 | 1963-07-31 | Improvements in or relating to electroplating |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB26837/62A Expired GB941823A (en) | 1961-08-10 | 1962-07-12 | Improvements in or relating to electroplating |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US3257294A (en) |
| BE (1) | BE621297A (en) |
| CH (1) | CH429356A (en) |
| DE (2) | DE1224111B (en) |
| GB (2) | GB941823A (en) |
| NL (1) | NL281922A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH494824A (en) * | 1969-07-10 | 1970-08-15 | Fluehmann Werner | Process for the electrodeposition of copper with high ductility |
| US3669853A (en) * | 1969-07-15 | 1972-06-13 | Chemetron Corp | Coumarin-carrier addition agent for nickel baths |
| US3518171A (en) * | 1969-07-24 | 1970-06-30 | Metalux Corp The | Purification of nickel electroplating solutions |
| US4014761A (en) * | 1975-01-06 | 1977-03-29 | M & T Chemicals Inc. | Bright acid zinc plating |
| CA1128458A (en) * | 1977-06-06 | 1982-07-27 | Tokuyama Soda Kabushiki Kaisha | Electrolysis with cathode of iron or nickel with electroplate from s/n nickel bath |
| DE2921241A1 (en) * | 1979-04-19 | 1980-10-23 | Alusuisse | ACID TIN-II CONTAINING ELECTROLYT |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| US4614568A (en) * | 1983-06-14 | 1986-09-30 | Nihon Kogyo Kabushiki Kaisha | High-speed silver plating and baths therefor |
| GB8522046D0 (en) * | 1985-09-05 | 1985-10-09 | Interox Chemicals Ltd | Stabilisation |
| EP2128903B1 (en) * | 2008-05-30 | 2017-02-22 | ATOTECH Deutschland GmbH | Electroplating additive for the deposition of a metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)-group 13 (IIIA)-group 16 (VIA) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1071438B (en) * | 1959-12-17 | Deutsche Gold- und Silber-Scheideanstalt vormals Roessler, Frankfurt/M | Anode for electroplating baths and process for their manufacture | |
| US1003092A (en) * | 1907-04-11 | 1911-09-12 | Ontario Nickel Company Ltd | Method of electrolyzing nickel-sulfate solutions. |
| US1371414A (en) * | 1919-06-17 | 1921-03-15 | Thomas A Edison | Nickel-plating |
| US2248092A (en) * | 1934-10-26 | 1941-07-08 | Sherka Chemical Co Inc | Method for treating electroplating baths |
| US2449422A (en) * | 1944-04-15 | 1948-09-14 | Harshaw Chem Corp | Electrodeposition of nickel |
| BE517665A (en) * | 1949-11-23 | |||
| AT172066B (en) * | 1950-03-27 | 1952-08-11 | H C Dr Wilhelm Dipl Pfanhauser | Process for producing hard, shiny copper deposits by electrolytic deposition |
| NL110737C (en) * | 1953-09-19 | |||
| US2799634A (en) * | 1954-02-26 | 1957-07-16 | Westinghouse Electric Corp | Combined addition agents for acid copper plating |
| DE1037801B (en) | 1954-03-22 | 1958-08-28 | Dehydag Gmbh | Bath for the galvanic production of metal coatings |
| BE550706A (en) * | 1956-01-27 | |||
| US2879211A (en) * | 1956-11-16 | 1959-03-24 | Hanson Van Winkle Munning Co | Electroplating duplex nickel coatings |
| US2885399A (en) * | 1957-03-04 | 1959-05-05 | Univ Ohio State Res Found | Hydrazinium hexafluorophosphate salts |
| DE1152863B (en) * | 1957-03-16 | 1963-08-14 | Riedel & Co | Acid baths for the production of leveling copper coatings |
-
0
- BE BE621297D patent/BE621297A/xx unknown
- NL NL281922D patent/NL281922A/xx unknown
-
1961
- 1961-08-10 DE DED36777A patent/DE1224111B/en active Pending
-
1962
- 1962-03-24 CH CH355962A patent/CH429356A/en unknown
- 1962-07-12 GB GB26837/62A patent/GB941823A/en not_active Expired
- 1962-08-01 DE DE19621421977 patent/DE1421977B2/en active Pending
- 1962-08-03 US US214490A patent/US3257294A/en not_active Expired - Lifetime
-
1963
- 1963-07-29 US US298424A patent/US3245886A/en not_active Expired - Lifetime
- 1963-07-31 GB GB30313/63A patent/GB1055243A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1421977B2 (en) | 1970-02-19 |
| BE621297A (en) | |
| US3257294A (en) | 1966-06-21 |
| GB941823A (en) | 1963-11-13 |
| DE1224111B (en) | 1966-09-01 |
| CH429356A (en) | 1967-01-31 |
| US3245886A (en) | 1966-04-12 |
| DE1421977A1 (en) | 1968-11-07 |
| NL281922A (en) |
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