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FR2878081B1 - METHOD OF MAKING ANTENNAS INTEGRATED ON CHIP HAVING IMPROVED RADIATION EFFICIENCY - Google Patents

METHOD OF MAKING ANTENNAS INTEGRATED ON CHIP HAVING IMPROVED RADIATION EFFICIENCY

Info

Publication number
FR2878081B1
FR2878081B1 FR0452663A FR0452663A FR2878081B1 FR 2878081 B1 FR2878081 B1 FR 2878081B1 FR 0452663 A FR0452663 A FR 0452663A FR 0452663 A FR0452663 A FR 0452663A FR 2878081 B1 FR2878081 B1 FR 2878081B1
Authority
FR
France
Prior art keywords
layer
chip
radiation efficiency
improved radiation
antennas integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0452663A
Other languages
French (fr)
Other versions
FR2878081A1 (en
Inventor
Michel Pons
Frederic Lemaire
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orange SA
STMicroelectronics lnc USA
Original Assignee
France Telecom SA
STMicroelectronics lnc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by France Telecom SA, STMicroelectronics lnc USA filed Critical France Telecom SA
Priority to FR0452663A priority Critical patent/FR2878081B1/en
Priority to US11/281,744 priority patent/US8212725B2/en
Publication of FR2878081A1 publication Critical patent/FR2878081A1/en
Application granted granted Critical
Publication of FR2878081B1 publication Critical patent/FR2878081B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285—Planar dipole

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

The method involves providing a semiconductor substrate (100) covered with a semi-conductor layer (102). Insulating blocks (110) limiting circulation of carrier charges in the layer are formed in a zone of the layer. A set of layers (112) is formed above the layer (102) and a metallic layer (114) is formed on the set of layers (112). An antenna formed on the layer (114) by branches (140, 150) is situated opposite to the blocks. An independent claim is also included for a microelectronic device provided with an integrated antenna.
FR0452663A 2004-11-17 2004-11-17 METHOD OF MAKING ANTENNAS INTEGRATED ON CHIP HAVING IMPROVED RADIATION EFFICIENCY Expired - Fee Related FR2878081B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0452663A FR2878081B1 (en) 2004-11-17 2004-11-17 METHOD OF MAKING ANTENNAS INTEGRATED ON CHIP HAVING IMPROVED RADIATION EFFICIENCY
US11/281,744 US8212725B2 (en) 2004-11-17 2005-11-17 Method for production of chip-integrated antennae with an improved emission efficiency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0452663A FR2878081B1 (en) 2004-11-17 2004-11-17 METHOD OF MAKING ANTENNAS INTEGRATED ON CHIP HAVING IMPROVED RADIATION EFFICIENCY

Publications (2)

Publication Number Publication Date
FR2878081A1 FR2878081A1 (en) 2006-05-19
FR2878081B1 true FR2878081B1 (en) 2009-03-06

Family

ID=34952972

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0452663A Expired - Fee Related FR2878081B1 (en) 2004-11-17 2004-11-17 METHOD OF MAKING ANTENNAS INTEGRATED ON CHIP HAVING IMPROVED RADIATION EFFICIENCY

Country Status (2)

Country Link
US (1) US8212725B2 (en)
FR (1) FR2878081B1 (en)

Families Citing this family (11)

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US7183994B2 (en) * 2004-11-22 2007-02-27 Wj Communications, Inc. Compact antenna with directed radiation pattern
IL173941A0 (en) * 2006-02-26 2007-03-08 Haim Goldberger Monolithic modules for high frequecney applications
JP5040926B2 (en) * 2007-02-01 2012-10-03 富士通セミコンダクター株式会社 antenna
US8077095B2 (en) * 2007-03-29 2011-12-13 Intel Corporation Multi-band highly isolated planar antennas integrated with front-end modules for mobile applications
US8351982B2 (en) * 2007-05-23 2013-01-08 Broadcom Corporation Fully integrated RF transceiver integrated circuit
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7990237B2 (en) 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
US9899725B2 (en) 2009-12-18 2018-02-20 American University In Cairo Circuitry-isolated MEMS antennas: devices and enabling technology
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041839A (en) * 1981-03-11 1991-08-20 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Electromagnetic radiation sensors
JPH04145705A (en) * 1990-10-08 1992-05-19 Nec Corp Monolithic microwave millimeter wave antenna
US5621913A (en) * 1992-05-15 1997-04-15 Micron Technology, Inc. System with chip to chip communication
US5386215A (en) * 1992-11-20 1995-01-31 Massachusetts Institute Of Technology Highly efficient planar antenna on a periodic dielectric structure
US5432374A (en) * 1993-02-08 1995-07-11 Santa Barbara Research Center Integrated IR and mm-wave detector
DE9414895U1 (en) * 1994-09-13 1995-03-02 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., 80539 München Heterodyne detector for infrared light
US5665633A (en) * 1995-04-06 1997-09-09 Motorola, Inc. Process for forming a semiconductor device having field isolation
FR2810451A1 (en) * 2000-06-20 2001-12-21 Koninkl Philips Electronics Nv INTEGRATED CIRCUIT INCLUDING A HIGH QUALITY FACTOR INDUCTIVE ELEMENT AND HAVING HIGH COMPACITY
DE10041691A1 (en) * 2000-08-24 2002-03-14 Infineon Technologies Ag A semiconductor device
US6373121B1 (en) * 2001-03-23 2002-04-16 United Microelectronics Corp. Silicon chip built-in inductor structure
JP3792635B2 (en) * 2001-12-14 2006-07-05 富士通株式会社 Electronic equipment
WO2003105274A2 (en) * 2002-06-10 2003-12-18 University Of Florida High gain integrated antenna and devices therefrom
WO2004032343A2 (en) * 2002-10-02 2004-04-15 University Of Florida Single chip radio with integrated antenna
US7466998B2 (en) * 2003-04-30 2008-12-16 University Of Florida Research Foundation, Inc. Layout and architecture for reduced noise coupling between circuitry and on-chip antenna
US7750413B2 (en) * 2003-06-16 2010-07-06 Nec Corporation Semiconductor device and method for manufacturing same
US7122891B2 (en) * 2003-12-23 2006-10-17 Intel Corporation Ceramic embedded wireless antenna
FR2867899A1 (en) * 2004-03-16 2005-09-23 St Microelectronics Sa SEMICONDUCTOR DEVICE WITH ANTENNA AND COLLECTION SCREEN
SG119329A1 (en) * 2004-07-29 2006-02-28 Fujikura Ltd Semiconductor device and method for manufacturing the same
US7247922B2 (en) * 2004-09-24 2007-07-24 Taiwan Semiconductor Manufacturing Company, Ltd. Inductor energy loss reduction techniques
US7342299B2 (en) * 2005-09-21 2008-03-11 International Business Machines Corporation Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Also Published As

Publication number Publication date
US8212725B2 (en) 2012-07-03
US20060158378A1 (en) 2006-07-20
FR2878081A1 (en) 2006-05-19

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20130731