FR2795235B1 - METHOD FOR PRODUCING DEVICES COMPRISING A CHIP ASSOCIATED WITH A CIRCUIT ELEMENT AND DEVICES OBTAINED - Google Patents
METHOD FOR PRODUCING DEVICES COMPRISING A CHIP ASSOCIATED WITH A CIRCUIT ELEMENT AND DEVICES OBTAINEDInfo
- Publication number
- FR2795235B1 FR2795235B1 FR9907555A FR9907555A FR2795235B1 FR 2795235 B1 FR2795235 B1 FR 2795235B1 FR 9907555 A FR9907555 A FR 9907555A FR 9907555 A FR9907555 A FR 9907555A FR 2795235 B1 FR2795235 B1 FR 2795235B1
- Authority
- FR
- France
- Prior art keywords
- devices
- circuit element
- chip associated
- producing
- producing devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9907555A FR2795235B1 (en) | 1999-06-15 | 1999-06-15 | METHOD FOR PRODUCING DEVICES COMPRISING A CHIP ASSOCIATED WITH A CIRCUIT ELEMENT AND DEVICES OBTAINED |
AU52291/00A AU5229100A (en) | 1999-06-15 | 2000-05-30 | Method for making devices comprising a chip associated with a circuit element and resulting devices |
PCT/FR2000/001492 WO2000077852A1 (en) | 1999-06-15 | 2000-05-30 | Method for making devices comprising a chip associated with a circuit element and resulting devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9907555A FR2795235B1 (en) | 1999-06-15 | 1999-06-15 | METHOD FOR PRODUCING DEVICES COMPRISING A CHIP ASSOCIATED WITH A CIRCUIT ELEMENT AND DEVICES OBTAINED |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2795235A1 FR2795235A1 (en) | 2000-12-22 |
FR2795235B1 true FR2795235B1 (en) | 2002-08-02 |
Family
ID=9546808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9907555A Expired - Fee Related FR2795235B1 (en) | 1999-06-15 | 1999-06-15 | METHOD FOR PRODUCING DEVICES COMPRISING A CHIP ASSOCIATED WITH A CIRCUIT ELEMENT AND DEVICES OBTAINED |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU5229100A (en) |
FR (1) | FR2795235B1 (en) |
WO (1) | WO2000077852A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2820548A1 (en) * | 2001-02-02 | 2002-08-09 | Schlumberger Systems & Service | PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME |
FR2893734A1 (en) | 2005-11-21 | 2007-05-25 | St Microelectronics Sa | ELECTRON MICROMODULE AND METHOD FOR MANUFACTURING SUCH A MICROMODULE |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3917707A1 (en) * | 1989-05-31 | 1990-12-06 | Siemens Ag | ELECTRONIC MODULE AND METHOD FOR THE PRODUCTION THEREOF |
US5155068A (en) * | 1989-08-31 | 1992-10-13 | Sharp Kabushiki Kaisha | Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal |
FR2716281B1 (en) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Method of manufacturing a contactless card. |
US5898215A (en) * | 1996-12-16 | 1999-04-27 | Motorola, Inc. | Microelectronic assembly with connection to a buried electrical element, and method for forming same |
FR2761527B1 (en) * | 1997-03-25 | 1999-06-04 | Gemplus Card Int | METHOD OF MANUFACTURING CONTACTLESS CARD WITH ANTENNA CONNECTION BY WELDED WIRES |
-
1999
- 1999-06-15 FR FR9907555A patent/FR2795235B1/en not_active Expired - Fee Related
-
2000
- 2000-05-30 WO PCT/FR2000/001492 patent/WO2000077852A1/en active Application Filing
- 2000-05-30 AU AU52291/00A patent/AU5229100A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FR2795235A1 (en) | 2000-12-22 |
AU5229100A (en) | 2001-01-02 |
WO2000077852A1 (en) | 2000-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100226 |