FR2793331B1 - METHOD FOR MANUFACTURING A MICROCIRCUIT CARD - Google Patents
METHOD FOR MANUFACTURING A MICROCIRCUIT CARDInfo
- Publication number
- FR2793331B1 FR2793331B1 FR9905779A FR9905779A FR2793331B1 FR 2793331 B1 FR2793331 B1 FR 2793331B1 FR 9905779 A FR9905779 A FR 9905779A FR 9905779 A FR9905779 A FR 9905779A FR 2793331 B1 FR2793331 B1 FR 2793331B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- microcircuit card
- microcircuit
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H10W72/073—
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- H10W72/075—
-
- H10W72/50—
-
- H10W72/5522—
-
- H10W72/59—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/734—
-
- H10W90/754—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/964—Roughened surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9905779A FR2793331B1 (en) | 1999-05-06 | 1999-05-06 | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD |
| GBGB9914227.5A GB9914227D0 (en) | 1999-05-06 | 1999-06-18 | Joining method |
| EP00401127.6A EP1050844B1 (en) | 1999-05-06 | 2000-04-21 | Method of manufacturing a chip card |
| JP2000133153A JP4737479B2 (en) | 1999-05-06 | 2000-05-02 | Method for manufacturing card including microcircuit |
| US09/563,910 US6372541B1 (en) | 1999-05-06 | 2000-05-04 | Method of fabricating a microcircuit card |
| TW089108677A TW472212B (en) | 1999-05-06 | 2000-05-06 | Method of fabricating a microcircuit card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9905779A FR2793331B1 (en) | 1999-05-06 | 1999-05-06 | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2793331A1 FR2793331A1 (en) | 2000-11-10 |
| FR2793331B1 true FR2793331B1 (en) | 2001-08-10 |
Family
ID=9545293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9905779A Expired - Lifetime FR2793331B1 (en) | 1999-05-06 | 1999-05-06 | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6372541B1 (en) |
| EP (1) | EP1050844B1 (en) |
| JP (1) | JP4737479B2 (en) |
| FR (1) | FR2793331B1 (en) |
| TW (1) | TW472212B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2793330B1 (en) * | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | METHOD FOR MOUNTING A MICROCIRCUIT IN A CAVITY OF A SUPPORT CARD AND CARD THUS OBTAINED |
| FR2833801B1 (en) * | 2001-12-19 | 2005-07-01 | Oberthur Card Syst Sa | METHOD FOR PRODUCING A MICROCIRCUIT CARD |
| FR2872946B1 (en) * | 2004-07-08 | 2006-09-22 | Gemplus Sa | METHOD FOR MANUFACTURING A MINI UICC CHIP CARD HOLDER WITH UICC PLUG-IN ADAPTER AND A SUPPORT OBTAINED |
| FR2885718B1 (en) * | 2005-05-11 | 2007-09-21 | Gemplus Sa | ADHESIVE FORMAT ADAPTER FOR MEMORY DEVICE AND METHOD OF MANUFACTURE |
| JP5011766B2 (en) * | 2006-03-16 | 2012-08-29 | 大日本印刷株式会社 | IC module for IC card |
| FR2963137B1 (en) * | 2010-07-20 | 2016-02-19 | Oberthur Technologies | TRANSPONDER INSERT AND DEVICE COMPRISING SUCH AN INSERT |
| USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
| USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
| USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
| EP4105830A4 (en) | 2020-02-13 | 2023-07-19 | Asahi Kasei Kabushiki Kaisha | Transparent antenna and rf tag |
| JP2024051656A (en) * | 2022-09-30 | 2024-04-11 | ニデック株式会社 | Motor, blower device, and method of manufacturing the motor |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3723547C2 (en) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Carrier element for installation in ID cards |
| US5304513A (en) * | 1987-07-16 | 1994-04-19 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
| EP0472766A1 (en) * | 1990-08-30 | 1992-03-04 | Siemens Aktiengesellschaft | Process for encapsulating a contacted semiconductor chip |
| FR2670930A1 (en) * | 1990-12-21 | 1992-06-26 | Bull Cp8 | Process for embodying the electronic module of a portable object such as a microcircuit card, module and cards obtained by the implementation of the process |
| FR2677785A1 (en) * | 1991-06-17 | 1992-12-18 | Philips Composants | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD |
| JPH0613718A (en) * | 1992-06-29 | 1994-01-21 | Ibiden Co Ltd | Printed wiring board for ic card and manufacture thereof |
| JPH0685111A (en) * | 1992-09-07 | 1994-03-25 | Hitachi Ltd | Tape carrier type semiconductor device and assembling method thereof |
| JPH08279522A (en) * | 1995-04-04 | 1996-10-22 | Nitto Denko Corp | Semiconductor device and manufacturing method thereof |
| JPH10163381A (en) * | 1996-11-28 | 1998-06-19 | Fujitsu Ten Ltd | Sealing structure of semiconductor chip |
| JPH10240894A (en) * | 1997-02-27 | 1998-09-11 | Oji Paper Co Ltd | Magnetic recording card and method of manufacturing the same |
| KR100255108B1 (en) * | 1997-06-18 | 2000-05-01 | Samsung Electronics Co Ltd | Chip card |
-
1999
- 1999-05-06 FR FR9905779A patent/FR2793331B1/en not_active Expired - Lifetime
-
2000
- 2000-04-21 EP EP00401127.6A patent/EP1050844B1/en not_active Expired - Lifetime
- 2000-05-02 JP JP2000133153A patent/JP4737479B2/en not_active Expired - Lifetime
- 2000-05-04 US US09/563,910 patent/US6372541B1/en not_active Expired - Lifetime
- 2000-05-06 TW TW089108677A patent/TW472212B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| FR2793331A1 (en) | 2000-11-10 |
| TW472212B (en) | 2002-01-11 |
| EP1050844B1 (en) | 2013-07-10 |
| JP4737479B2 (en) | 2011-08-03 |
| JP2001005944A (en) | 2001-01-12 |
| EP1050844A1 (en) | 2000-11-08 |
| US6372541B1 (en) | 2002-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 18 |
|
| PLFP | Fee payment |
Year of fee payment: 19 |
|
| PLFP | Fee payment |
Year of fee payment: 20 |