GB2300068B - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number: GB2300068B
Authority: GB; United Kingdom
Prior art keywords: semiconductor device; semiconductor
Prior art date: 1992-07-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

GB9607233A

Other versions

GB2300068A (en

GB9607233D0 (en

Inventor

Akira Inoue

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Original Assignee

Mitsubishi Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-07-21

Filing date

1993-03-12

Publication date

1997-01-22

1992-07-21 Priority claimed from JP4217254A external-priority patent/JP2721093B2/en

1993-03-12 Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp

1996-06-12 Publication of GB9607233D0 publication Critical patent/GB9607233D0/en

1996-10-23 Publication of GB2300068A publication Critical patent/GB2300068A/en

1997-01-22 Application granted granted Critical

1997-01-22 Publication of GB2300068B publication Critical patent/GB2300068B/en

2013-03-12 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W44/20—
- H10W42/20—
- H10W44/501—
- H10W70/65—
- H10W70/688—
- H10W74/121—
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
- H10W74/00—
- H10W90/754—

GB9607233A 1992-07-21 1993-03-12 Semiconductor device Expired - Fee Related GB2300068B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP4217254A JP2721093B2 (en)	1992-07-21	1992-07-21	Semiconductor device
GB9305127A GB2269935B (en)	1992-07-21	1993-03-12	Semiconductor device

Publications (3)

Publication Number	Publication Date
GB9607233D0 GB9607233D0 (en)	1996-06-12
GB2300068A GB2300068A (en)	1996-10-23
GB2300068B true GB2300068B (en)	1997-01-22

Family

ID=26302575

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB9607233A Expired - Fee Related GB2300068B (en)	1992-07-21	1993-03-12	Semiconductor device

Country Status (1)

Country	Link
GB (1)	GB2300068B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR2780551B1 (en) *	1998-06-29	2001-09-07	Inside Technologies	INTEGRATED ELECTRONIC MICROMODULE AND METHOD FOR MANUFACTURING SUCH A MICROMODULE
JP2001308226A (en) *	2000-04-24	2001-11-02	Nec Corp	Semiconductor device

1993
- 1993-03-12 GB GB9607233A patent/GB2300068B/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
GB2300068A (en)	1996-10-23
GB9607233D0 (en)	1996-06-12

Similar Documents

Publication	Publication Date	Title
GB2269935B (en)	1997-01-22	Semiconductor device
EP0564204A3 (en)	1994-09-28	Semiconductor device
EP0594441A3 (en)	1994-06-08	Semiconductor device
KR970005695B1 (en)	1997-04-18	Semiconductor device
GB2261990B (en)	1995-10-11	Semiconductor device
GB2259187B (en)	1996-06-19	Semiconductor device
KR970001887B1 (en)	1997-02-18	Semiconductor device
TW371512U (en)	1999-10-01	Semiconductor device
KR960012648B1 (en)	1996-09-23	Resin-seal type semiconductor device
SG43018A1 (en)	1997-10-17	Semiconductor device
KR970006537B1 (en)	1997-04-29	Semiconductor device
GB2285175B (en)	1997-11-26	Semiconductor device
GB2267996B (en)	1996-04-17	Semiconductor device
GB2274203B (en)	1996-08-07	Semiconductor device
GB2266183B (en)	1994-12-07	Semiconductor device
GB9208324D0 (en)	1992-06-03	Semiconductor devices
SG49206A1 (en)	1998-05-18	Semiconductor device
TW476451U (en)	2002-02-11	Semiconductor device
EP0495114A4 (en)	1992-10-28	Semiconductor device
EP0454134A3 (en)	1993-05-19	Semiconductor device
KR970003890B1 (en)	1997-03-22	Semiconductor device
KR970006538B1 (en)	1997-04-29	Semiconductor device
GB2256313B (en)	1995-03-29	Semiconductor device
EP0534203A3 (en)	1993-08-25	Semiconductor device
KR950013786B1 (en)	1995-11-16	Semiconductor device

Legal Events

Date	Code	Title	Description
2000-11-01	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20000312