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FR2032259A1 - - Google Patents

Info

Publication number
FR2032259A1
FR2032259A1 FR6933103A FR6933103A FR2032259A1 FR 2032259 A1 FR2032259 A1 FR 2032259A1 FR 6933103 A FR6933103 A FR 6933103A FR 6933103 A FR6933103 A FR 6933103A FR 2032259 A1 FR2032259 A1 FR 2032259A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6933103A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2032259A1 publication Critical patent/FR2032259A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H10P95/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P95/00—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/12743—Next to refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component
FR6933103A 1968-09-30 1969-09-29 Withdrawn FR2032259A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1789062A DE1789062C3 (de) 1968-09-30 1968-09-30 Verfahren zum Herstellen von Metallkontaktschichten für Halbleiteranordnungen

Publications (1)

Publication Number Publication Date
FR2032259A1 true FR2032259A1 (fr) 1970-11-27

Family

ID=5706784

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6933103A Withdrawn FR2032259A1 (fr) 1968-09-30 1969-09-29

Country Status (9)

Country Link
US (1) US3650826A (fr)
JP (1) JPS4831506B1 (fr)
AT (1) AT303119B (fr)
CH (1) CH504101A (fr)
DE (1) DE1789062C3 (fr)
FR (1) FR2032259A1 (fr)
GB (1) GB1229381A (fr)
NL (1) NL6913039A (fr)
SE (1) SE340849B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384645A1 (fr) * 1989-02-24 1990-08-29 General Instrument Corporation Matériau de brasure pour la formation d'une liaison entre une plaquette semi-conductrice et un contact métallique

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872419A (en) * 1972-06-15 1975-03-18 Alexander J Groves Electrical elements operable as thermisters, varisters, smoke and moisture detectors, and methods for making the same
US3922385A (en) * 1973-07-02 1975-11-25 Gen Motors Corp Solderable multilayer contact for silicon semiconductor
US4293587A (en) * 1978-11-09 1981-10-06 Zilog, Inc. Low resistance backside preparation for semiconductor integrated circuit chips
WO1982002457A1 (fr) * 1980-12-30 1982-07-22 Finn John B Fixation d'un de de qualite et fiabilite ameliorees
SE8306663L (sv) * 1982-12-08 1984-06-09 Int Rectifier Corp Forfarande for framstellning av halvledaranordning
US4965173A (en) * 1982-12-08 1990-10-23 International Rectifier Corporation Metallizing process and structure for semiconductor devices
DE3426199C2 (de) * 1984-07-17 1994-02-03 Asea Brown Boveri Überbrückungselement
DE3426200C2 (de) * 1984-07-17 1994-02-10 Asea Brown Boveri Überbrückungselement
NL8600021A (nl) * 1986-01-08 1987-08-03 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij op een halfgeleiderlichaam een metallisatie met een dikke aansluitelektrode wordt aangebracht.
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL299522A (fr) * 1962-05-25 1900-01-01
GB1053069A (fr) * 1963-06-28
US3465209A (en) * 1966-07-07 1969-09-02 Rca Corp Semiconductor devices and methods of manufacture thereof
US3523223A (en) * 1967-11-01 1970-08-04 Texas Instruments Inc Metal-semiconductor diodes having high breakdown voltage and low leakage and method of manufacturing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384645A1 (fr) * 1989-02-24 1990-08-29 General Instrument Corporation Matériau de brasure pour la formation d'une liaison entre une plaquette semi-conductrice et un contact métallique

Also Published As

Publication number Publication date
JPS4831506B1 (fr) 1973-09-29
GB1229381A (fr) 1971-04-21
AT303119B (de) 1972-11-10
DE1789062A1 (de) 1972-01-05
DE1789062B2 (de) 1978-03-30
US3650826A (en) 1972-03-21
DE1789062C3 (de) 1978-11-30
CH504101A (de) 1971-02-28
NL6913039A (fr) 1970-04-01
SE340849B (fr) 1971-12-06

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Legal Events

Date Code Title Description
ST Notification of lapse