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FR1181721A - Improvements made to acid baths for the manufacture of copper coatings - Google Patents

Improvements made to acid baths for the manufacture of copper coatings

Info

Publication number
FR1181721A
FR1181721A FR1181721DA FR1181721A FR 1181721 A FR1181721 A FR 1181721A FR 1181721D A FR1181721D A FR 1181721DA FR 1181721 A FR1181721 A FR 1181721A
Authority
FR
France
Prior art keywords
manufacture
improvements made
acid baths
copper coatings
coatings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riedel and Co
Original Assignee
Riedel and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riedel and Co filed Critical Riedel and Co
Application granted granted Critical
Publication of FR1181721A publication Critical patent/FR1181721A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
FR1181721D 1957-03-16 1957-08-28 Improvements made to acid baths for the manufacture of copper coatings Expired FR1181721A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DER20796A DE1152863B (en) 1957-03-16 1957-03-16 Acid baths for the production of leveling copper coatings

Publications (1)

Publication Number Publication Date
FR1181721A true FR1181721A (en) 1959-06-18

Family

ID=7400753

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1181721D Expired FR1181721A (en) 1957-03-16 1957-08-28 Improvements made to acid baths for the manufacture of copper coatings

Country Status (4)

Country Link
US (1) US3101305A (en)
DE (1) DE1152863B (en)
FR (1) FR1181721A (en)
GB (1) GB873753A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1224111B (en) * 1961-08-10 1966-09-01 Dehydag Gmbh Acid galvanic copper and nickel baths and process for depositing the coatings

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1184172B (en) * 1961-08-31 1964-12-23 Dehydag Gmbh Process for the galvanic deposition of firmly adhering and high-gloss copper coatings
DE1180140B (en) * 1962-07-20 1964-10-22 Dehydag Gmbh Process for the separation of fine-grained deposits in the refining and reduction electrolysis of nickel, zinc, silver, tin, lead and especially copper
US3414493A (en) * 1965-10-19 1968-12-03 Lea Ronal Inc Electrodeposition of copper
DE1496982B1 (en) * 1966-08-02 1970-10-15 Riedel & Co Cyanidic bright copper bath
DE1496723B1 (en) * 1966-12-12 1971-11-25 Dayton Bright Copper Co ACID GALVANIC SHINY COPPER BATH
FR2085243A1 (en) * 1970-04-01 1971-12-24 Peugeot & Renault
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
DE102005011708B3 (en) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
US9243339B2 (en) * 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE888493C (en) * 1951-11-03 1953-09-03 Hydrierwerke A G Deutsche Process for the production of firmly adhering and shiny galvanic copper coatings
NL90899C (en) * 1953-04-28
DE924489C (en) * 1953-04-28 1955-03-03 Degussa Bath for the galvanic deposition of metals
DE1001078B (en) * 1953-08-13 1957-01-17 Dehydag Gmbh Galvanic baths for the production of metal coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1224111B (en) * 1961-08-10 1966-09-01 Dehydag Gmbh Acid galvanic copper and nickel baths and process for depositing the coatings

Also Published As

Publication number Publication date
DE1152863B (en) 1963-08-14
US3101305A (en) 1963-08-20
GB873753A (en) 1961-07-26

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