FI974488A7 - Semiconductor unit housing, semiconductor unit encapsulation method, and encapsulation for use in encapsulating a semiconductor unit - Google Patents

Semiconductor unit housing, semiconductor unit encapsulation method, and encapsulation for use in encapsulating a semiconductor unit Download PDF

Info

Publication number: FI974488A7
Authority: FI; Finland
Prior art keywords: semiconductor unit; encapsulation; encapsulating; housing; encapsulation method
Prior art date: 1995-06-12

Application number

FI974488A

Other languages

Finnish (fi)

Swedish (sv)

Other versions

FI974488A0 (en

Inventor

Kazunori Omoya

Takashi Oobayashi

Wataru Sakurai

Mitsuru Harada

Yoshihiro Bessho

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-06-12

Filing date

1997-12-11

Publication date

1998-02-09

1995-11-28 Priority claimed from JP07308798A external-priority patent/JP3093621B2/en

1996-01-29 Priority claimed from US08/593,675 external-priority patent/US5641996A/en

1997-12-11 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1997-12-11 Publication of FI974488A0 publication Critical patent/FI974488A0/en

1998-02-09 Publication of FI974488A7 publication Critical patent/FI974488A7/en

Classifications

- H10W74/012—
- H10W72/012—
- H10W72/20—
- H10W72/30—
- H10W74/15—
- H10W74/47—
- H10W72/01204—
- H10W72/01215—
- H10W72/01225—
- H10W72/072—
- H10W72/073—
- H10W72/07331—
- H10W72/222—
- H10W72/225—
- H10W72/252—
- H10W72/253—
- H10W72/354—
- H10W72/5522—
- H10W72/856—
- H10W90/724—
- H10W90/734—

FI974488A 1995-06-12 1997-12-11 Semiconductor unit housing, semiconductor unit encapsulation method, and encapsulation for use in encapsulating a semiconductor unit FI974488A7 (en)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP14437395		1995-06-12
JP07308798A JP3093621B2 (en)	1995-01-30	1995-11-28	Semiconductor device mounting method
US08/593,675 US5641996A (en)	1995-01-30	1996-01-29	Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
PCT/JP1996/001600 WO1996042106A1 (en)	1995-06-12	1996-06-12	Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Publications (2)

Publication Number	Publication Date
FI974488A0 FI974488A0 (en)	1997-12-11
FI974488A7 true FI974488A7 (en)	1998-02-09

Family

ID=27318812

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FI974488A FI974488A7 (en)	1995-06-12	1997-12-11	Semiconductor unit housing, semiconductor unit encapsulation method, and encapsulation for use in encapsulating a semiconductor unit

Country Status (9)

Country	Link
CN (1)	CN1101594C (en)
AU (1)	AU695142B2 (en)
CA (1)	CA2221286A1 (en)
FI (1)	FI974488A7 (en)
ID (2)	ID19377A (en)
IN (1)	IN192021B (en)
NO (1)	NO321429B1 (en)
SE (1)	SE522253C2 (en)
WO (1)	WO1996042106A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100467946B1 (en) *	1997-01-24	2005-01-24	로무 가부시키가이샤	Method for manufacturing a semiconductor chip
JPH10270496A (en)	1997-03-27	1998-10-09	Hitachi Ltd	Electronic device, information processing device, semiconductor device, and semiconductor chip mounting method
US6407461B1 (en)	1997-06-27	2002-06-18	International Business Machines Corporation	Injection molded integrated circuit chip assembly
EP0933809B1 (en) *	1998-02-02	2006-11-29	Shin-Etsu Chemical Co., Ltd.	Method for mounting flip-chip semiconductor devices
JP3692935B2 (en)	1998-07-01	2005-09-07	セイコーエプソン株式会社	Manufacturing method of semiconductor device
US7834464B2 (en) *	2007-10-09	2010-11-16	Infineon Technologies Ag	Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
WO2012157584A1 (en) *	2011-05-13	2012-11-22	富士電機株式会社	Semiconductor device and manufacturing method thereof
JP5658088B2 (en) *	2011-05-23	2015-01-21	パナソニックＩｐマネジメント株式会社	Semiconductor package component mounting structure and manufacturing method
US10894935B2 (en)	2015-12-04	2021-01-19	Samsung Electronics Co., Ltd.	Composition for removing silicone resins and method of thinning substrate by using the same
CN107034028B (en) *	2015-12-04	2021-05-25	三星电子株式会社	Composition for removing silicone resin, method for thinning a substrate using the same, and manufacturing a semiconductor package, and system using the same
US10157887B2 (en) *	2017-03-09	2018-12-18	Advanced Semiconductor Engineering, Inc.	Semiconductor device package and method of manufacturing the same
US10297564B2 (en) *	2017-10-05	2019-05-21	Infineon Technologies Ag	Semiconductor die attach system and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63268724A (en) *	1987-04-24	1988-11-07	Matsushita Electric Works Ltd	Liquid epoxy resin composition
JP2515344B2 (en) *	1987-07-24	1996-07-10	松下電工株式会社	One-part liquid epoxy resin composition for sealing
JPH04130633A (en) *	1990-09-20	1992-05-01	Matsushita Electron Corp	Semiconductor device and manufacture thereof and capillary used therefor
US5194930A (en) *	1991-09-16	1993-03-16	International Business Machines	Dielectric composition and solder interconnection structure for its use
JP2826049B2 (en) *	1992-11-18	1998-11-18	松下電子工業株式会社	Semiconductor device and manufacturing method thereof
US5436503A (en) *	1992-11-18	1995-07-25	Matsushita Electronics Corporation	Semiconductor device and method of manufacturing the same
JPH06279654A (en) *	1993-02-26	1994-10-04	Matsushita Electric Works Ltd	Liquid epoxy resin composition
JPH06313027A (en) *	1993-05-06	1994-11-08	Matsushita Electric Works Ltd	Epoxy resin molding material for sealing

1996
- 1996-06-11 ID IDP980877A patent/ID19377A/en unknown
- 1996-06-11 ID IDP980876A patent/ID19376A/en unknown
- 1996-06-12 WO PCT/JP1996/001600 patent/WO1996042106A1/en not_active Ceased
- 1996-06-12 CN CN96194158A patent/CN1101594C/en not_active Expired - Fee Related
- 1996-06-12 CA CA002221286A patent/CA2221286A1/en not_active Abandoned
- 1996-06-12 AU AU60154/96A patent/AU695142B2/en not_active Ceased
- 1996-11-06 IN IN1083CA1996 patent/IN192021B/en unknown
1997
- 1997-12-10 SE SE9704602A patent/SE522253C2/en not_active IP Right Cessation
- 1997-12-11 NO NO19975833A patent/NO321429B1/en not_active IP Right Cessation
- 1997-12-11 FI FI974488A patent/FI974488A7/en not_active Application Discontinuation

Also Published As

Publication number	Publication date
SE522253C2 (en)	2004-01-27
NO975833L (en)	1998-02-03
WO1996042106A1 (en)	1996-12-27
CN1185231A (en)	1998-06-17
ID19377A (en)	1998-07-09
AU695142B2 (en)	1998-08-06
IN192021B (en)	2004-02-07
NO321429B1 (en)	2006-05-08
FI974488A0 (en)	1997-12-11
CA2221286A1 (en)	1996-12-27
ID19376A (en)	1998-07-09
SE9704602D0 (en)	1997-12-10
AU6015496A (en)	1997-01-09
SE9704602L (en)	1998-02-05
NO975833D0 (en)	1997-12-11
CN1101594C (en)	2003-02-12

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Legal Events

Date	Code	Title	Description
2008-08-15	FD	Application lapsed