NO975833D0 - Semiconductor Package, Semiconductor Packaging Procedure and Enclosure for Semiconductor Package Use - Google Patents

Semiconductor Package, Semiconductor Packaging Procedure and Enclosure for Semiconductor Package Use

Info

Publication number: NO975833D0
Authority: NO; Norway
Prior art keywords: semiconductor package; semiconductor; enclosure; packaging procedure; package
Prior art date: 1995-06-12

Application number

NO975833A

Other languages

Norwegian (no)

Other versions

NO975833L (en

NO321429B1 (en

Inventor

Kazunori Omoya

Takashi Oobayashi

Wataru Sakurai

Mitsuru Harada

Yoshihiro Bessho

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-06-12

Filing date

1997-12-11

Publication date

1997-12-11

1995-11-28 Priority claimed from JP07308798A external-priority patent/JP3093621B2/en

1996-01-29 Priority claimed from US08/593,675 external-priority patent/US5641996A/en

1997-12-11 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1997-12-11 Publication of NO975833D0 publication Critical patent/NO975833D0/en

1998-02-03 Publication of NO975833L publication Critical patent/NO975833L/en

2006-05-08 Publication of NO321429B1 publication Critical patent/NO321429B1/en

Classifications

- H10W74/012—
- H10W72/012—
- H10W72/20—
- H10W72/30—
- H10W74/15—
- H10W74/47—
- H10W72/01204—
- H10W72/01215—
- H10W72/01225—
- H10W72/072—
- H10W72/073—
- H10W72/07331—
- H10W72/222—
- H10W72/225—
- H10W72/252—
- H10W72/253—
- H10W72/354—
- H10W72/5522—
- H10W72/856—
- H10W90/724—
- H10W90/734—

NO19975833A 1995-06-12 1997-12-11 Semiconductor Unit Pack, Semiconductor Unit Packing Procedure, and Enclosure for Semiconductor Unit Packing Use NO321429B1 (en)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP14437395		1995-06-12
JP07308798A JP3093621B2 (en)	1995-01-30	1995-11-28	Semiconductor device mounting method
US08/593,675 US5641996A (en)	1995-01-30	1996-01-29	Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
PCT/JP1996/001600 WO1996042106A1 (en)	1995-06-12	1996-06-12	Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Publications (3)

Publication Number	Publication Date
NO975833D0 true NO975833D0 (en)	1997-12-11
NO975833L NO975833L (en)	1998-02-03
NO321429B1 NO321429B1 (en)	2006-05-08

Family

ID=27318812

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO19975833A NO321429B1 (en)	1995-06-12	1997-12-11	Semiconductor Unit Pack, Semiconductor Unit Packing Procedure, and Enclosure for Semiconductor Unit Packing Use

Country Status (9)

Country	Link
CN (1)	CN1101594C (en)
AU (1)	AU695142B2 (en)
CA (1)	CA2221286A1 (en)
FI (1)	FI974488A7 (en)
ID (2)	ID19376A (en)
IN (1)	IN192021B (en)
NO (1)	NO321429B1 (en)
SE (1)	SE522253C2 (en)
WO (1)	WO1996042106A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0890989A4 (en) *	1997-01-24	2006-11-02	Rohm Co Ltd	SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE DEVICE
JPH10270496A (en)	1997-03-27	1998-10-09	Hitachi Ltd	Electronic device, information processing device, semiconductor device, and semiconductor chip mounting method
US6407461B1 (en) *	1997-06-27	2002-06-18	International Business Machines Corporation	Injection molded integrated circuit chip assembly
DE69934153T2 (en) *	1998-02-02	2007-09-20	Shin-Etsu Chemical Co., Ltd.	Method for mounting flip-chip semiconductor devices
SG102032A1 (en)	1998-07-01	2004-02-27	Seiko Epson Corp	Semiconductor device and method of its manufacture
US7834464B2 (en) *	2007-10-09	2010-11-16	Infineon Technologies Ag	Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
US8957508B2 (en) *	2011-05-13	2015-02-17	Fuji Electric Co., Ltd.	Semiconductor device and method of manufacturing the same
JP5658088B2 (en) *	2011-05-23	2015-01-21	パナソニックＩｐマネジメント株式会社	Semiconductor package component mounting structure and manufacturing method
CN107034028B (en) *	2015-12-04	2021-05-25	三星电子株式会社	Composition for removing silicone resin, method for thinning a substrate using the same, and manufacturing a semiconductor package, and system using the same
US10894935B2 (en)	2015-12-04	2021-01-19	Samsung Electronics Co., Ltd.	Composition for removing silicone resins and method of thinning substrate by using the same
US10157887B2 (en)	2017-03-09	2018-12-18	Advanced Semiconductor Engineering, Inc.	Semiconductor device package and method of manufacturing the same
US10297564B2 (en) *	2017-10-05	2019-05-21	Infineon Technologies Ag	Semiconductor die attach system and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63268724A (en) *	1987-04-24	1988-11-07	Matsushita Electric Works Ltd	Liquid epoxy resin composition
JP2515344B2 (en) *	1987-07-24	1996-07-10	松下電工株式会社	One-part liquid epoxy resin composition for sealing
JPH04130633A (en) *	1990-09-20	1992-05-01	Matsushita Electron Corp	Semiconductor device and manufacture thereof and capillary used therefor
US5194930A (en) *	1991-09-16	1993-03-16	International Business Machines	Dielectric composition and solder interconnection structure for its use
US5436503A (en) *	1992-11-18	1995-07-25	Matsushita Electronics Corporation	Semiconductor device and method of manufacturing the same
JP2826049B2 (en) *	1992-11-18	1998-11-18	松下電子工業株式会社	Semiconductor device and manufacturing method thereof
JPH06279654A (en) *	1993-02-26	1994-10-04	Matsushita Electric Works Ltd	Liquid epoxy resin composition
JPH06313027A (en) *	1993-05-06	1994-11-08	Matsushita Electric Works Ltd	Epoxy resin molding material for sealing

1996
- 1996-06-11 ID IDP980876A patent/ID19376A/en unknown
- 1996-06-11 ID IDP980877A patent/ID19377A/en unknown
- 1996-06-12 CA CA002221286A patent/CA2221286A1/en not_active Abandoned
- 1996-06-12 CN CN96194158A patent/CN1101594C/en not_active Expired - Fee Related
- 1996-06-12 WO PCT/JP1996/001600 patent/WO1996042106A1/en not_active Ceased
- 1996-06-12 AU AU60154/96A patent/AU695142B2/en not_active Ceased
- 1996-11-06 IN IN1083CA1996 patent/IN192021B/en unknown
1997
- 1997-12-10 SE SE9704602A patent/SE522253C2/en not_active IP Right Cessation
- 1997-12-11 FI FI974488A patent/FI974488A7/en not_active Application Discontinuation
- 1997-12-11 NO NO19975833A patent/NO321429B1/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
SE9704602L (en)	1998-02-05
AU6015496A (en)	1997-01-09
NO975833L (en)	1998-02-03
CA2221286A1 (en)	1996-12-27
SE522253C2 (en)	2004-01-27
CN1185231A (en)	1998-06-17
AU695142B2 (en)	1998-08-06
CN1101594C (en)	2003-02-12
IN192021B (en)	2004-02-07
FI974488A7 (en)	1998-02-09
SE9704602D0 (en)	1997-12-10
WO1996042106A1 (en)	1996-12-27
ID19376A (en)	1998-07-09
FI974488A0 (en)	1997-12-11
ID19377A (en)	1998-07-09
NO321429B1 (en)	2006-05-08

Publication	Publication Date	Title
DK0910114T3 (en)	2003-05-05	Wafer Shipping and Packaging
DE69518935D1 (en)	2000-11-02	Semiconductor package
BR9600856A (en)	1997-12-30	Packaging and package method
NO975833D0 (en)	1997-12-11	Semiconductor Package, Semiconductor Packaging Procedure and Enclosure for Semiconductor Package Use
KR950025918U (en)	1995-09-18	Semiconductor product packaging device
KR960025455U (en)	1996-07-22	Semiconductor package
KR960038755U (en)	1996-12-18	Semiconductor package
KR970046772U (en)	1997-07-31	Semiconductor package
KR970046932U (en)	1997-07-31	Semiconductor Package
KR970047009U (en)	1997-07-31	Slim Semiconductor Package
KR960012677U (en)	1996-04-17	Semiconductor package
KR960006383U (en)	1996-02-17	Semiconductor package
KR970046934U (en)	1997-07-31	Semiconductor Package
KR970025862U (en)	1997-06-20	Semiconductor package
KR970046955U (en)	1997-07-31	Semiconductor package
KR970025860U (en)	1997-06-20	Semiconductor package
KR970025866U (en)	1997-06-20	Semiconductor package
KR970019768U (en)	1997-05-26	Semiconductor package
KR970046916U (en)	1997-07-31	Semiconductor package
KR970003287U (en)	1997-01-24	Semiconductor package
KR970046913U (en)	1997-07-31	Semiconductor package
KR960038754U (en)	1996-12-18	Semiconductor package
KR970046905U (en)	1997-07-31	Semiconductor package
KR960035636U (en)	1996-11-21	Semiconductor package
KR960032765U (en)	1996-10-24	Semiconductor package

Legal Events

Date	Code	Title	Description
2013-02-04	MM1K	Lapsed by not paying the annual fees