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FI20085443L - Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi - Google Patents

Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi Download PDF

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Publication number
FI20085443L
FI20085443L FI20085443A FI20085443A FI20085443L FI 20085443 L FI20085443 L FI 20085443L FI 20085443 A FI20085443 A FI 20085443A FI 20085443 A FI20085443 A FI 20085443A FI 20085443 L FI20085443 L FI 20085443L
Authority
FI
Finland
Prior art keywords
circuit module
manufacturing
module
circuit
Prior art date
Application number
FI20085443A
Other languages
English (en)
Swedish (sv)
Other versions
FI20085443A0 (fi
FI123205B (fi
Inventor
Petteri Palm
Risto Tuominen
Antti Iihola
Original Assignee
Imbera Electronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39523098&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI20085443(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Imbera Electronics Oy filed Critical Imbera Electronics Oy
Priority to FI20085443A priority Critical patent/FI123205B/fi
Publication of FI20085443A0 publication Critical patent/FI20085443A0/fi
Priority to JP2011508961A priority patent/JP2011523773A/ja
Priority to CN2009801172483A priority patent/CN102027585B/zh
Priority to KR1020107025126A priority patent/KR20110011614A/ko
Priority to US12/990,785 priority patent/US8699233B2/en
Priority to PCT/FI2009/050383 priority patent/WO2009138560A1/en
Priority to GB1021002A priority patent/GB2472953A/en
Publication of FI20085443L publication Critical patent/FI20085443L/fi
Publication of FI123205B publication Critical patent/FI123205B/fi
Application granted granted Critical
Priority to US14/231,758 priority patent/US9107324B2/en
Priority to US14/821,818 priority patent/US9324647B2/en
Priority to US15/084,530 priority patent/US9883587B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10W70/09—
    • H10W70/093—
    • H10W70/60—
    • H10W70/611—
    • H10W70/614—
    • H10W70/635—
    • H10W70/65—
    • H10W70/66—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H10P72/743—
    • H10W70/095—
    • H10W70/682—
    • H10W70/685—
    • H10W72/073—
    • H10W72/241—
    • H10W72/252—
    • H10W72/29—
    • H10W72/9413—
    • H10W90/00—
    • H10W90/10—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Geometry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FI20085443A 2008-05-12 2008-05-12 Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi FI123205B (fi)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FI20085443A FI123205B (fi) 2008-05-12 2008-05-12 Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi
GB1021002A GB2472953A (en) 2008-05-12 2009-05-11 Circuit module and method of manufacturing the same
JP2011508961A JP2011523773A (ja) 2008-05-12 2009-05-11 回路モジュールおよびその製造方法
CN2009801172483A CN102027585B (zh) 2008-05-12 2009-05-11 电路模块及其制造方法
KR1020107025126A KR20110011614A (ko) 2008-05-12 2009-05-11 회로모듈 및 제조방법
US12/990,785 US8699233B2 (en) 2008-05-12 2009-05-11 Circuit module and method of manufacturing the same
PCT/FI2009/050383 WO2009138560A1 (en) 2008-05-12 2009-05-11 Circuit module and method of manufacturing the same
US14/231,758 US9107324B2 (en) 2008-05-12 2014-04-01 Circuit module and method of manufacturing the same
US14/821,818 US9324647B2 (en) 2008-05-12 2015-08-10 Circuit module and method of manufacturing the same
US15/084,530 US9883587B2 (en) 2008-05-12 2016-03-30 Circuit module and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20085443A FI123205B (fi) 2008-05-12 2008-05-12 Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi
FI20085443 2008-05-12

Publications (3)

Publication Number Publication Date
FI20085443A0 FI20085443A0 (fi) 2008-05-12
FI20085443L true FI20085443L (fi) 2009-11-13
FI123205B FI123205B (fi) 2012-12-31

Family

ID=39523098

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20085443A FI123205B (fi) 2008-05-12 2008-05-12 Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi

Country Status (7)

Country Link
US (4) US8699233B2 (fi)
JP (1) JP2011523773A (fi)
KR (1) KR20110011614A (fi)
CN (1) CN102027585B (fi)
FI (1) FI123205B (fi)
GB (1) GB2472953A (fi)
WO (1) WO2009138560A1 (fi)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI123205B (fi) 2008-05-12 2012-12-31 Imbera Electronics Oy Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi
FI122217B (fi) * 2008-07-22 2011-10-14 Imbera Electronics Oy Monisirupaketti ja valmistusmenetelmä
JP2012124397A (ja) * 2010-12-10 2012-06-28 Cmk Corp 部品内蔵型多層プリント配線板
US8923008B2 (en) * 2011-03-08 2014-12-30 Ibiden Co., Ltd. Circuit board and method for manufacturing circuit board
DE102011107958B4 (de) * 2011-07-20 2020-09-24 Wilo Se Überschlagsschutz für eine Anordnung eines Halbleiterbauelements auf einem Substrat
WO2013065099A1 (ja) * 2011-10-31 2013-05-10 株式会社メイコー 部品内蔵基板の製造方法及びこの方法を用いて製造した部品内蔵基板
KR20140089386A (ko) * 2011-11-08 2014-07-14 메이코 일렉트로닉스 컴파니 리미티드 부품내장기판의 제조방법 및 이 방법을 이용하여 제조한 부품내장기판
US9355990B2 (en) * 2012-09-11 2016-05-31 Meiko Electronics Co., Ltd. Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method
WO2014042620A1 (en) * 2012-09-12 2014-03-20 Hewlett-Packard Development Company, L.P. Latch for a computer case
JP5624699B1 (ja) 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
JP5624698B1 (ja) * 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
WO2014097642A1 (ja) 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
CN104584207A (zh) 2012-12-21 2015-04-29 松下知识产权经营株式会社 电子部件封装以及其制造方法
CN104603932A (zh) 2012-12-21 2015-05-06 松下知识产权经营株式会社 电子部件封装件及其制造方法
WO2014118916A1 (ja) * 2013-01-30 2014-08-07 株式会社メイコー 部品内蔵基板の製造方法
CN106104801A (zh) * 2014-03-13 2016-11-09 飞利浦照明控股有限公司 照明装置及制造照明装置的方法
GB2524791B (en) * 2014-04-02 2018-10-03 At & S Austria Tech & Systemtechnik Ag Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate
KR101640751B1 (ko) 2014-09-05 2016-07-20 대덕전자 주식회사 인쇄회로기판 및 제조방법
JP6862087B2 (ja) 2015-12-11 2021-04-21 株式会社アムコー・テクノロジー・ジャパン 配線基板、配線基板を有する半導体パッケージ、およびその製造方法
CN109425814B (zh) * 2017-09-01 2021-09-10 中华精测科技股份有限公司 探针组件及其探针结构
US10181449B1 (en) * 2017-09-28 2019-01-15 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure
US11150701B1 (en) 2021-04-05 2021-10-19 Ibenzer Inc. Case for a computing device
JP2025068660A (ja) 2023-10-17 2025-04-30 三星電子株式会社 電子部品内蔵モジュールおよび電子部品内蔵モジュールの製造方法

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FI122128B (fi) * 2005-06-16 2011-08-31 Imbera Electronics Oy Menetelmä piirilevyrakenteen valmistamiseksi
FI123205B (fi) 2008-05-12 2012-12-31 Imbera Electronics Oy Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi

Also Published As

Publication number Publication date
GB2472953A (en) 2011-02-23
US20160212855A1 (en) 2016-07-21
CN102027585A (zh) 2011-04-20
FI20085443A0 (fi) 2008-05-12
US20110061909A1 (en) 2011-03-17
JP2011523773A (ja) 2011-08-18
US9324647B2 (en) 2016-04-26
US9883587B2 (en) 2018-01-30
CN102027585B (zh) 2013-07-10
WO2009138560A1 (en) 2009-11-19
US20140210090A1 (en) 2014-07-31
FI123205B (fi) 2012-12-31
US8699233B2 (en) 2014-04-15
US20150348878A1 (en) 2015-12-03
GB201021002D0 (en) 2011-01-26
US9107324B2 (en) 2015-08-11
KR20110011614A (ko) 2011-02-08

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