FI20040629A0 - Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi - Google Patents
Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturiInfo
- Publication number
- FI20040629A0 FI20040629A0 FI20040629A FI20040629A FI20040629A0 FI 20040629 A0 FI20040629 A0 FI 20040629A0 FI 20040629 A FI20040629 A FI 20040629A FI 20040629 A FI20040629 A FI 20040629A FI 20040629 A0 FI20040629 A0 FI 20040629A0
- Authority
- FI
- Finland
- Prior art keywords
- pressure sensor
- capacitive pressure
- producing
- capacitive
- producing capacitive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20040629A FI115487B (fi) | 2004-05-03 | 2004-05-03 | Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi |
| US11/114,215 US7252007B2 (en) | 2004-05-03 | 2005-04-26 | Method for the manufacturing of a capacitive pressure sensor, and a capacitive pressure sensor |
| EP05103506.1A EP1593949B1 (en) | 2004-05-03 | 2005-04-28 | Method of manufacturing a capacitive pressure sensor and a capacitive pressure sensor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20040629A FI115487B (fi) | 2004-05-03 | 2004-05-03 | Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi |
| FI20040629 | 2004-05-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FI20040629A0 true FI20040629A0 (fi) | 2004-05-03 |
| FI115487B FI115487B (fi) | 2005-05-13 |
Family
ID=32338350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20040629A FI115487B (fi) | 2004-05-03 | 2004-05-03 | Menetelmä kapasitiivisen paineanturin valmistamiseksi ja kapasitiivinen paineanturi |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7252007B2 (fi) |
| EP (1) | EP1593949B1 (fi) |
| FI (1) | FI115487B (fi) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080124528A1 (en) * | 2006-11-29 | 2008-05-29 | Motorola, Inc. | Printed electronic device and methods of determining the electrical value thereof |
| US8297125B2 (en) * | 2008-05-23 | 2012-10-30 | Honeywell International Inc. | Media isolated differential pressure sensor with cap |
| US8230745B2 (en) * | 2008-11-19 | 2012-07-31 | Honeywell International Inc. | Wet/wet differential pressure sensor based on microelectronic packaging process |
| RU2465681C2 (ru) * | 2009-02-19 | 2012-10-27 | Государственное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) | Способ изготовления чувствительного элемента датчика давления жидких и газообразных сред |
| US8322225B2 (en) * | 2009-07-10 | 2012-12-04 | Honeywell International Inc. | Sensor package assembly having an unconstrained sense die |
| US8230743B2 (en) | 2010-08-23 | 2012-07-31 | Honeywell International Inc. | Pressure sensor |
| US8754504B2 (en) * | 2012-05-23 | 2014-06-17 | United Microelectronics Corporation | Thinned wafer and fabricating method thereof |
| US20200355857A1 (en) * | 2017-08-30 | 2020-11-12 | Ecole Polytechnique Federale De Lausanne | Single crystalline diamond defractive optical elements and method of fabricating the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE272737C (fi) | ||||
| US3986200A (en) * | 1974-01-02 | 1976-10-12 | Signetics Corporation | Semiconductor structure and method |
| JPS5524423A (en) * | 1978-08-10 | 1980-02-21 | Nissan Motor Co Ltd | Semiconductor pressure sensor |
| JPS60138977A (ja) | 1983-12-27 | 1985-07-23 | Fuji Electric Co Ltd | 半導体形静電容量式圧力センサ |
| JPH07101743B2 (ja) | 1988-04-05 | 1995-11-01 | 横河電機株式会社 | 半導体圧力センサの製造方法 |
| JPH01261872A (ja) | 1988-04-12 | 1989-10-18 | Yokogawa Electric Corp | 半導体圧力センサの製造方法 |
| JPH06232423A (ja) * | 1993-02-04 | 1994-08-19 | Mitsubishi Electric Corp | 半導体圧力センサ |
| JPH11135806A (ja) | 1997-10-28 | 1999-05-21 | Denso Corp | 半導体圧力センサおよびその製造方法 |
| US6156585A (en) * | 1998-02-02 | 2000-12-05 | Motorola, Inc. | Semiconductor component and method of manufacture |
| US6089099A (en) * | 1998-09-08 | 2000-07-18 | Smi Corporation | Method for forming a bonded silicon-glass pressure sensor with strengthened corners |
| EP1223420A3 (en) * | 2001-01-16 | 2003-07-09 | Fujikura Ltd. | Pressure sensor and manufacturing method thereof |
| DE102004018408A1 (de) * | 2004-04-16 | 2005-11-03 | Robert Bosch Gmbh | Kapazitiver Drucksensor und Verfahren zur Herstellung |
-
2004
- 2004-05-03 FI FI20040629A patent/FI115487B/fi not_active IP Right Cessation
-
2005
- 2005-04-26 US US11/114,215 patent/US7252007B2/en not_active Expired - Lifetime
- 2005-04-28 EP EP05103506.1A patent/EP1593949B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| FI115487B (fi) | 2005-05-13 |
| EP1593949A1 (en) | 2005-11-09 |
| EP1593949B1 (en) | 2015-01-21 |
| US7252007B2 (en) | 2007-08-07 |
| US20050248905A1 (en) | 2005-11-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Patent granted |
Ref document number: 115487 Country of ref document: FI |
|
| PC | Transfer of assignment of patent |
Owner name: MURATA ELECTRONICS OY |
|
| MM | Patent lapsed |