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ES8402370A1 - Metodo y sus correspondiente aparato para el electrochapado de piezas. - Google Patents

Metodo y sus correspondiente aparato para el electrochapado de piezas.

Info

Publication number
ES8402370A1
ES8402370A1 ES516287A ES516287A ES8402370A1 ES 8402370 A1 ES8402370 A1 ES 8402370A1 ES 516287 A ES516287 A ES 516287A ES 516287 A ES516287 A ES 516287A ES 8402370 A1 ES8402370 A1 ES 8402370A1
Authority
ES
Spain
Prior art keywords
bath
electrolyte
workpieces
contact wheels
delivered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES516287A
Other languages
English (en)
Other versions
ES516287A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chemcut Corp
Original Assignee
Chemcut Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chemcut Corp filed Critical Chemcut Corp
Publication of ES8402370A1 publication Critical patent/ES8402370A1/es
Publication of ES516287A0 publication Critical patent/ES516287A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

METODO Y SU CORRESPONDIENTE APARATO PARA EL ELECTROCHAPADO DE PIEZAS, ESPECIALMENTE PIEZAS PLANAS. CONSISTE EN SUMINISTRAR PIEZAS, A TRAVES DE UN BAÑO ELECTROLITO (26), MEDIANTE UN ACOPLAMIENTO CON RUEDAS DE CONTACTO ACCIONADAS POR MOTOR QUE SIRVEN TAMBIEN COMO ELECTRODOS, MIENTRAS LAS PIEZAS TRABAJAN MANTIENEN UNA CONEXION ELECTRICA CONTINUA CON LAS RUEDAS DE TRABAJO. EXISTEN UNAS BARRERAS (48, 50) Y UNOS FROTADORES PARA IMPEDIR QUE EL ELECTROLITO Y SU TURBULENCIA, PENETRE EN LA ZONA DE BAÑO.
ES516287A 1981-10-07 1982-10-06 Metodo y sus correspondiente aparato para el electrochapado de piezas. Granted ES516287A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/309,180 US4385967A (en) 1981-10-07 1981-10-07 Electroplating apparatus and method

Publications (2)

Publication Number Publication Date
ES8402370A1 true ES8402370A1 (es) 1984-01-16
ES516287A0 ES516287A0 (es) 1984-01-16

Family

ID=23197043

Family Applications (1)

Application Number Title Priority Date Filing Date
ES516287A Granted ES516287A0 (es) 1981-10-07 1982-10-06 Metodo y sus correspondiente aparato para el electrochapado de piezas.

Country Status (13)

Country Link
US (1) US4385967A (es)
JP (1) JPS58136797A (es)
AT (1) AT378009B (es)
CA (1) CA1190888A (es)
CH (1) CH652758A5 (es)
DE (1) DE3236545C2 (es)
ES (1) ES516287A0 (es)
FR (1) FR2514037B1 (es)
GB (1) GB2107357B (es)
IE (1) IE54263B1 (es)
IT (1) IT1196672B (es)
NL (1) NL8203845A (es)
SE (1) SE8205713L (es)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459183A (en) * 1981-10-07 1984-07-10 Chemcut Corporation Electroplating apparatus and method
GB2129444B (en) * 1982-11-01 1986-08-28 Omi Int Corp Anode structure for a plating cell
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles
US4696729A (en) * 1986-02-28 1987-09-29 International Business Machines Electroplating cell
DE3624481A1 (de) * 1986-07-19 1988-01-28 Schering Ag Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
JPH07116636B2 (ja) * 1986-09-26 1995-12-13 川崎製鉄株式会社 ラジアル型めつきセル
DE3638630A1 (de) * 1986-11-11 1988-05-26 Schering Ag Verfahren zur entfernung von harzverschmutzungen in bohrloechern von leiterplatten
DE3864526D1 (de) * 1987-01-26 1991-10-10 Siemens Ag Galvanisierungseinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.
ES2039486T5 (es) * 1988-02-25 2003-07-01 Schmid Gmbh & Co Geb Dispositivo para el tratamiento de placas de circuito impreso electrico.
ATE89616T1 (de) * 1988-09-01 1993-06-15 Siemens Nixdorf Inf Syst Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.
DE58904413D1 (de) * 1988-09-01 1993-06-24 Siemens Nixdorf Inf Syst Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.
ATE89615T1 (de) * 1988-09-01 1993-06-15 Siemens Nixdorf Inf Syst Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus
US4859298A (en) * 1988-12-07 1989-08-22 Chemcut Corporation Process and apparatus for electrolytically removing protective layers from sheet metal substrate
US4999079A (en) * 1989-06-02 1991-03-12 Chemcut Corporation Process and apparatus for treating articles and preventing their wrap around a roller
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
DE4123985C2 (de) * 1991-07-19 1994-01-27 Hoellmueller Maschbau H Vorrichtung zur elektrolytischen Behandlung von Leiterplatten, insbesondere zur elektrolytischen Beschichtung mit Kupfer
US5211826A (en) * 1991-09-26 1993-05-18 Siemens Aktiengesellschaft Electroplating means for perforated printed circuit boards to be treated in a horizontal pass
DE4212567A1 (de) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten
DE4225961C5 (de) * 1992-08-06 2011-01-27 Atotech Deutschland Gmbh Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände
DE4229403C2 (de) * 1992-09-03 1995-04-13 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien
DE4301742C2 (de) * 1993-01-23 1999-07-08 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren plattenförmiger Gegenstände, insbesondere von elektronischen Leiterplatten
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DE19633796B4 (de) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
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DE19736352C1 (de) 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
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DE10206660C1 (de) * 2002-02-12 2003-07-24 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum Transport von flachem Behandlungsgut in Durchlaufanlagen
DE10207941A1 (de) * 2002-02-17 2003-09-04 Egon Huebel Verfahren und Vorrichtung zur elektrischen Kontaktierung von flachem Gut in elektrolytischen Anlagen
DE10210538B4 (de) * 2002-03-05 2004-11-18 Atotech Deutschland Gmbh Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut
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NL2005480C2 (nl) 2010-10-07 2012-04-11 Meco Equip Eng Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat.
CN102456934B (zh) 2010-10-20 2016-01-20 流体公司 针对基架燃料电极的电池重置过程
JP5908251B2 (ja) 2010-11-17 2016-04-26 フルイディック，インク．Ｆｌｕｉｄｉｃ，Ｉｎｃ． 階層型アノードのマルチモード充電
CN102121126B (zh) * 2011-01-19 2014-12-31 俊杰机械(深圳)有限公司 一种带导轮架的pcb电镀装置
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CN103266334B (zh) * 2013-04-24 2015-12-02 东莞市鸿展机械设备有限公司 隔液传送装置
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Also Published As

Publication number Publication date
IE822387L (en) 1983-04-07
SE8205713D0 (sv) 1982-10-06
JPH0222159B2 (es) 1990-05-17
GB2107357A (en) 1983-04-27
ES516287A0 (es) 1984-01-16
SE8205713L (sv) 1983-04-08
FR2514037A1 (fr) 1983-04-08
IE54263B1 (en) 1989-08-02
JPS58136797A (ja) 1983-08-13
CA1190888A (en) 1985-07-23
IT1196672B (it) 1988-11-25
IT8268174A0 (it) 1982-10-06
DE3236545A1 (de) 1983-05-05
FR2514037B1 (fr) 1986-12-26
GB2107357B (en) 1984-12-12
DE3236545C2 (de) 1991-12-12
NL8203845A (nl) 1983-05-02
US4385967A (en) 1983-05-31
CH652758A5 (it) 1985-11-29
AT378009B (de) 1985-06-10
ATA367882A (de) 1984-10-15

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