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ES439036A1 - Metodo para formar una capa metalica sobre la superficie de un cuerpo de polimero de poliimida. - Google Patents

Metodo para formar una capa metalica sobre la superficie de un cuerpo de polimero de poliimida.

Info

Publication number
ES439036A1
ES439036A1 ES439036A ES439036A ES439036A1 ES 439036 A1 ES439036 A1 ES 439036A1 ES 439036 A ES439036 A ES 439036A ES 439036 A ES439036 A ES 439036A ES 439036 A1 ES439036 A1 ES 439036A1
Authority
ES
Spain
Prior art keywords
forming
metallic layer
polyimide polymer
polymer body
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES439036A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES439036A1 publication Critical patent/ES439036A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
ES439036A 1974-07-03 1975-07-01 Metodo para formar una capa metalica sobre la superficie de un cuerpo de polimero de poliimida. Expired ES439036A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48541074A 1974-07-03 1974-07-03

Publications (1)

Publication Number Publication Date
ES439036A1 true ES439036A1 (es) 1977-02-01

Family

ID=23928053

Family Applications (1)

Application Number Title Priority Date Filing Date
ES439036A Expired ES439036A1 (es) 1974-07-03 1975-07-01 Metodo para formar una capa metalica sobre la superficie de un cuerpo de polimero de poliimida.

Country Status (9)

Country Link
US (2) US4112139A (es)
JP (1) JPS5119067A (es)
BR (1) BR7504107A (es)
CA (1) CA1053994A (es)
DE (1) DE2529571A1 (es)
ES (1) ES439036A1 (es)
FR (1) FR2277114A1 (es)
GB (1) GB1497620A (es)
IT (1) IT1039133B (es)

Families Citing this family (64)

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US4261800A (en) * 1977-08-15 1981-04-14 Western Electric Co., Inc. Method of selectively depositing a metal on a surface of a substrate
JPS6054906B2 (ja) * 1978-01-31 1985-12-02 財団法人特殊無機材料研究所 セラミツクス焼結成形体の製造法
JPS54140968A (en) * 1978-04-25 1979-11-01 Hitachi Ltd Method of forming circuit
NL7806773A (nl) * 1978-06-23 1979-12-28 Philips Nv Additieve werkwijze voor het vervaardigen van metaal- patronen op kunststofsubstraten.
US4360968A (en) * 1981-07-27 1982-11-30 Western Electric Company, Incorporated Method for reducing solder sticking on a printed wiring board
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
US4430418A (en) 1982-09-30 1984-02-07 E. I. Du Pont De Nemours And Company Radiation-sensitive polyimide precursor composition derived from a diaryl fluoronated diamine compound
JPH0652732B2 (ja) * 1985-08-14 1994-07-06 三菱電機株式会社 パツシベ−シヨン膜の形成方法
US4639290A (en) * 1985-12-09 1987-01-27 Hughes Aircraft Company Methods for selectively removing adhesives from polyimide substrates
US4701351A (en) * 1986-06-16 1987-10-20 International Business Machines Corporation Seeding process for electroless metal deposition
EP0272420A3 (en) * 1986-12-22 1989-11-02 General Electric Company Photopatterned aromatic polymeric substrates, method for making same and use
US4775449A (en) * 1986-12-29 1988-10-04 General Electric Company Treatment of a polyimide surface to improve the adhesion of metal deposited thereon
CN87100440B (zh) * 1987-01-27 1988-05-11 中国人民解放军装甲兵工程学院 在不导电材料上刷镀铜的方法
US4725504A (en) * 1987-02-24 1988-02-16 Polyonics Corporation Metal coated laminate products made from textured polyimide film
US4992144A (en) * 1987-02-24 1991-02-12 Polyonics Corporation Thermally stable dual metal coated laminate products made from polyimide film
US4894124A (en) * 1988-02-16 1990-01-16 Polyonics Corporation Thermally stable dual metal coated laminate products made from textured polyimide film
US4806395A (en) * 1987-02-24 1989-02-21 Polyonics Corporation Textured polyimide film
US4832799A (en) * 1987-02-24 1989-05-23 Polyonics Corporation Process for coating at least one surface of a polyimide sheet with copper
US4882200A (en) * 1987-05-21 1989-11-21 General Electric Company Method for photopatterning metallization via UV-laser ablation of the activator
US4877718A (en) * 1988-09-26 1989-10-31 Rennsselaer Polytechnic Institute Positive-working photosensitive polyimide operated by photo induced molecular weight changes
US4931310A (en) * 1988-11-25 1990-06-05 International Business Machines Corporation Process for treating the surface of polyimides to improve properties to receive metal layer
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
JP2538043B2 (ja) * 1989-04-05 1996-09-25 松下電器産業株式会社 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法
US5084299A (en) * 1989-08-10 1992-01-28 Microelectronics And Computer Technology Corporation Method for patterning electroless plated metal on a polymer substrate
US5192581A (en) * 1989-08-10 1993-03-09 Microelectronics And Computer Technology Corporation Protective layer for preventing electroless deposition on a dielectric
US4981715A (en) * 1989-08-10 1991-01-01 Microelectronics And Computer Technology Corporation Method of patterning electroless plated metal on a polymer substrate
US5133840A (en) * 1990-05-15 1992-07-28 International Business Machines Corporation Surface midification of a polyimide
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
JP2524436B2 (ja) * 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面処理方法
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
JPH0760821B2 (ja) * 1991-05-17 1995-06-28 インターナショナル・ビジネス・マシーンズ・コーポレイション ポリマー基材の状態調整方法
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
JP2765673B2 (ja) * 1992-06-04 1998-06-18 インターナショナル・ビジネス・マシーンズ・コーポレイション メタライゼーション層及びその形成方法
US5380560A (en) * 1992-07-28 1995-01-10 International Business Machines Corporation Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition
US5348574A (en) * 1993-07-02 1994-09-20 Monsanto Company Metal-coated polyimide
JPH0948864A (ja) * 1995-08-03 1997-02-18 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムの接着性改善方法及び接着性を改善したポリイミドフィルム
US5755859A (en) * 1995-08-24 1998-05-26 International Business Machines Corporation Cobalt-tin alloys and their applications for devices, chip interconnections and packaging
DE10024239C1 (de) * 2000-05-15 2001-09-20 Atotech Deutschland Gmbh Verfahren zum galvanotechnischen Behandeln von Werkstücken mit einer Palladiumkolloidlösung
US6685793B2 (en) 2001-05-21 2004-02-03 3M Innovative Properties Company Fluoropolymer bonding composition and method
US7485371B2 (en) * 2004-04-16 2009-02-03 3M Innovative Properties Company Bonding compositions
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US6752894B2 (en) 2001-12-14 2004-06-22 3M Innovative Properties Company Process for modifying a polymeric surface
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US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US20070237977A1 (en) * 2006-04-07 2007-10-11 United States Of America As Represented By The Administrator Of The National Aeronautics And Spac Thin Metal Film System To Include Flexible Substrate And Method Of Making Same
JP5215182B2 (ja) * 2006-07-04 2013-06-19 新日鉄住金化学株式会社 ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法
US7649439B2 (en) * 2006-08-18 2010-01-19 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flexible thin metal film thermal sensing system
US8198976B2 (en) * 2006-08-18 2012-06-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flexible thin metal film thermal sensing system
CN101688308B (zh) * 2007-07-02 2012-10-10 荏原优莱特科技股份有限公司 金属层叠聚酰亚胺底座及其制造方法
US20090149589A1 (en) * 2007-12-05 2009-06-11 College Of William And Mary Method for generating surface-silvered polymer structures
CA2917871A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated tubular lattice structure
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US3558352A (en) * 1966-10-27 1971-01-26 Ibm Metallization process
US3573973A (en) * 1967-11-13 1971-04-06 Ibm High speed additive circuit process
US3791939A (en) * 1972-05-15 1974-02-12 Western Electric Co Method of selectively depositing a metal on a surface
US3821016A (en) * 1972-05-19 1974-06-28 Western Electric Co Method of forming an adherent metallic pattern on a polyimide surface
US3775121A (en) * 1972-08-09 1973-11-27 Western Electric Co Method of selectively depositing a metal on a surface of a substrate

Also Published As

Publication number Publication date
CA1053994A (en) 1979-05-08
JPS5119067A (es) 1976-02-16
IT1039133B (it) 1979-12-10
FR2277114A1 (fr) 1976-01-30
GB1497620A (en) 1978-01-12
BR7504107A (pt) 1976-07-20
FR2277114B1 (es) 1979-10-19
US4078096A (en) 1978-03-07
DE2529571A1 (de) 1976-01-22
US4112139A (en) 1978-09-05

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