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EP2695189A1 - Ceramic printed circuit board comprising an al cooling body - Google Patents

Ceramic printed circuit board comprising an al cooling body

Info

Publication number
EP2695189A1
EP2695189A1 EP12714276.8A EP12714276A EP2695189A1 EP 2695189 A1 EP2695189 A1 EP 2695189A1 EP 12714276 A EP12714276 A EP 12714276A EP 2695189 A1 EP2695189 A1 EP 2695189A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
heat sink
soldered
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12714276.8A
Other languages
German (de)
French (fr)
Inventor
Alexander Dohn
Alfred Thimm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of EP2695189A1 publication Critical patent/EP2695189A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H10W40/228—
    • H10W40/25—
    • H10W40/255—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Definitions

  • the invention relates to a printed circuit board made of ceramic with an upper side and a lower side, wherein sintered metallization regions are arranged on the upper side and the lower side is designed as a heat sink.
  • Such a ceramic circuit board is known from WO 2007/107601 A3.
  • the invention has the object to improve a printed circuit board made of ceramic according to the preamble of claim 1 so that.
  • the heat dissipation of components on the top of the circuit board is improved
  • this object is achieved in that also sintered metallization areas are arranged on the bottom on which a metallic heat sink is soldered. Due to the sintered metallization areas on the underside and the soldering of the metal heat sink, a particularly good heat dissipation is achieved from the top of the printed circuit board to the metallic heat sink.
  • solder preferably a refractory brazing alloy having a melting point between 450 and 660 ° C is achieved.
  • Metallic heat sinks have a high thermal conductivity.
  • the printed circuit board is made of aluminum oxide or aluminum nitride.
  • the circuit board is made of aluminum nitride, which has a particularly good thermal conductivity.
  • the metallic heat sink is made of aluminum.
  • Aluminum has a high thermal conductivity.
  • the metallic heat sink consists of a carrier plate with a connection side and an active side, and the heat sink with the connection side is soldered onto the metallization regions of the underside of the circuit board and has cooling elements projecting on the active side. By projecting cooling elements, the surface of the heat sink is increased and can radiate the heat introduced better.
  • the protruding cooling elements are a plurality of needles in the nature of a pin cushion.
  • the surface is extremely enlarged in a small space.
  • the top of the circuit board is concave or convex, whereby when using the circuit board as a lamp, the radiated light can be focused or scattered.
  • a method according to the invention for producing a printed circuit board is characterized in that a ceramic substrate pre-metallized on both sides by sintered metallization regions is produced, the metallization areas being gold, silver, silver alloys, active plating with galvanic coatings such as Ni + Au or thick-film aluminum or alternative methods such as Thin-film or plasma spraying is metallized and then the heat sink is soldered with its connection side on the underside of the circuit board, wherein as solder preferably a refractory brazing material with a melting point between 450 and 660 ° C is used.
  • soldering with brazing in the temperature range mentioned a necessary solid compound is achieved with good heat transfer performance. There is no clamping, screwing or gluing, as they have defects that are avoided when brazing with brazing.
  • the circuit board is used as a lamp or part of a lamp, wherein on the upper side of the printed circuit board LEDs are optionally soldered with associated circuit and / or electrical components.
  • the circuit may be covered for protection with an opaque lid.
  • the printed circuit board 2 has an upper 2a and a lower side 2b, wherein a soldered metallic heat sink 3 is arranged on the lower side 2b.
  • An essential feature of the invention is that both the upper side 2a and the lower side 2b are formed as ceramic circuit boards 2. This is achieved by applying sintered metallization regions on the upper side 2a and lower side 2b. Sintered metallization regions are described in WO 2007107601 A2. On the upper side 2a or on the localized metallization regions, components such as LEDs and / or a circuit can be soldered directly.
  • the advantage lies, inter alia, in the fact that the heat generated by the components is conducted directly into the ceramic of the printed circuit board 2 due to the high thermal conductivity.
  • the ceramic substrate preferably of AIN, pre-metallized on both sides by sintered metallization regions is metallized with gold, silver, silver alloys, active solder with galvanic coatings such as Ni + Au or with aluminum in thick film technology or alternative methods (thin film, plasma spraying, etc.) (base metallization). Both sides of the substrate can also be covered with different metallization.
  • the circuit board made of aluminum nitride, since in this case the thermal conductivity is extremely high.
  • a metallic heat sink 3 is soldered in a suitable geometry on the underside 2b of the ceramic circuit board 2 or on its base-metallized side.
  • the heat sink 3 is preferably made of aluminum (injection molding, cast part or the like).
  • the solder is preferably a refractory brazing material with a melting point between 450 and 660 ° C, the printed circuit board 2 on the base metallization and the braze with the metallic heat sink 3 firmly connects. There is no clamping, screwing or gluing.
  • the ceramic circuit board 2 which has both sides sintered Metallmaschines Kunststoffe and thus both sides of a board, or can be used, is on one side to the cooler side, i. towards the metallic heat sink 3, preferably flat.
  • the surface On the component side, i. on the top 2a where LEDs 6 are preferably arranged, the surface may also be convex or concave curved. As a result, when the components are LEDs 6, the light is scattered or bundled.
  • the braze used to braze the metallic heat sink 3 is preferably a commercially available aluminum brazing alloy (TMP aluminum brazing paste-39), as used to repair aluminum components, solid and good at 570 ° C.
  • thermally conductive over 50 W / mK
  • thermally conductive over 50 W / mK
  • the mounting side ie on the bottom 2b mechanically or chemically well cleaned (free of oxide) aluminum cooler 3 is connected.
  • the electrical components such as diodes, LEDs 6, transistors or similar. are then soldered with any other required components such as resistors or drivers with a soft solder in the temperature range at preferably 100-400 ° C in a second step on the top 2a of the pre-metallized ceramic circuit board 2. This creates a good heat transfer, especially for power components.
  • connection to the electrical network is preferably carried out by connector strips on the upper side 2a of the ceramic or via bonding wires from the ceramic to the outside.
  • LEDs 6 soldered
  • single or group lenses can be glued or soldered for protection or light scattering. Even opaque lid can serve to close the circuit.
  • the ceramic circuit board according to the invention can be used as a lamp or as part of a lamp.
  • FIG. 1 shows a printed circuit board 2 according to the invention with its top 2a and bottom 2b.
  • a metallic heat sink 3 is soldered aluminum.
  • the ceramic of the printed circuit board 2 is aluminum nitride.
  • the printed circuit board 2 is round in this example.
  • the sintered metallization areas are not visible in this figure.
  • the metallic heat sink 3 is made of aluminum and is formed like a pincushion, i. consists of a support plate 4, which is soldered onto the ceramic circuit board 2.
  • a plurality of protruding cylindrical needles 5 are arranged on the carrier plate 4.
  • FIG. 2 shows the upper side 2 a of the printed circuit board 2 according to FIG. 1.
  • the soldered electrical components are identified by the reference numeral 6.
  • the power lines are applied in thick film technology and marked with the reference numeral 7. These power lines 7 and the components 6 are soldered onto the sintered metallization regions. The metallization areas are not visible in the figure.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Led Device Packages (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The invention relates to a ceramic printed circuit board (2) comprising an upper side (2a) and a lower side (2b), sintered metallisation regions being arranged on the upper side (2a), and the lower side being embodied as a cooling body (3). In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side (2b) is also provided with sintered metallisation regions to which a metal cooling body (3) is soldered.

Description

Keramische Leiterplatte mit AI-Kühlkörper  Ceramic circuit board with AI heat sink

Die Erfindung betrifft eine Leiterplatte aus Keramik mit einer Oberseite und einer Unterseite, wobei auf der Oberseite versinterte Metallisierungsbereiche angeordnet sind und die Unterseite als Kühlkörper ausgebildet ist. The invention relates to a printed circuit board made of ceramic with an upper side and a lower side, wherein sintered metallization regions are arranged on the upper side and the lower side is designed as a heat sink.

Eine derartige keramische Leiterplatte ist aus der WO 2007/107601 A3 bekannt. Such a ceramic circuit board is known from WO 2007/107601 A3.

Der Erfindung liegt die Aufgabe zugrunde, eine Leiterplatte aus Keramik nach dem Oberbegriff des Anspruchs 1 so zu verbessern, dass. die Wärmeableitung von Komponenten auf der Oberseite der Leiterplatte verbessert ist Erfindungsgemäß wird diese Aufgabe dadurch gelöst, dass auch auf der Unterseite versinterte Metallisierungsbereiche angeordnet sind auf denen ein metallischer Kühlkörper aufgelötet ist. Durch die versinterten Metallisierungsbereiche auf der Unterseite und das Auflöten des metallischen Kühlkörpers ist eine besonders gute Wärmeableitung von der Oberseite der Leiterplatte bis in den metallischen Kühlkörper erreicht. Als Lot wird vorzugsweise ein hochschmelzendes Hartlot mit einem Schmelzpunkt zwischen 450 und 660°C erreicht. Metallische Kühlkörper weisen eine hohe thermische Leitfähigkeit auf. The invention has the object to improve a printed circuit board made of ceramic according to the preamble of claim 1 so that. The heat dissipation of components on the top of the circuit board is improved According to the invention this object is achieved in that also sintered metallization areas are arranged on the bottom on which a metallic heat sink is soldered. Due to the sintered metallization areas on the underside and the soldering of the metal heat sink, a particularly good heat dissipation is achieved from the top of the printed circuit board to the metallic heat sink. As solder, preferably a refractory brazing alloy having a melting point between 450 and 660 ° C is achieved. Metallic heat sinks have a high thermal conductivity.

In einer Ausführungsform der Erfindung besteht die Leiterplatte aus Aluminiumoxid oder Aluminiumnitrid. Bevorzugt besteht die Leiterplatte als Aluminiumnitrid, welches eine besonders gute thermische Leitfähigkeit hat. In one embodiment of the invention, the printed circuit board is made of aluminum oxide or aluminum nitride. Preferably, the circuit board is made of aluminum nitride, which has a particularly good thermal conductivity.

In bevorzugter Ausführungsform besteht der metallische Kühlkörper aus Aluminium. Aluminium weist eine große thermische Leitfähigkeit auf. In einer erfindungsgemäßen Ausführungsform besteht der metallische Kühlkörper aus einer Trägerplatte mit einer Verbindungsseite und einer Wirkseite und ist der Kühlkörper mit der Verbindungsseite auf die Metallisierungsbereiche der Unterseite der Leiterplatte gelötet und weist auf der Wirkseite abstehende Kühlelemente auf. Durch abstehende Kühlelemente ist die Oberfläche des Kühlkörpers vergrößert und kann die eingeleitete Wärme besser abstrahlen. In a preferred embodiment, the metallic heat sink is made of aluminum. Aluminum has a high thermal conductivity. In an embodiment according to the invention, the metallic heat sink consists of a carrier plate with a connection side and an active side, and the heat sink with the connection side is soldered onto the metallization regions of the underside of the circuit board and has cooling elements projecting on the active side. By projecting cooling elements, the surface of the heat sink is increased and can radiate the heat introduced better.

In einer erfindungsgemäßen Ausführungsform sind die abstehenden Kühlelemente eine Mehrzahl an Nadeln in der Art eines Nadelkissens. Hierdurch ist auf kleinstem Raum die Oberfläche extrem vergrößert. In einer Ausführungsform der Erfindung ist die Oberseite der Leiterplatte konkav oder konvex ausgebildet, wodurch bei der Verwendung der Leiterplatte als Lampe, das abgestrahlte Licht fokussiert oder gestreut werden kann. In one embodiment of the invention, the protruding cooling elements are a plurality of needles in the nature of a pin cushion. As a result, the surface is extremely enlarged in a small space. In one embodiment of the invention, the top of the circuit board is concave or convex, whereby when using the circuit board as a lamp, the radiated light can be focused or scattered.

Ein erfindungsgemäßes Verfahren zur Herstellung einer Leiterplatte ist dadurch gekennzeichnet, dass ein beidseitig durch versinterte Metallisierungsbereiche vormetallisiertes keramisches Substrat hergestellt wird, dass die Metallisierungsbereiche mit Gold, Silber, Silberlegierungen, Aktivlot mit galvanischen Überzügen wie Ni + Au oder mit Aluminium in Dickfilmtechnik oder alternativen Methoden wie Dünnfilm oder Plasmaspritzen metallisiert wird und anschließend der Kühlkörper mit seiner Verbindungsseite auf die Unterseite der Leiterplatte gelötet wird, wobei als Lot vorzugsweise ein hochschmelzendes Hartlot mit einem Schmelzpunkt zwischen 450 und 660°C verwendet wird. Durch das Auflöten mit Hartlot in dem genannten Temperaturbereich wird eine notwendige feste Verbindung bei guter Wärmeübergangsleistung erreicht. Es erfolgt keine Klemmung, Verschraubung oder Klebung, da diese Mängel aufweisen, die beim Auflöten mit Hartlot vermieden werden. A method according to the invention for producing a printed circuit board is characterized in that a ceramic substrate pre-metallized on both sides by sintered metallization regions is produced, the metallization areas being gold, silver, silver alloys, active plating with galvanic coatings such as Ni + Au or thick-film aluminum or alternative methods such as Thin-film or plasma spraying is metallized and then the heat sink is soldered with its connection side on the underside of the circuit board, wherein as solder preferably a refractory brazing material with a melting point between 450 and 660 ° C is used. By soldering with brazing in the temperature range mentioned a necessary solid compound is achieved with good heat transfer performance. There is no clamping, screwing or gluing, as they have defects that are avoided when brazing with brazing.

Bevorzugt wird die Leiterplatte als Lampe oder Teil einer Lampe verwendet, wobei auf der Oberseite der Leiterplatte LEDs ggf. mit zugehöriger Schaltung und/oder elektrische Bauelemente aufgelötet sind. Die Schaltung kann zum Schutz mit einem lichtundurchlässigen Deckel abgedeckt sein. Preferably, the circuit board is used as a lamp or part of a lamp, wherein on the upper side of the printed circuit board LEDs are optionally soldered with associated circuit and / or electrical components. The circuit may be covered for protection with an opaque lid.

Zur Steuerung des abgestrahlten Lichts können auf den LEDs Einzel- oder Gruppenlinsen aufgebracht sein. Die erfindungsgemäße Leiterplatte 2 (siehe Figuren 1 und 2) weist eine Ober 2a - und eine Unterseite 2b auf, wobei auf der Unterseite 2b ein aufgelöteter metallischer Kühlkörper 3 angeordnet ist. Ein wesentliches Merkmal der Erfindung ist, dass sowohl die Oberseite 2a als auch die Unterseite 2b als keramische Leiterplatten 2 ausgebildet sind. Dies wird dadurch erreicht, dass auf der Oberseite 2a und Unterseite 2b versinterte Metallisierungsbereiche aufgebracht sind. Versinterte Metallisierungsbereiche sind in der WO 2007107601 A2 beschrieben. Auf der Oberseite 2a bzw. auf die dortigen Metallisierungsbereiche können Bauteile, wie LEDs und/oder eine Schaltung direkt aufgelötet werden. Der Vorteil liegt unter anderem darin, dass die von den Bauteilen erzeugte Wärme aufgrund der hohen Wärmeleitfähigkeit direkt in die Keramik der Leiterplatte 2 geleitet wird. To control the radiated light can be applied to the LEDs single or group lenses. The printed circuit board 2 according to the invention (see FIGS. 1 and 2) has an upper 2a and a lower side 2b, wherein a soldered metallic heat sink 3 is arranged on the lower side 2b. An essential feature of the invention is that both the upper side 2a and the lower side 2b are formed as ceramic circuit boards 2. This is achieved by applying sintered metallization regions on the upper side 2a and lower side 2b. Sintered metallization regions are described in WO 2007107601 A2. On the upper side 2a or on the localized metallization regions, components such as LEDs and / or a circuit can be soldered directly. The advantage lies, inter alia, in the fact that the heat generated by the components is conducted directly into the ceramic of the printed circuit board 2 due to the high thermal conductivity.

Das beidseitig durch versinterte Metallisierungsbereiche vormetallisierte keramische Substrat vorzugsweise aus AIN wird mit Gold, Silber, Silberlegierungen, Aktivlot mit galvanischen Überzügen wie Ni + Au oder mit Aluminium in Dickfilmtechnik oder alternativen Methoden (Dünnfilm, Plasmaspritzen usw.) metallisiert (Grundmetallisierung). Beide Seiten des Substrats können auch mit unterschiedlicher Metallisierung belegt sein. Bevorzugt besteht die Leiterplatte aus Aluminiumnitrid, da hierbei die Wärmeleitfähigkeit extrem hoch ist. The ceramic substrate, preferably of AIN, pre-metallized on both sides by sintered metallization regions is metallized with gold, silver, silver alloys, active solder with galvanic coatings such as Ni + Au or with aluminum in thick film technology or alternative methods (thin film, plasma spraying, etc.) (base metallization). Both sides of the substrate can also be covered with different metallization. Preferably, the circuit board made of aluminum nitride, since in this case the thermal conductivity is extremely high.

Auf der Unterseite 2b der keramischen Leiterplatte 2 bzw. auf deren grundmetallisierte Seite wird aus Gründen hoher Wärmeleitfähigkeit ein metallischer Kühlkörper 3 in geeigneter Geometrie gelötet. Der Kühlkörper 3 besteht vorzugsweise aus Aluminium (Spritzguss, Giessteil o.ä.). Das Lot ist vorzugsweise ein hochschmelzendes Hartlot mit einem Schmelzpunkt zwischen 450 und 660°C, das die Leiterplatte 2 über deren Grundmetallisierung und das Hartlot mit dem metallischen Kühlkörper 3 fest verbindet. Es erfolgt keine Klemmung, Verschraubung oder Klebung. For reasons of high thermal conductivity, a metallic heat sink 3 is soldered in a suitable geometry on the underside 2b of the ceramic circuit board 2 or on its base-metallized side. The heat sink 3 is preferably made of aluminum (injection molding, cast part or the like). The solder is preferably a refractory brazing material with a melting point between 450 and 660 ° C, the printed circuit board 2 on the base metallization and the braze with the metallic heat sink 3 firmly connects. There is no clamping, screwing or gluing.

Die keramische Leiterplatte 2, die beidseitig versinterte Metallisierungsbereiche aufweist und damit beidseitig eine Platine ist, bzw. dazu verwendet werden kann, ist einseitig zur Kühlerseite, d.h. zum metallischen Kühlkörper 3 hin, vorzugsweise eben. Auf der Bauteilseite, d.h. auf der Oberseite 2a wo bevorzugt LEDs 6 angeordnet sind, kann die Oberfläche auch konvex oder konkav gekrümmt sein. Hierdurch wird, wenn die Bauteile LEDs 6 sind, das Licht gestreut oder gebündelt abgestrahlt. Das zum Auflöten des metallischen Kühlkörpers 3 verwendete Hartlot ist bevorzugt ein kommerziell erhältliches Aluminiumhartlot (TMP-Aluminium-Lötpaste-39), wie es zur Reparatur von Aluminiumbauteilen verwendet wird, das bei 570°C auf einer Heizplatte oder in einem geeigneten Lötofen fest und gut wärmeleitfähig (über 50 W/mK) mit einem preisgünstigen, auf der Montageseite, d.h. auf der Unterseite 2b mechanisch oder chemisch gut gesäuberten (von Oxid befreitem) Aluminiumkühler 3 verbunden wird. The ceramic circuit board 2, which has both sides sintered Metallisierungsbereiche and thus both sides of a board, or can be used, is on one side to the cooler side, i. towards the metallic heat sink 3, preferably flat. On the component side, i. on the top 2a where LEDs 6 are preferably arranged, the surface may also be convex or concave curved. As a result, when the components are LEDs 6, the light is scattered or bundled. The braze used to braze the metallic heat sink 3 is preferably a commercially available aluminum brazing alloy (TMP aluminum brazing paste-39), as used to repair aluminum components, solid and good at 570 ° C. on a hot plate or in a suitable brazing furnace thermally conductive (over 50 W / mK) with a low-cost, on the mounting side, ie on the bottom 2b mechanically or chemically well cleaned (free of oxide) aluminum cooler 3 is connected.

Die elektrischen Bauteile wie Dioden, LEDs 6, Transistoren o.ä. werden dann mit eventuell benötigten weiteren Komponenten wie Widerständen bzw. Treibern mit einem Weichlot im Temperaturbereich bei vorzugsweise 100-400 °C in einem zweiten Schritt auf die Oberseite 2a der vormetallisierten keramischen Leiterplatte 2 gelötet. Dadurch wird ein guter Wärmeübergang besonders für Leistungsbauteile erzeugt. The electrical components such as diodes, LEDs 6, transistors or similar. are then soldered with any other required components such as resistors or drivers with a soft solder in the temperature range at preferably 100-400 ° C in a second step on the top 2a of the pre-metallized ceramic circuit board 2. This creates a good heat transfer, especially for power components.

Die Verbindung zum elektrischen Netz erfolgt bevorzugt durch Steckerleisten an der Oberseite 2a der Keramik oder über Bonddrähte von der Keramik nach aussen. Im Falle von aufgelöteten LEDs 6 können zum Schutz oder zur Lichtstreuung Einzeloder Gruppenlinsen aufgeklebt oder gelötet werden. Auch lichtundurchlässige Deckel können zum Verschluss der Schaltung dienen. Die erfindungsgemäße keramische Leiterplatte kann als Lampe oder als Teil einer Lampe verwendet werden. The connection to the electrical network is preferably carried out by connector strips on the upper side 2a of the ceramic or via bonding wires from the ceramic to the outside. In the case of LEDs 6 soldered, single or group lenses can be glued or soldered for protection or light scattering. Even opaque lid can serve to close the circuit. The ceramic circuit board according to the invention can be used as a lamp or as part of a lamp.

Figur 1 zeigt eine erfindungsgemäße Leiterplatte 2 mit ihrer Oberseite 2a und Unterseite 2b. Auf der Unterseite 2a ist ein metallischer Kühlkörper 3 aus Aluminium aufgelötet. Die Keramik der Leiterplatte 2 ist Aluminiumnitrid. Die Leiterplatte 2 ist in diesem Beispiel rund ausgebildet. Die versinterten Metallisierungsbereiche sind in dieser Figur nicht zu sehen. Der metallische Kühlkörper 3 besteht aus Aluminium und ist wie ein Nadelkissen ausgebildet, d.h. besteht aus einer Trägerplatte 4, die auf die keramische Leiterplatte 2 gelötet wird. Auf der gegenüberliegenden Seite sind auf der Trägerplatte 4 eine Vielzahl abstehender zylinderförmiger Nadeln 5 angeordnet. FIG. 1 shows a printed circuit board 2 according to the invention with its top 2a and bottom 2b. On the bottom 2a a metallic heat sink 3 is soldered aluminum. The ceramic of the printed circuit board 2 is aluminum nitride. The printed circuit board 2 is round in this example. The sintered metallization areas are not visible in this figure. The metallic heat sink 3 is made of aluminum and is formed like a pincushion, i. consists of a support plate 4, which is soldered onto the ceramic circuit board 2. On the opposite side, a plurality of protruding cylindrical needles 5 are arranged on the carrier plate 4.

Figur 2 zeigt die Oberseite 2a der Leiterplatte 2 gemäß Figur 1 . Die aufgelöteten elektrischen Bauteile sind mit dem Bezugszeichen 6 gekennzeichnet. Die Stromleitungen sind in Dickfilmtechnik aufgebracht und mit dem Bezugszeichen 7 gekennzeichnet. Diese Stromleitungen 7 und die Bauteile 6 sind auf die versinterten Metallisierungsbereiche aufgelötet. Die Metallisierungsbereiche sind in der Figur nicht zu sehen. FIG. 2 shows the upper side 2 a of the printed circuit board 2 according to FIG. 1. The soldered electrical components are identified by the reference numeral 6. The power lines are applied in thick film technology and marked with the reference numeral 7. These power lines 7 and the components 6 are soldered onto the sintered metallization regions. The metallization areas are not visible in the figure.

Claims

Patentansprüche claims 1 . Leiterplatte (2) aus Keramik mit einer Oberseite (2a) und einer Unterseite (2b), wobei auf der Oberseite (2a) versinterte Metallisierungsbereiche angeordnet sind und die Unterseite als Kühlkörper (3) ausgebildet ist, dadurch gekennzeichnet, dass auch auf der Unterseite (2b) versinterte Metallisierungsbereiche angeordnet sind +auf denen ein metallischer Kühlkörper (3) aufgelötet ist. 1 . Circuit board (2) made of ceramic with a top (2a) and a bottom (2b), wherein on the top (2a) sintered metallization are arranged and the bottom is formed as a heat sink (3), characterized in that also on the bottom ( 2b) sintered metallization are arranged + on which a metallic heat sink (3) is soldered. 2. Leiterplatte nach Anspruch 1 , dadurch gekennzeichnet, dass die Leiterplatte (2) aus Aluminiumoxid oder Aluminiumnitrid besteht. 2. Printed circuit board according to claim 1, characterized in that the printed circuit board (2) consists of aluminum oxide or aluminum nitride. 3. Leiterplatte nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der metallische Kühlkörper (3) aus Aluminium besteht. 3. Printed circuit board according to claim 1 or 2, characterized in that the metallic heat sink (3) consists of aluminum. 4. Leiterplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass der metallische Kühlkörper (3) aus einer Trägerplatte (4) mit einer4. Printed circuit board according to one of claims 1 to 3, characterized in that the metallic heat sink (3) consists of a carrier plate (4) with a Verbindungsseite und einer Wirkseite besteht und der Kühlkörper (3) mit der Verbindungsseite auf die Metallisierungsbereiche der Unterseite (2b) der Leiterplatte (2) gelötet ist und auf der Wirkseite abstehende Kühlelemente (3) aufweist. Connecting side and an active side exists and the heat sink (3) with the connection side to the metallization of the bottom (2b) of the circuit board (2) is soldered and projecting on the active side cooling elements (3). 5. Leiterplatte nach Anspruch 4, dadurch gekennzeichnet, dass die abstehenden Kühlelemente (3) eine Mehrzahl an Nadeln (5) in der Art eines Nadelkissens sind. 5. Printed circuit board according to claim 4, characterized in that the protruding cooling elements (3) are a plurality of needles (5) in the manner of a pin cushion. 6. Leiterplatte nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Oberseite (2a) der Leiterplatte (2) konkav oder konvex ausgebildet ist. 6. Printed circuit board according to one of claims 1 to 5, characterized in that the upper side (2 a) of the printed circuit board (2) is concave or convex. 7. Verfahren zur Herstellung einer Leiterplatte (2) nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass ein beidseitig durch versinterte Metallisierungsbereiche vormetallisiertes keramisches Substrat hergestellt wird, dass die Metallisierungsbereiche mit Gold, Silber, Silberlegierungen, Aktivlot mit galvanischen Überzügen wie Ni + Au oder mit Aluminium in Dickfilmtechnik oder alternativen Methoden wie Dünnfilm oder Plasmaspritzen metallisiert wird und anschließend der Kühlkörper (3) mit seiner Verbindungsseite auf die Unterseite (2b) der Leiterplatte (2) gelötet wird, wobei als Lot vorzugsweise ein hochschmelzendes Hartlot mit einem Schmelzpunkt zwischen 450 und 660°C verwendet wird. 7. A method for producing a printed circuit board (2) according to any one of claims 1 to 6, characterized in that a pre-metallized on both sides by sintered metallization ceramic substrate is made, that the metallization areas with gold, silver, silver alloys, active solder with galvanic coatings such as Ni + Au or with aluminum in thick-film technology or alternative methods such as thin film or plasma spraying is metallized and then the heat sink (3) is soldered with its connection side on the bottom (2b) of the circuit board (2), preferably as Lot a high-melting braze with a melting point between 450 and 660 ° C is used. 8. Verwendung einer Leiterplatte (2) nach einem der Ansprüche 1 bis 6 als Lampe oder Teil einer Lampe, wobei auf der Oberseite (2a) der Leiterplatte LEDs ggf. mit zugehöriger Schaltung und/oder elektrische Bauelemente aufgelötet sind. 8. Use of a printed circuit board (2) according to one of claims 1 to 6 as a lamp or part of a lamp, wherein on the upper side (2 a) of the printed circuit board LEDs are possibly soldered with associated circuit and / or electrical components. 9. Verwendung nach Anspruch 8, dadurch gekennzeichnet, dass die Schaltung mit einem lichtundurchlässigen Deckel abgedeckt ist. 9. Use according to claim 8, characterized in that the circuit is covered with an opaque lid. 10. Verwendung nach Anspruch 7 oder 8, dadurch gekennzeichnet, dass auf den LEDs Einzel- oder Gruppenlinsen aufgebracht sind. 10. Use according to claim 7 or 8, characterized in that single or group lenses are applied to the LEDs.
EP12714276.8A 2011-04-04 2012-03-30 Ceramic printed circuit board comprising an al cooling body Withdrawn EP2695189A1 (en)

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102401358B (en) * 2010-09-10 2016-08-03 欧司朗股份有限公司 The manufacture method of cooling body, cooling body and there is the illuminator of this cooling body
CN104486900A (en) * 2014-11-07 2015-04-01 广东风华高新科技股份有限公司 Supporting member for circuit board and manufacturing method for supporting member
CN105305206B (en) * 2015-11-03 2021-04-20 华中科技大学 A heat sink suitable for disc laser jet impingement cooling system
JP2018046237A (en) * 2016-09-16 2018-03-22 株式会社東芝 Semiconductor device and manufacturing method thereof
US10415895B2 (en) * 2016-11-21 2019-09-17 Abl Ip Holding Llc Heatsink
US12108576B1 (en) 2021-09-08 2024-10-01 Meta Platforms Technologies, Llc Thermal interposer for electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6543521B1 (en) * 1999-10-04 2003-04-08 Matsushita Electric Industrial Co., Ltd. Cooling element and cooling apparatus using the same

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths
US4695489A (en) * 1986-07-28 1987-09-22 General Electric Company Electroless nickel plating composition and method
JP2688446B2 (en) * 1990-03-26 1997-12-10 株式会社日立製作所 Multilayer wiring board and manufacturing method thereof
US6003586A (en) 1990-11-05 1999-12-21 Beane; Glenn L. Heat-sinking structures and electrical sockets for use therewith
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
JP3792268B2 (en) * 1995-05-23 2006-07-05 ローム株式会社 Manufacturing method of chip type light emitting device
JPH11307705A (en) * 1998-04-24 1999-11-05 Sumitomo Metal Ind Ltd Heat sink for forced air cooling and cooling method thereof
JP2002222905A (en) * 2001-01-25 2002-08-09 Hitachi Ltd Power module and its composite board and joining brazing material
EP2241803B1 (en) * 2001-05-26 2018-11-07 GE Lighting Solutions, LLC High power LED-lamp for spot illumination
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7775685B2 (en) * 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
JP3971296B2 (en) * 2002-12-27 2007-09-05 Ｄｏｗａホールディングス株式会社 Metal-ceramic bonding substrate and manufacturing method thereof
CN100587560C (en) * 2003-04-01 2010-02-03 夏普株式会社 Light-emitting device module, light-emitting device, backside light irradiation device, and display device
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
CN2689457Y (en) * 2004-02-25 2005-03-30 周珑 LED luminescent device for signal light
US7269017B2 (en) * 2004-11-19 2007-09-11 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
US7521789B1 (en) 2004-12-18 2009-04-21 Rinehart Motion Systems, Llc Electrical assembly having heat sink protrusions
KR101305884B1 (en) * 2006-01-06 2013-09-06 엘지이노텍 주식회사 Light emitting diode package, manufacturing method thereof and Back light unit having the same
TWI449137B (en) 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 Carrier for components or circuits
DE102006015117A1 (en) * 2006-03-31 2007-10-04 Osram Opto Semiconductors Gmbh Electromagnetic radiation emitting optoelectronic headlights, has gallium nitride based light emitting diode chip, which has two emission areas
JP2007294824A (en) * 2006-04-20 2007-11-08 Showa Boeki Kk LED module
US20080080187A1 (en) * 2006-09-28 2008-04-03 Purinton Richard S Sealed LED light bulb
CN101584079B (en) * 2007-01-30 2013-01-16 日立金属株式会社 Irreversible circuit element and its center conductor assembly
TW200847469A (en) * 2007-05-23 2008-12-01 Tysun Inc Substrates of curved surface for light emitting diodes
JP5160201B2 (en) * 2007-11-20 2013-03-13 株式会社豊田中央研究所 Solder material and manufacturing method thereof, joined body and manufacturing method thereof, power semiconductor module and manufacturing method thereof
TW201036508A (en) * 2009-03-17 2010-10-01 High Conduction Scient Co Ltd Double-faced conductive composite board and manufacturing method thereof
JP5383346B2 (en) * 2009-06-25 2014-01-08 京セラ株式会社 Light emitting element mounting package and light emitting device
TW201100711A (en) 2009-06-30 2011-01-01 Power Light Tech Co Ltd Light emitting diode light source assembly with heat dissipation base
US8882284B2 (en) * 2010-03-03 2014-11-11 Cree, Inc. LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties
US20110279981A1 (en) * 2010-05-17 2011-11-17 Alex Horng Heat Dissipating Assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6543521B1 (en) * 1999-10-04 2003-04-08 Matsushita Electric Industrial Co., Ltd. Cooling element and cooling apparatus using the same

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