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EP1658148B1 - Procede de formage de toles - Google Patents

Procede de formage de toles Download PDF

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Publication number
EP1658148B1
EP1658148B1 EP04801928A EP04801928A EP1658148B1 EP 1658148 B1 EP1658148 B1 EP 1658148B1 EP 04801928 A EP04801928 A EP 04801928A EP 04801928 A EP04801928 A EP 04801928A EP 1658148 B1 EP1658148 B1 EP 1658148B1
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EP
European Patent Office
Prior art keywords
reinforcement
base plate
forming
another
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP04801928A
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German (de)
English (en)
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EP1658148A1 (fr
EP1658148B2 (fr
Inventor
Heiko Engels
Hubertus Steffens
Achim Braun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metalsa Automotive GmbH
Original Assignee
ISE Innomotive Systems Europe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by ISE Innomotive Systems Europe GmbH filed Critical ISE Innomotive Systems Europe GmbH
Publication of EP1658148A1 publication Critical patent/EP1658148A1/fr
Application granted granted Critical
Publication of EP1658148B1 publication Critical patent/EP1658148B1/fr
Publication of EP1658148B2 publication Critical patent/EP1658148B2/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02—Stamping using rigid devices or tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
    • B21D35/002—Processes combined with methods covered by groups B21D1/00 - B21D31/00
    • B21D35/005—Processes combined with methods covered by groups B21D1/00 - B21D31/00 characterized by the material of the blank or the workpiece
    • B21D35/007—Layered blanks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/03—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal otherwise than by folding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D49/00—Sheathing or stiffening objects

Definitions

  • the invention relates to a method for hot or hot forming of sheets, in particular circuit boards, in a forming tool, wherein applied to a motherboard for partial reinforcement one or more reinforcing boards, the motherboard and the at least one reinforcing board fixed to each other and / or aligned by suitable means and the motherboard and the at least one reinforcing board are formed together.
  • the DE 43 07 563 C2 suggests for the field of deep drawing of sheet metal, therefore, deep-draw base plate and reinforcing plate together or form-punching.
  • the one or more reinforcing plates are attached to the base plate before the common deep-drawing or punching and connected inextricably after deep-drawing or punching with the base plate.
  • this document discloses the provision of corrosion protection measures in the field of superimposed sheets.
  • the provision of coated or galvanized steel sheets or the interposition of a plastic or metal foil or an adhesive layer see also DE 101 20 121 A1 ) called.
  • the joint forming the patched composite sheet Before the joint forming the patched composite sheet is heated to a temperature above the forming temperature of the material of the sheets, formed in the hot state into the desired shape and then held under mechanical fixation in the forming state in the closed Forming tool and / or fixing and cutting tool defined chilled.
  • the sheet forming processes discussed above provide either no hot working and thus high and partially differential stress on the thermoforming tool, or hot working, which, however, is cumbersome when applied in paste form due to the use of blanket brazing application. precise metering and positioning when sprayed on, sprinkled or applied in the form of chips or applied in the form of a solder foil is, where in such a prior accurate blank is required.
  • the provision of a pocket or a cavity for a glass intermediate element or a glass mat has the disadvantage that on the one hand such a cavity must be created, on the other hand, the glass mat, if it does not have the dimensions of the reinforcing plate, allows the penetration of moisture at their edges and thus corrosion of the sheets used.
  • the present invention is an object of the invention to provide a method for hot forming of sheets or boards, which does not have the disadvantages mentioned above and allows the production of moldings in lightweight construction with provided for a partial higher stress reinforcement, with respect to the above Technique for even more effective corrosion protection in conjunction with a secure connection of motherboard and reinforcement board (s) is to be made possible.
  • the object of a method of the type mentioned is achieved in that the motherboard and the at least one reinforcing board singulated after forming, provided with at least one connecting layer and are joined together again.
  • the object is achieved in that on the at least one reinforcing plate before the warm forging or hot forming a surface coating is applied to form a or as a bonding layer, wherein the surface coating melts during the hot or hot forming and a connection between the motherboard and which forms at least one reinforcing board.
  • a connecting layer between a molded motherboard and at least one reinforcing plate in the form of an adhesive and / or molten and solidified glass material is provided, which is the motherboard and the at least one reinforcing board or more Reinforcing reinforcing plates sealingly together, wherein the molded motherboard and the at least one molded reinforcing plate fit together to avoid gaps, and wherein the connecting layer of a sealing foam adhesive, a material film, in particular pressure-sensitive adhesive film, adhesive fiber composite mat, silicone, epoxy resin adhesive, polyurethane adhesive, hot melt adhesive, PUR Dispersion adhesive or sintered glass.
  • This provides a process for hot or hot forging sheet metal, particularly blanks, which combines the advantages of co-forming blanks to be joined and hot or hot forging with those of optimum sealing and blending of the molded blanks. Due to the Using a common hot or hot forming of motherboard and reinforcing board (s) a very good manufacturing accuracy and avoidance of gaps between the formed blanks can be achieved in combination with the advantage of an arbitrarily high degree of deformation, due to the use of a hot or hot forging in contrast for example, to cold forming such as deep drawing. As a result, in particular the press tools used can be spared, even when using almost any material thicknesses of boards and their combination with each other.
  • connection layer is arbitrary.
  • material film in particular pressure-sensitive adhesive film, mat, in particular adhesive fiber composite mat, etc.
  • the bonding layer is formed from a multicomponent adhesive whose components are applied to the surface of the motherboard and the at least one reinforcing board or surfaces of the reinforcing boards.
  • a connection of the surfaces of the boards only after their firm assembly.
  • the presence of heat for rapid curing usually proves to be advantageous, which is why the surfaces of the boards to be joined together can already be provided with the multi-component adhesive prior to complete cooling and joined together.
  • a surface coating for forming a connecting layer can be applied to the at least one reinforcing plate.
  • the surface coating is applied to the at least one reinforcing board prior to the hot or warm forming operation, whereby the surface coating melts during forming and forms a bond between the surface Motherboard and the at least one reinforcing board forms.
  • the reinforcing plate (s) is an optimal and uniform connection with the motherboard up to the edge of the reinforcing board approaching and possibly of individual reinforcing boards to each other possible. In this way, a full-surface connection of the boards can be achieved up to the edge region of the reinforcing board (s) even with very complex shapes.
  • An additional application of a sealant bead in the edge region of the at least one reinforcing plate is therefore no longer necessary, but may, if desired, nevertheless be provided.
  • the bonding layer in the form of a surface coating of the at least one reinforcing board may also prove to be advantageous as a surface coating applied to the singulated formed boards after hot or warm forming.
  • any adhesive and / or sealant for example an adhesive, such as a silicone, in particular epoxy resin adhesive, polyurethane adhesive, hot melt adhesive, PUR dispersion adhesive, etc., can be used as the coating material.
  • the coating can be done, for example, by rolling, dipping, printing, gumming, etc.
  • the tie layer may completely cover the surface of the reinforcing board (s). However, it can also be formed as a pattern or mask on the surface of the at least one reinforcing plate and / or the motherboard, in particular surrounding the edge region of the reinforcing board substantially gapless. Sometimes it is not absolutely necessary to cover the entire surface of the Reinforcement board (s) to be provided with the respective connection layer, since a compound of the molded boards is already supported by the shaping and sealing only in the edge region of the reinforcing board (s) for corrosion protection is appropriate. In the choice of the pattern or the mask, this (s) is advantageously matched to the forces acting on the finished molding during operation, so that unintentional release of the boards can be avoided from each other.
  • the connecting layer preferably consists of a glass material applied as coating on the motherboard and / or the at least one reinforcing plate and / or adhesive, which melts during the forming process and forms a firm connection between the motherboard and the reinforcing plate (s) during cooling.
  • a glass material applied as coating on the motherboard and / or the at least one reinforcing plate and / or adhesive, which melts during the forming process and forms a firm connection between the motherboard and the reinforcing plate (s) during cooling.
  • an adhesive coating Similar to an enamel layer, a firm connection between the adjacent board surfaces can occur during cooling. Corrosion protection is possible as well as a firm connection of the molded boards.
  • an adhesive can be used as the connecting layer. This can melt during the forming process, harden on cooling and form a firm connection between the motherboard and the at least one reinforcing board.
  • a connecting layer is provided between a shaped motherboard and at least one reinforcing board in the form of an adhesive and / or molten and solidified glass material, which connects the motherboard and the at least one reinforcing board and / or several reinforcing boards.
  • a reinforcing board is arranged on the motherboard and fixed and / or aligned by suitable means to this or several reinforcing boards next to and / or one above the other on the motherboard and fixed and / or aligned by suitable means to each other and / or to the motherboard.
  • Particularly preferred is provided with the provision of only one gain board on the motherboard and fixed and / or aligned by suitable means to this or providing multiple reinforcing boards these are overlapping and / or abutting each other in a partial area and / or spaced from each other on the motherboard fixed and / or aligned with each other by suitable means.
  • stud bolts or the like may be particularly preferably provided in the forming tool or the forming press.
  • the reinforcing boards are connected to each other abutting each other before the forming process, in particular by attaching a weld or other connecting seam.
  • this butt seam can be leveled during forming, so that no uneven transition points remain.
  • the blanks are preferably fixed to one another by means of additional connections prior to hot or warm forming and / or after semi-hot or hot forming, in particular by welding, riveting, clinching or another connection method.
  • additional connections prior to hot or warm forming and / or after semi-hot or hot forming, in particular by welding, riveting, clinching or another connection method.
  • the unique position of the reinforcing plate (s) applied selectively at certain locations on the surface of the motherboard is fixed so that it does not substantially change during the forming process.
  • a fixation proves to be advantageous in itself otherwise by shearing off possibly easily releasing connections between motherboard and reinforcement board (s), since especially an additional punctiform connection can counteract unwanted shearing.
  • FIG. 1 shows a first step of a hot forming process, in which first a flat flat motherboard 1 is provided with three flat and flat reinforcing boards 2, 3, 4 of smaller dimensions than that of the motherboard. This is also indicated by the arrows P.
  • the reinforcing boards 2, 3, 4 are fixed on the surface 10 of the motherboard by a number of joints, for example by six welds 5, whereby a composite board 6 is formed.
  • a fixation can also be made by riveting, clinching or any other connection method.
  • the number of joints depends on the sheet thickness of the boards as well as the extent of deformation.
  • the boards 1, 2, 3, 4 only aligned with each other without fixation by welding points or the like can be positioned on each other.
  • the reinforcing boards are arranged side by side and adjacent to each other on the motherboard. Their position and dimensions depend on the desired local stiffness to be achieved. They reinforcing boards can therefore each, for example, have different thicknesses and / or different thicknesses of the reinforcing boards, possibly also by joining several reinforcing boards, achieved.
  • the resulting composite board 6 is heated in an oven 7, as shown in FIG. 2 outlined.
  • the composite board is heated to a suitable temperature for hot forming, in particular to a temperature in Range of 950 ° C.
  • a half-warm forming can take place, for example, with temperatures in the range of less than 850 ° C, in particular 500 to 700 ° C, for example around 600 to 650 ° C.
  • the heated composite board is then passed into a forming press 8, as in FIG. 3 outlined.
  • the forming press the common hot or hot forming of the mutually fixed motherboard and reinforcing boards.
  • the composite board is tempered by a corresponding temperature control.
  • FIG. 4 The deformable composite plate in the form of a molded part which can be removed from the forming press 8 is shown in FIG FIG. 4 shown in perspective view.
  • the three reinforcing boards are fixed on the now formed to an inside of the molding surface 10 of the motherboard 1. Their position to each other has not changed during the forming process.
  • the molded blanks After separation of the molded blanks, they are provided on the mutually facing surfaces with a bonding layer 11, for example with an adhesive layer and / or a sealant, which preferably also allows bonding of the surfaces to one another.
  • the three reinforcement boards may be applied either on a common interconnect layer or on separate interconnect layers.
  • the molded reinforcing boards 2, 3, 4 are again molded onto the Motherboard 1 is fitted, wherein an at least adhesive connection between the surfaces of the boards is now achieved by the bonding layer.
  • the connecting layer preferably has such a thickness that the accuracy of fit of the jointly deformed boards is not endangered. In particular, it lays between the boards in such a way that an optimal substantially gap-free fit is ensured.
  • the attachment of the molded reinforcing boards 2, 3, 4 is in FIG. 6 indicated by arrows 9.
  • the reinforcing boards can already be interconnected, in particular prior to forming, to allow easy singulation and reassembly.
  • joints in the form of e.g. Welding points, rivets, etc. are provided.
  • this additional connection can also be omitted.
  • the shaped reinforcing boards serve e.g. as internal reinforcement, the molded motherboard as external reinforcement of a vehicle B-pillar.
  • FIG. 7 shows the first processing step of an alternative method for hot or hot forging of blanks.
  • the reinforcing boards 2, 3, 4 are initially provided with a surface coating 20, 30, 40.
  • This surface coating consists of a material which melts under the influence of heat and, at the latest when cooling the shaped blanks, adheres or adhesively bonds these with the molded blanks, in particular an adhesive.
  • a glass material such as a sintered glass, can be advantageously used.
  • the surface 10 of the motherboard and / or both the surface of the motherboard and the reinforcing boards can be provided with a surface coating, which also allows a connection with the reinforcing boards when heated, for example in the manner of a multi-component adhesive.
  • This resulting unit of a composite board 60 is subsequently introduced into a furnace 7, such as FIG. 8 can be seen.
  • the composite board is heated to a suitable for warm forging (or possibly hot forming) suitable temperature and forwarded to the forming press 8 ( FIG. 9 ).
  • the surface coating of the boards melts and bonds to the respective adjacent board surface. Therefore, a bonding layer 12 is formed directly during the forming, which allows a dense and firmly connected unit of the molded blanks.
  • the bonding layer 12 is cooled and thereby hardens. Any gaps between motherboard and reinforcing boards remaining or remaining during molding are filled by the bonding layer, thereby creating a dense corrosion prevention unit.
  • the bonding layer 12 is cooled and thereby hardens. Any gaps between motherboard and reinforcing boards remaining or remaining during molding are filled by the bonding layer, thereby creating a dense corrosion prevention unit.
  • Welding points even more or these may be again provided for additional connection of the molded boards to each other. In principle, however, it is already possible to ensure a sufficiently firm hold of the molded blanks on one another by the combination of the fixing connecting points applied before forming and the connecting layer.
  • the forming press 8, as in FIG. 9 is shown, a finished molded part can be removed, which can be used as a structural part in vehicle construction after a customarily subsequent to the forming cutting.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Body Structure For Vehicles (AREA)
  • Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)

Claims (16)

  1. Procédé de formage tempéré ou de formage à chaud, dans un outil de formage (8), de tôles se présentant notamment comme des platines (1, 2, 3, 4), procédé dans lequel une ou plusieurs platine(s) de renforcement (2, 3, 4) est (sont) placée(s) sur une platine de base (1), en vue du renforcement partiel ; la platine de base (1) et la platine de renforcement (2, 3, 4) prévue au minimum sont assujetties l'une à l'autre, et/ou orientées mutuellement à l'aide de moyens adéquats ; et ladite platine de base (1) et ladite platine de renforcement (2, 3, 4) prévue au minimum sont mises en forme conjointement,
    caractérisé par le fait que,
    à l'issue du formage, la platine de base (1) et la platine de renforcement (2, 3, 4) prévue au minimum sont pourvues, individuellement, d'au moins une couche de solidarisation (11), puis sont de nouveau assemblées.
  2. Procédé selon la revendication 1,
    caractérisé par le fait que,
    avant, pendant ou après l'opération de formage tempéré ou de formage à chaud, un adhésif, en particulier un adhésif à chaud, est déposé sur la platine de base et/ou sur la platine de renforcement prévue au minimum, notamment durant la phase de refroidissement des platines (1, 2, 3, 4) mises en forme, en particulier à l'intérieur de l'outil de formage.
  3. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait que
    la couche de solidarisation est constituée d'un adhésif à plusieurs composants, dont les composants sont déposés sur la surface (10) de la platine de base (1) et de la platine de renforcement (2, 3, 4) prévue au minimum, respectivement sur les surfaces des platines de renforcement (2, 3, 4).
  4. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait que
    la couche de solidarisation est déposée, sur la platine de renforcement (2, 3, 4) prévue au minimum, sous la forme d'un revêtement de surface (20, 30, 40) de cette dernière.
  5. Procédé de formage tempéré ou de formage à chaud, dans un outil de formage (8), de tôles se présentant notamment comme des platines (1, 2, 3, 4), procédé dans lequel une ou plusieurs platine(s) de renforcement (2, 3, 4) est (sont) placée(s) sur une platine de base (1), en vue du renforcement partiel ; la platine de base (1) et la platine de renforcement (2, 3, 4) prévue au minimum sont assujetties l'une à l'autre, et/ou orientées mutuellement à l'aide de moyens adéquats ; et ladite platine de base (1) et ladite platine de renforcement (2, 3, 4) prévue au minimum sont mises en forme conjointement,
    caractérisé par le fait que,
    préalablement à l'opération de formage tempéré ou de formage à chaud, un revêtement de surface (20, 30, 40) est déposé sur la platine de renforcement (2, 3, 4) prévue au minimum, afin de former une couche de solidarisation ou en tant que couche de ce type, sachant que ledit revêtement de surface fond au cours du formage tempéré ou formage à chaud, et instaure une liaison entre la platine de base (1) et la platine de renforcement (2, 3, 4) prévue au minimum.
  6. Procédé selon la revendication 4 ou 5,
    caractérisé par le fait que
    la couche de solidarisation est constituée d'un adhésif et/ou d'un matériau vitreux déposé(s), en tant que revêtement, sur la platine de base (1) et/ou sur la platine de renforcement (2, 3, 4) prévue au minimum.
  7. Procédé selon la revendication 6,
    caractérisé par le fait que
    le matériau vitreux est du verre fritté, et/ou l'adhésif est un adhésif approprié pour des températures élevées ou très élevées.
  8. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait que
    la couche de solidarisation est conçue sous la forme d'un motif ou d'un cache, sur la surface de la platine de renforcement (2, 3, 4) prévue au minimum et/ou de la platine de base (1), en entourant notamment la région marginale de ladite platine de renforcement.
  9. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait
    qu'une platine de renforcement est placée et consignée à demeure sur la platine de base (1), et/ou est orientée vis-à-vis de cette dernière à l'aide de moyens adéquats ; ou par le fait que plusieurs platines de renforcement (2, 3, 4) sont placées et consignées à demeure sur la platine de base (1), en juxtaposition et/ou en superposition, et/ou sont orientées, à l'aide de moyens adéquats, les unes vis-à-vis des autres et/ou vis-à-vis de ladite platine de base (1).
  10. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait
    qu'une platine de renforcement est placée et consignée à demeure sur la platine de base (1), et/ou est orientée vis-à-vis de cette dernière à l'aide de moyens adéquats ; ou par le fait que plusieurs platines de renforcement (2, 3, 4) sont consignées à demeure sur la platine de base (1) avec chevauchement réciproque dans une région partielle et/ou en butée mutuelle et/ou à distance les unes des autres, et/ou sont orientées vis-à-vis de ladite platine à l'aide de moyens adéquats.
  11. Procédé selon la revendication 10,
    caractérisé par le fait que
    plusieurs platines de renforcement sont reliées les unes aux autres en butée mutuelle, préalablement à l'opération de formage, en particulier par dépôt d'un cordon de soudure ou d'un autre joint de solidarisation.
  12. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait que
    la platine de base (1), et la (les) platine(s) de renforcement (2, 3, 4), présente(nt) des épaisseurs de matériau différentes.
  13. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait que,
    avant le formage tempéré ou le formage à chaud et/ou après le formage tempéré ou le formage à chaud, les platines (1, 2, 3, 4) sont assujetties les unes aux autres par des solidarisations additionnelles, notamment par soudage, par rivetage, par assemblage traversant ou par un autre procédé de liaison.
  14. Procédé selon l'une des revendications précédentes,
    caractérisé par le fait
    qu'un formage tempéré a lieu à des températures inférieures à 850°C, les platines étant notamment mises en forme à des températures comprises entre 500 et 730°C, en particulier entre 500 et 700°C, notamment entre 500 et 650°C.
  15. Pièce structurelle fabriquée selon un procédé conforme à l'une des revendications précédentes,
    sachant
    qu'une couche de solidarisation (12) est prévue entre une platine de base (1) mise en forme et au moins une platine de renforcement (2, 3, 4), sous la forme d'un adhésif et/ou d'un matériau vitreux fondu et solidifié qui relie mutuellement, de manière étanche, ladite platine de base (1) et ladite platine de renforcement (2, 3, 4) prévue au minimum, ou bien plusieurs platines de renforcement (2, 3, 4) ; sachant que la platine de base mise en forme, et la platine de renforcement mise en forme prévue au minimum, s'adaptent précisément l'une à l'autre en évitant des interstices ; et sachant que la couche de solidarisation est constituée par un adhésif moussant à effet d'étanchement, par une feuille de matière, notamment un feuil auto-adhésif, par une nappe composite fibreuse adhérente, par du silicone, par un adhésif à la résine époxyde, par un adhésif au polyuréthane, par un adhésif agissant par fusion, par un adhésif à dispersion de polyuréthane, ou par du verre fritté.
  16. Pièce structurelle selon la revendication 15,
    caractérisée par le fait que
    les platines de renforcement ou la platine de renforcement (2, 3, 4) prévue au minimum, et la platine de base (1), présente(nt) des épaisseurs de matériau différentes.
EP04801928.5A 2003-08-25 2004-08-23 Procede de formage de toles Expired - Lifetime EP1658148B2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10339350A DE10339350B4 (de) 2003-08-25 2003-08-25 Verfahren zum Halbwarm-oder Warmumformen von Blechen
PCT/EP2004/009389 WO2005021177A1 (fr) 2003-08-25 2004-08-23 Procede de formage de toles

Publications (3)

Publication Number Publication Date
EP1658148A1 EP1658148A1 (fr) 2006-05-24
EP1658148B1 true EP1658148B1 (fr) 2008-09-10
EP1658148B2 EP1658148B2 (fr) 2015-10-28

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ID=34258235

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04801928.5A Expired - Lifetime EP1658148B2 (fr) 2003-08-25 2004-08-23 Procede de formage de toles

Country Status (3)

Country Link
EP (1) EP1658148B2 (fr)
DE (2) DE10339350B4 (fr)
WO (1) WO2005021177A1 (fr)

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DE102006049014B4 (de) * 2006-10-13 2019-07-11 Thyssenkrupp Steel Europe Ag Verbundblech mit hohem Energieabsorptionsvermögen, Verfahren zu dessen Herstellung und Bauteil
WO2008055570A1 (fr) * 2006-11-07 2008-05-15 Thyssenkrupp Drauz Nothelfer Gmbh Procédé et installation de fabrication de flans de tôle renforcés
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DE10339350A1 (de) 2005-04-07
DE502004008042D1 (de) 2008-10-23
WO2005021177A1 (fr) 2005-03-10
EP1658148A1 (fr) 2006-05-24
EP1658148B2 (fr) 2015-10-28

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