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EP0914362A1 - Modifiziertes epoxysiloxan-kondensat, verfahren zu dessen herstellung und dessen einsatz als low-stress-giessharz für die elektronik und die elektrotechnik - Google Patents

Modifiziertes epoxysiloxan-kondensat, verfahren zu dessen herstellung und dessen einsatz als low-stress-giessharz für die elektronik und die elektrotechnik

Info

Publication number
EP0914362A1
EP0914362A1 EP97932704A EP97932704A EP0914362A1 EP 0914362 A1 EP0914362 A1 EP 0914362A1 EP 97932704 A EP97932704 A EP 97932704A EP 97932704 A EP97932704 A EP 97932704A EP 0914362 A1 EP0914362 A1 EP 0914362A1
Authority
EP
European Patent Office
Prior art keywords
condensation
epoxysiloxane
condensate
silanol
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97932704A
Other languages
German (de)
English (en)
French (fr)
Inventor
Klaus Höhn
Ernst Wipfelder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP0914362A1 publication Critical patent/EP0914362A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

Definitions

  • Modified epoxy siloxane condensate process for its production and its use as a low-stress casting resin for electronics and electrical engineering
  • the invention relates to an epoxysiloxane condensate which is modified by an in-situ reaction with an organic compound, preferably a difunctional or multifunctional compound.
  • P 43 28 465 discloses a process for the preparation of epoxysiloxane condensates, in which epoxysiloxanes are obtained by condensation of epoxy-functional alkoxysiloxanes with silanols.
  • epoxysiloxane condensates can either be used directly as casting resins or for mixing with epoxy resins for electronics applications.
  • the cast resin systems with epoxy-containing siloxanes are also suitable for the production of temperature-stable and thermomechanically resilient molded materials.
  • the epoxysiloxane condensates have a general structure which can be derived from the epoxyalkoxysilanes used and the silanols used and from chemical analyzes.
  • the object of the present invention is therefore to provide a method for modifying epoxysiloxane condensates and modified epoxysiloxane condensates in which the chemical-functional structure of the products can be adjusted within wide limits.
  • General knowledge of the invention is that in the alkoxy-silanol condensation the ratio of reactive silanol groups to the alkoxy groups of the epoxy-functional siloxane can be adjusted within wide limits such that not all alkoxy groups are consumed by silanols.
  • alkoxy groups which are still free after the reaction with the silanols, can be reacted with organic compounds which are as multifunctional as possible in a further condensation step.
  • the physico-chemical properties of the casting resins can be influenced in a targeted manner by incorporating various organic compounds.
  • the possibly contained further functionalities of the organic compounds serve as additional connecting points for the siloxane casting resins obtained in the epoxy resin crosslinking.
  • the epoxysiloxanes can be built into the epoxy resin network even more firmly.
  • the invention relates to a modified epoxysiloxane condensate, obtainable by the following condensation steps
  • R 1 represents an alkyl radical with 1 to 22 C atoms or an aryl radical
  • R 2 is a glycidyloxyalkyl, epoxyalkyl or an epoxycycloalkyl radical, the two radicals
  • R 3 independently of one another represent OR or R or a further alkyl or aryl radical
  • R 4 represents alkyl or aryl
  • R 5 are independently OH or R 4 and n is an integer greater than 1
  • the present invention furthermore relates to a process for modifying epoxysiloxanes, in which in a first condensation step a) an epoxysiloxane 1 is condensed with a silanol 2, 1 and 2 being the compounds indicated above, and after reaction of the silanol 2 in a further condensation step
  • the alkoxy group-containing epoxysiloxane condenser thus obtained is condensed in situ with an organic compound having a linear, branched or cyclic and optionally aromatic carbon backbone of 1 to 24 carbon atoms.
  • the present invention also relates to the use of the epoxysiloxane condensate modified according to the invention for blending with common epoxy resins.
  • the point in time at which the mixing with the epoxy resin takes place can be arbitrarily within, before and after the reaction sequence, a) condensation of 1 with 2, then b) condensation of the alkoxy group-containing epoxysiloxane condensate obtained with an organic, optionally di- or multifunctional, Connection.
  • the process according to the invention can be carried out in a simple one-pot reaction under normal conditions with regard to atmosphere and pressure and therefore with a minimal outlay on the process in a short time.
  • the first product obtained is a mixture of different siloxanes, which are the condensate of epoxyalkoxysilane 1 with silanol 2.
  • an Si-O-Si bond is formed from the alkoxy group of the epoxysilane and the OH group of the silanol with elimination of the corresponding alkyl alcohol.
  • the compound containing this Si-O-Si bond is called an epoxysiloxane condensate. Since not all available alkoxy groups of 1 in the first condensation step are used, they serve as reaction centers for the second condensation step.
  • the second reaction step is carried out in situ in the one-pot reaction from 1 and 2 with a condensable, optionally di- or polyfunctional, organic compound with a linear, branched or cyclic and optionally aromatic carbon backbone of 1 to 24 carbon atoms and as a functional one Groups hydroxyl, epoxy, ester, lactone, lactam, halogen and / or pseudohalogen functions and / or unsaturated CC bonds as well as spiro and / or bicycloorthoester and / or spirocarbonate groups are reacted.
  • This is preferred second process step is only carried out when the silanol used for the first process step has been used up as completely as possible. For this purpose it can be advantageous to use the silanol in a deficit for the first condensation step.
  • the epoxyalkoxysilane 1 used as the starting compound carries 1 to 3 condensable alkoxy groups (OR and R 3 ).
  • the radical R 1 is arbitrary, but is preferably an alkyl radical having 1 to 8 carbon atoms, since the reactivity of the group to be split off during the condensation decreases with increasing chain length of the alkyl radical.
  • the most reactive starting compounds are therefore the epoxymethoxysilanes. Because of the toxicological harmlessness of the split-off ethyl alcohol, ethyl can also be preferred as the alkyl group.
  • the shorter-chain alkyl radicals in which the alcohols or cleavage products resulting therefrom have a relatively lower boiling point and are therefore easier to separate off are preferred.
  • silanols 2 are more readily available which have OH groups in the ⁇ -position, ⁇ - and ⁇ u-position or in the chain as reactive groups.
  • the further organic group R 4 bound via SiC is not critical with regard to its selection and can be any alkyl or aryl radical.
  • the index "n" which determines the number of siloxane units in the silanol 2
  • n can represent any number greater than 1, preferably between 1 and 100.
  • n for reasons of incompatibility, homogeneous reactions cannot be carried out and the reaction rate increases even with increased Temperatures clearly decrease, so that advantageously n is chosen between 1 and 12.
  • n is chosen between 1 and 12.
  • R of the starting compound 1 containing epoxy or glycidyloxyalkyl groups is bonded to silicon via a carbon atom and is otherwise freely selectable.
  • R can be a glycidyloxyalkyl, an epoxyalkyl, glycidyloxyaryl, epoxyaryl or an epoxycycloalkyl group.
  • the corresponding glycidyloxy compounds which are obtained by condensation of correspondingly reactive compounds with epichlorohydrin are readily available.
  • a condensation catalyst may be required to support the condensation.
  • the condensation itself there are no restrictions for the catalyst, so that any biger condensation catalyst is suitable.
  • the catalyst is selected so that the epoxy group is preserved as much as possible during the condensation.
  • a catalyst that is ideal in this regard therefore reacts neither very basic nor very acidic, ideally neutral.
  • the optionally difunctional or multifunctional organic compound is added in a stoichiometric amount with respect to the alkoxy functions still present.
  • the liberation of a generally volatile alkoxy alcohol in the case of a methoxy compound, for example methanol, can be observed.
  • the condensation of the starting materials with the epoxysiloxane condensate can take place as a solution in suitable solvents, for example in hydrocarbons and / or in aromatic hydrocarbons and ethers or the like.
  • the epoxy resins intended for mixing can also be diluted. It is also possible to carry out the condensation as a bulk reaction without solvent. In order to obtain only clear and transparent products, the condensation is catalyzed and carried out as a bulk reaction.
  • condensation can take place in an open reaction vessel and is carried out with an increase in temperature.
  • Preferred condensation temperatures are between 80 and 150 ° C.
  • Volatile reaction products are preferably driven off, for example by blowing in or passing an inert gas (for example nitrogen).
  • an inert gas for example nitrogen.
  • the composition of the modified epoxysiloxane condensate obtainable by the process depends first of all on the reaction conditions and on the stochiometry of the batches.
  • the silanol functions are added in a deficit, so that it is ensured that, after the first condensation step, free alkoxy functions are available for the second condensation step.
  • the deficit is to be dimensioned such that at least one alkoxy function of the epoxysilane 1 is consumed in the condensation step.
  • the condensation product formed in the first stage is, as is known from the prior art, a colorless, transparent oil.
  • the organic, optionally di- or multifunctional compound is now added stoichiometrically, i. H. for each remaining alkoxy function on the expoxysiloxane condensate, exactly one condensable function of the organic compound is expected.
  • a transesterification then takes place, so that the organic compound is bound to the epoxysiloxane condensate via the oxygen and possibly also has a further free functional group.
  • the modified epoxy-siloxane condensate according to the invention therefore has further functional groups and can be described as “more functional”.
  • the still free functional groups serve primarily for mixing the product to achieve a more intensive chemical fixation of the condensate in the epoxy resin network during crosslinking with further, common reaction resins and to influence later properties of the molding material in a targeted manner.
  • the epoxysiloxane condensates preferably described can be mixed with practically any common reaction resin or epoxy resin in almost any mixing ratio.
  • new reaction resin mixtures can be obtained with aliphatic and aromatic glycidyl ethers, in particular based on bisphenol A and F, with corresponding glycidyl esters, aliphatic and cycloaliphatic epoxides, or with any other epoxides obtained, for example, by epoxidation of unsaturated compounds.
  • the storage stability of the reaction resin mixture with the new epoxysiloxane can be further increased by heating the epoxysilanes in an applied vacuum.
  • the structure and the chemical-physical behavior of the epoxy resins obtained can be adjusted within wide limits by the choice of the organic, possibly difunctional or multifunctional, compound. Likewise, the phase separation behavior during curing by the organic compound with unchanged siloxane content or unchanged siloxane component can be adjusted. With that, the
  • Morphology the modulus of elasticity, the coefficient of thermal expansion ⁇ and the mechanical relaxation behavior of the end influence molding materials or bodies obtained in the production chain.
  • the morphology determines the mechanical behavior of a molding material and is the determining factor for the low
  • Morphology means the microstructure formed during curing from an epoxy resin matrix and embedded, chemically fixed, ⁇ iloxane-rich domains. In addition to finely divided siloxane domains, the siloxanes can separate out as a second phase, resulting in multi-phase, cloudy moldings.
  • epoxysiloxane condensate or "epoxysiloxanes” are the epoxysiloxanes of the prior art known to date, in particular those disclosed in P 43 28 465.5, which corresponds to US Pat. No. 5,492,981, an alkyl alcohol being free in the condensation reaction
  • the disclosure content of the above-mentioned patent US Pat. No. 5,492,981 is hereby incorporated by reference and is made the subject of the present description.
  • Condensable and / or “di or multifunctional” compounds are used as the organic compound with which the condensation is carried out in the second process step b).
  • Condensable means that the compound is a hydroxy or halogen group for condensation or
  • Di- or multifunctional here means that in addition to this / these hydroxy or halogen functions with which the modified epoxysiloxane condensate is formed, the organic compounds still have other reactive groups, such as, for example, hydroxy, epoxy, ester, lactone, Lactam, halogen and / or pseudohalogen functions and / or unsaturated CC bonds as well as spiro and / or bicycloorthoester and / or spirocarbonate groups for further functionalization of the resulting condensation product.
  • the modified siloxane condensate described here is chemically incorporated into the epoxy resin network via additional functionalities. This fixes the siloxane even more firmly in the duromer matrix and improves the hydrolysis behavior, water absorption, thermal behavior and the evaporation behavior of the For substances.
  • the mechanical behavior (modulus of elasticity, glass transition temperature) with regard to the low-stress problem can be favorably adapted to the technical requirements via the additionally inserted organic intermediate elements.
  • the epoxysiloxane molding materials obtained have increased bond strength on carrier substances such as V2A steel.
  • the diol compounds were 1,4-butanediol (Merck), 1,6-hexanediol (Merck), 1,4-bis (dimenthanol) cyclohexane (Merck), TCD alcohol DM
  • the condensates were further processed to give a 1: 1 casting resin using cycloaliphatic CY17 (3, 4-epoxy-cyclo-hexylmethyl-3 ', 4' -epoxy-cyclo-hexane carboxylate, Ciba-Geigy).
  • the siloxane condensates were processed to a homogeneous 1: 1 casting resin at 120 ° C.
  • the resins were degassed at 0.5 torr for 10 min and annealed at 120 ° C. for 30 min (Table 2).
  • Table 2 Selected parameters of the 1: 1 casting resins with CY179.
  • condensation synthesis concept with subsequent transesterification offers a broad development potential.
  • the physico-chemical properties, the morphology and the stress behavior of the molding materials obtained can be varied within wide limits.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP97932704A 1996-07-26 1997-06-23 Modifiziertes epoxysiloxan-kondensat, verfahren zu dessen herstellung und dessen einsatz als low-stress-giessharz für die elektronik und die elektrotechnik Withdrawn EP0914362A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19630319 1996-07-26
DE19630319A DE19630319C1 (de) 1996-07-26 1996-07-26 Modifiziertes Epoxysiloxan Kondensat, Verfahren zu dessen Herstellung und dessen Einsatz als Low-Stress-Gießharz für die Elektronik und Elektrotechnik
PCT/DE1997/001303 WO1998004609A1 (de) 1996-07-26 1997-06-23 Modifiziertes epoxysiloxan-kondensat, verfahren zu dessen herstellung und dessen einsatz als low-stress-giessharz für die elektronik und die elektrotechnik

Publications (1)

Publication Number Publication Date
EP0914362A1 true EP0914362A1 (de) 1999-05-12

Family

ID=7801016

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97932704A Withdrawn EP0914362A1 (de) 1996-07-26 1997-06-23 Modifiziertes epoxysiloxan-kondensat, verfahren zu dessen herstellung und dessen einsatz als low-stress-giessharz für die elektronik und die elektrotechnik

Country Status (7)

Country Link
US (1) US6248854B1 (ja)
EP (1) EP0914362A1 (ja)
JP (1) JP3266275B2 (ja)
CN (1) CN1226263A (ja)
DE (1) DE19630319C1 (ja)
TW (1) TW494112B (ja)
WO (1) WO1998004609A1 (ja)

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US6818721B2 (en) * 2002-12-02 2004-11-16 Rpo Pty Ltd. Process for producing polysiloxanes and use of the same
EP1601733A1 (en) * 2003-07-22 2005-12-07 Leibniz-Institut für Neue Materialien gemeinnützige GmbH Liquid-repellent coating composition and coating having high alkali resistance
ATE411367T1 (de) * 2003-07-22 2008-10-15 Leibniz Inst Neue Materialien Flüssigkeitsabweisende, alkali-beständige beschichtungszusammensetzung und beschichtungsmuster.
JPWO2005040245A1 (ja) * 2003-10-24 2007-11-22 日本化薬株式会社 感光性樹脂組成物及びその硬化皮膜を有するフィルム
KR100614976B1 (ko) * 2004-04-12 2006-08-25 한국과학기술원 광소자 또는 디스플레이에 이용되는 무기/유기혼성올리고머, 나노혼성고분자 및 그 제조방법
DE102005002960A1 (de) 2005-01-21 2006-08-03 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Kompositzusammensetzung für mikrogemusterte Schichten mit hohem Relaxationsvermögen, hoher chemischer Beständigkeit und mechanischer Stabilität
DE102006033280A1 (de) 2006-07-18 2008-01-24 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Kompositzusammensetzung für mikrostrukturierte Schichten
US20080255318A1 (en) * 2006-11-21 2008-10-16 Momentive Performance Materials Inc. Organosilicone compositions and methods for preparing them
JP5328442B2 (ja) * 2009-03-27 2013-10-30 旭化成ケミカルズ株式会社 絶縁性樹脂組成物、それを用いた半導体装置及び絶縁性樹脂組成物の製造方法
CN102782014A (zh) * 2010-03-02 2012-11-14 日本化药株式会社 有机聚硅氧烷的制造方法、通过该制造方法得到的有机聚硅氧烷、含有该有机聚硅氧烷的组合物
DE102012202161A1 (de) 2012-02-14 2013-08-14 Elantas Gmbh Elektroisolierharz auf Basis von Isohexiddioldiglycidethern
KR102146668B1 (ko) * 2017-05-31 2020-08-21 코오롱인더스트리 주식회사 코팅용 수지 조성물 및 이의 경화물을 코팅층으로 포함하는 코팅필름

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Also Published As

Publication number Publication date
JP3266275B2 (ja) 2002-03-18
US6248854B1 (en) 2001-06-19
CN1226263A (zh) 1999-08-18
TW494112B (en) 2002-07-11
WO1998004609A1 (de) 1998-02-05
JP2000500811A (ja) 2000-01-25
DE19630319C1 (de) 1998-04-23

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