DK252987A - Bad til galvanisk forgyldning - Google Patents
Bad til galvanisk forgyldningInfo
- Publication number
- DK252987A DK252987A DK252987A DK252987A DK252987A DK 252987 A DK252987 A DK 252987A DK 252987 A DK252987 A DK 252987A DK 252987 A DK252987 A DK 252987A DK 252987 A DK252987 A DK 252987A
- Authority
- DK
- Denmark
- Prior art keywords
- bathroom
- gold
- acrylic acid
- gilding
- galvanic
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- VUVORVXMOLQFMO-ONEGZZNKSA-N (e)-3-pyridin-3-ylprop-2-enoic acid Chemical compound OC(=O)\C=C\C1=CC=CN=C1 VUVORVXMOLQFMO-ONEGZZNKSA-N 0.000 abstract 1
- YBIWIEFOLKWDNV-UHFFFAOYSA-N 3-quinolin-3-ylprop-2-enoic acid Chemical compound C1=CC=CC2=CC(C=CC(=O)O)=CN=C21 YBIWIEFOLKWDNV-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 150000002505 iron Chemical class 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Building Environments (AREA)
- Residential Or Office Buildings (AREA)
- Electrolytic Production Of Metals (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8612361 | 1986-05-21 | ||
| GB868612361A GB8612361D0 (en) | 1986-05-21 | 1986-05-21 | Gold electroplating bath |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DK252987D0 DK252987D0 (da) | 1987-05-19 |
| DK252987A true DK252987A (da) | 1987-11-22 |
| DK168303B1 DK168303B1 (da) | 1994-03-07 |
Family
ID=10598205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK252987A DK168303B1 (da) | 1986-05-21 | 1987-05-19 | Guldelektropletteringsbad og fremgangsmåde til elektroplettering |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US4767507A (da) |
| EP (1) | EP0246869B1 (da) |
| JP (1) | JPS62287094A (da) |
| KR (1) | KR870011277A (da) |
| AT (1) | ATE68835T1 (da) |
| DE (1) | DE3773990D1 (da) |
| DK (1) | DK168303B1 (da) |
| ES (1) | ES2026910T3 (da) |
| FI (1) | FI872065A7 (da) |
| GB (1) | GB8612361D0 (da) |
| GR (1) | GR3002980T3 (da) |
| HK (1) | HK58592A (da) |
| NO (1) | NO872114L (da) |
| SG (1) | SG16192G (da) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5039381A (en) * | 1989-05-25 | 1991-08-13 | Mullarkey Edward J | Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like |
| JP2779207B2 (ja) * | 1989-06-06 | 1998-07-23 | 富士通株式会社 | 半導体装置の製造方法 |
| US6417366B2 (en) | 1999-06-24 | 2002-07-09 | Abbott Laboratories | Preparation of quinoline-substituted carbonate and carbamate derivatives |
| FR2807450B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages |
| FR2807422B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages |
| FR2828889B1 (fr) * | 2001-08-24 | 2004-05-07 | Engelhard Clal Sas | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages |
| US7279086B2 (en) * | 2003-05-21 | 2007-10-09 | Technic, Inc. | Electroplating solution for alloys of gold with tin |
| JP5116956B2 (ja) * | 2005-07-14 | 2013-01-09 | 関東化学株式会社 | 無電解硬質金めっき液 |
| JP4868116B2 (ja) * | 2005-09-30 | 2012-02-01 | 学校法人早稲田大学 | 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法 |
| JP5317433B2 (ja) * | 2007-06-06 | 2013-10-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 酸性金合金めっき液 |
| JP5854727B2 (ja) | 2010-09-21 | 2016-02-09 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | シアン化物を含まない銀電気めっき液 |
| EP2990507A1 (en) * | 2014-08-25 | 2016-03-02 | ATOTECH Deutschland GmbH | Composition, use thereof and method for electrodepositing gold containing layers |
| DE102016211594A1 (de) * | 2016-06-28 | 2017-12-28 | Voith Patent Gmbh | Elektrokontakt-Kupplung |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH455434A (de) * | 1963-08-15 | 1968-07-15 | Werner Fluehmann Galvanische A | Verfahren zur Herstellung von Weissgoldüberzügen |
| DE2237807C3 (de) * | 1972-08-01 | 1978-04-27 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verfahren zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten |
| DE2355581C3 (de) * | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit |
| US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
| GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
-
1986
- 1986-05-21 GB GB868612361A patent/GB8612361D0/en active Pending
-
1987
- 1987-05-11 FI FI872065A patent/FI872065A7/fi not_active Application Discontinuation
- 1987-05-19 EP EP87304445A patent/EP0246869B1/en not_active Expired - Lifetime
- 1987-05-19 ES ES198787304445T patent/ES2026910T3/es not_active Expired - Lifetime
- 1987-05-19 DE DE8787304445T patent/DE3773990D1/de not_active Expired - Lifetime
- 1987-05-19 DK DK252987A patent/DK168303B1/da active IP Right Grant
- 1987-05-19 AT AT87304445T patent/ATE68835T1/de not_active IP Right Cessation
- 1987-05-20 KR KR870004986A patent/KR870011277A/ko not_active Withdrawn
- 1987-05-20 JP JP62121429A patent/JPS62287094A/ja active Pending
- 1987-05-20 NO NO872114A patent/NO872114L/no unknown
-
1988
- 1988-01-11 US US07/144,607 patent/US4767507A/en not_active Expired - Lifetime
-
1991
- 1991-10-24 GR GR91400797T patent/GR3002980T3/el unknown
-
1992
- 1992-02-19 SG SG161/92A patent/SG16192G/en unknown
- 1992-08-06 HK HK585/92A patent/HK58592A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| FI872065L (fi) | 1987-11-22 |
| FI872065A7 (fi) | 1987-11-22 |
| EP0246869B1 (en) | 1991-10-23 |
| GB8612361D0 (en) | 1986-06-25 |
| FI872065A0 (fi) | 1987-05-11 |
| HK58592A (en) | 1992-08-14 |
| DK252987D0 (da) | 1987-05-19 |
| KR870011277A (ko) | 1987-12-22 |
| SG16192G (en) | 1992-04-16 |
| ES2026910T3 (es) | 1992-05-16 |
| US4767507A (en) | 1988-08-30 |
| ATE68835T1 (de) | 1991-11-15 |
| EP0246869A1 (en) | 1987-11-25 |
| DE3773990D1 (de) | 1991-11-28 |
| NO872114D0 (no) | 1987-05-20 |
| DK168303B1 (da) | 1994-03-07 |
| JPS62287094A (ja) | 1987-12-12 |
| NO872114L (no) | 1987-11-23 |
| GR3002980T3 (en) | 1993-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B1 | Patent granted (law 1993) |