DE69132324D1 - Methode zum Transportieren von Substraten mit plattenförmiger Grundlage - Google Patents

Methode zum Transportieren von Substraten mit plattenförmiger Grundlage

Info

Publication number: DE69132324D1
Authority: DE; Germany
Prior art keywords: plate; shaped base; transporting substrates; transporting; substrates
Prior art date: 1990-11-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69132324T

Other languages

English (en)

Other versions

DE69132324T2 (de

Inventor

Masayuki Toda

Takashi Onoda

Tadahiro Ohmi

Masaru Umeda

Yoichi Kanno

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

WATANABE SHOKO TOKIO TOKYO KK

Original Assignee

WATANABE SHOKO TOKIO TOKYO KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-11-16

Filing date

1991-10-28

Publication date

2000-08-17

1991-10-28 Application filed by WATANABE SHOKO TOKIO TOKYO KK filed Critical WATANABE SHOKO TOKIO TOKYO KK

2000-08-17 Application granted granted Critical

2000-08-17 Publication of DE69132324D1 publication Critical patent/DE69132324D1/de

2001-01-04 Publication of DE69132324T2 publication Critical patent/DE69132324T2/de

2011-10-29 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10P72/3602—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
- H10P72/36—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Fluid Mechanics (AREA)
Mechanical Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

DE69132324T 1990-11-16 1991-10-28 Methode zum Transportieren von Substraten mit plattenförmiger Grundlage Expired - Fee Related DE69132324T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP30887190		1990-11-16

Publications (2)

Publication Number	Publication Date
DE69132324D1 true DE69132324D1 (de)	2000-08-17
DE69132324T2 DE69132324T2 (de)	2001-01-04

Family

ID=17986266

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
DE69132324T Expired - Fee Related DE69132324T2 (de)	1990-11-16	1991-10-28	Methode zum Transportieren von Substraten mit plattenförmiger Grundlage
DE69127372T Expired - Fee Related DE69127372T2 (de)	1990-11-16	1991-10-28	Anordnung zum transportieren von substraten in form dünner plättchen

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
DE69127372T Expired - Fee Related DE69127372T2 (de)	1990-11-16	1991-10-28	Anordnung zum transportieren von substraten in form dünner plättchen

Country Status (4)

Country	Link
US (2)	US5518360A (de)
EP (2)	EP0747931B1 (de)
DE (2)	DE69132324T2 (de)
WO (1)	WO1992009103A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE69132324T2 (de) *	1990-11-16	2001-01-04	Kabushiki Kaisha Watanabe Shoko, Tokio/Tokyo	Methode zum Transportieren von Substraten mit plattenförmiger Grundlage
EP0792090B1 (de) *	1992-08-14	2004-07-21	Takasago Netsugaku Kogyo Kabushiki Kaisha	Verfahren und Vorrichtung zur Erzeugung von gasförmigen Ionen unter Verwendung von Röntgenstrahlen
JP3137989B2 (ja) *	1995-12-28	2001-02-26	日本酸素株式会社	薄板状基体の搬送方法および搬送装置
JP3901265B2 (ja) *	1996-11-26	2007-04-04	大陽日酸株式会社	薄板状基体の搬送方法及び搬送装置
USD406113S (en) *	1997-01-31	1999-02-23	Tokyo Electron Limited	Processing tube for use in a semiconductor wafer heat processing apparatus
USD405429S (en)	1997-01-31	1999-02-09	Tokyo Electron Limited	Processing tube for use in a semiconductor wafer heat processing apparatus
JP3298810B2 (ja) *	1997-07-09	2002-07-08	株式会社新川	ダイボンディング装置
USD405431S (en)	1997-08-20	1999-02-09	Tokyo Electron Ltd.	Tube for use in a semiconductor wafer heat processing apparatus
USD404368S (en)	1997-08-20	1999-01-19	Tokyo Electron Limited	Outer tube for use in a semiconductor wafer heat processing apparatus
USD405062S (en) *	1997-08-20	1999-02-02	Tokyo Electron Ltd.	Processing tube for use in a semiconductor wafer heat processing apparatus
RU2131155C1 (ru) *	1997-12-15	1999-05-27	Воронежская государственная технологическая академия	Устройство для ориентации пластин
JP2002054634A (ja) *	2000-08-07	2002-02-20	Nippon Steel Corp	静圧気体軸受
US6676365B2 (en) *	2001-03-16	2004-01-13	Toda Kogyo Corporation	Air track conveyor system for disk production
DE10145686B4 (de) *	2001-09-15	2006-04-06	Schott Ag	Vorrichtung zum berührungslosen Fördern eines Gegenstandes aus Glas oder Glaskeramik
DE60318898T2 (de) *	2002-12-18	2009-01-22	Koninklijke Philips Electronics N.V.	Gaslagersystem
KR100956348B1 (ko) *	2003-09-05	2010-05-06	삼성전자주식회사	인라인 반송 시스템
US6905300B1 (en) *	2004-01-16	2005-06-14	Dmetrix, Inc.	Slide feeder with air bearing conveyor
JP5291281B2 (ja) *	2004-06-28	2013-09-18	株式会社渡辺商行	浮上搬送装置及び浮上搬送方法
DE102004057754B4 (de) *	2004-11-30	2007-08-09	Steag Hama Tech Ag	Verfahren und Vorrichtung zum Behandeln von ein Innenloch aufweisenden Substratscheiben
US7080962B1 (en) *	2005-05-31	2006-07-25	Kimberly-Clark Worldwide, Inc.	Air conveyance apparatus
JP4755498B2 (ja) *	2006-01-06	2011-08-24	東京エレクトロン株式会社	加熱装置及び加熱方法
CN101769336B (zh) *	2009-01-05	2013-02-13	鸿富锦精密工业（深圳）有限公司	空气导轨
JP2012521095A (ja) *	2009-03-16	2012-09-10	アルタデバイセズ，インコーポレイテッド	加熱ランプシステム及びその方法
JP4919115B2 (ja) *	2009-09-24	2012-04-18	横河電機株式会社	放射線検査装置
US8834073B2 (en) *	2010-10-29	2014-09-16	Corning Incorporated	Transport apparatus having a measuring system and methods therefor
CN103381965B (zh) *	2013-07-02	2016-02-03	深圳市华星光电技术有限公司	一种液晶面板的气浮式导向轮传送装置
KR101839345B1 (ko) *	2016-10-27	2018-03-16	세메스 주식회사	기판 플로팅 장치 및 기판 플로팅 방법
US9889995B1 (en) *	2017-03-15	2018-02-13	Core Flow Ltd.	Noncontact support platform with blockage detection

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3797889A (en) *	1971-12-30	1974-03-19	Texas Instruments Inc	Workpiece alignment system
US3923342A (en) *	1974-06-10	1975-12-02	Motorola Inc	Apparatus and method for handling frangible objects
US4081201A (en) *	1976-12-27	1978-03-28	International Business Machines Corporation	Wafer air film transportation system
US4618292A (en) *	1977-02-28	1986-10-21	International Business Machines Corporation	Controls for semiconductor wafer orientor
US4165132A (en) *	1977-02-28	1979-08-21	International Business Machines Corporation	Pneumatic control of the motion of objects suspended on an air film
JPS5538828A (en) *	1978-09-13	1980-03-18	Ajinomoto Co Inc	Stabilized halogen-containing resin composition
US4242038A (en) *	1979-06-29	1980-12-30	International Business Machines Corporation	Wafer orienting apparatus
NL8103979A (nl) *	1981-08-26	1983-03-16	Bok Edward	Methode en inrichting voor het aanbrengen van een film vloeibaar medium op een substraat.
JPS594022A (ja) *	1982-06-30	1984-01-10	Fujitsu Ltd	スピンエアベアリング
US4540326A (en) *	1982-09-17	1985-09-10	Nacom Industries, Inc.	Semiconductor wafer transport system
JPS59215718A (ja) *	1983-05-23	1984-12-05	Kokusai Electric Co Ltd	半導体基板の赤外線熱処理装置
JPS6015318A (ja) *	1983-07-08	1985-01-26	Hitachi Ltd	半導体ウェハの搬送装置
US4624617A (en) *	1984-10-09	1986-11-25	David Belna	Linear induction semiconductor wafer transportation apparatus
KR900001666B1 (ko) *	1985-07-19	1990-03-17	후지쓰가부시끼가이샤	화합물 반도체의 에피택셜층 성장용의 화학적 유기 금속 기상 성장장치
DE3923405A1 (de) *	1989-07-14	1991-01-24	Wacker Chemitronic	Vorrichtung zum transportieren und positionieren von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, und verfahren zur nasschemischen oberflaechenbehandlung derselben
DE69132324T2 (de) *	1990-11-16	2001-01-04	Kabushiki Kaisha Watanabe Shoko, Tokio/Tokyo	Methode zum Transportieren von Substraten mit plattenförmiger Grundlage
JPH0812847B2 (ja) *	1991-04-22	1996-02-07	株式会社半導体プロセス研究所	半導体製造装置及び半導体装置の製造方法
JP3330166B2 (ja) *	1992-12-04	2002-09-30	東京エレクトロン株式会社	処理装置

1991
- 1991-10-28 DE DE69132324T patent/DE69132324T2/de not_active Expired - Fee Related
- 1991-10-28 WO PCT/JP1991/001469 patent/WO1992009103A1/ja not_active Ceased
- 1991-10-28 US US08/050,462 patent/US5518360A/en not_active Expired - Lifetime
- 1991-10-28 DE DE69127372T patent/DE69127372T2/de not_active Expired - Fee Related
- 1991-10-28 EP EP96113991A patent/EP0747931B1/de not_active Expired - Lifetime
- 1991-10-28 EP EP91918908A patent/EP0557523B1/de not_active Expired - Lifetime
1997
- 1997-07-24 US US08/900,049 patent/US5921744A/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
EP0557523A4 (de)	1994-02-09
EP0747931A3 (de)	1997-05-02
DE69127372D1 (de)	1997-09-25
DE69132324T2 (de)	2001-01-04
DE69127372T2 (de)	1998-03-19
EP0557523B1 (de)	1997-08-20
US5518360A (en)	1996-05-21
WO1992009103A1 (fr)	1992-05-29
US5921744A (en)	1999-07-13
EP0747931A2 (de)	1996-12-11
EP0557523A1 (de)	1993-09-01
EP0747931B1 (de)	2000-07-12

Publication	Publication Date	Title
DE69132324D1 (de)	2000-08-17	Methode zum Transportieren von Substraten mit plattenförmiger Grundlage
DE59101796D1 (de)	1994-07-07	Anordnung zum Beschichten von Substraten mit Magnetronkathoden.
DE3862922D1 (de)	1991-06-27	Methode zum zusammenfuegen von zwei teilen mit unterschiedlichem waermeausdehnungskoeffizienten.
DE3667584D1 (de)	1990-01-18	Einrichtung zum transportieren von zerbrechlichen gegenstaenden in einer atmosphaere mit kontrolliertem bestauben.
DK644687A (da)	1988-06-09	Rygevare med forbedret aerosoldannende substrat
DE3772722D1 (de)	1991-10-10	Traegergeschoss zum abwerfen von tochtergeschossen in kontrollierter weise.
DE69028939D1 (de)	1996-11-28	Verfahren zum Ätzen von Kontaktlöchern mit abgeschrägten Flanken
DE68916523D1 (de)	1994-08-04	Verfahren zur Vorbehandlung von Kunststoffsubstraten.
DE3684676D1 (de)	1992-05-07	Verfahren zum herstellen von halbleitersubstraten.
FI903405A7 (fi)	1991-01-07	Liuskamaisia substraatteja
DE3684281D1 (de)	1992-04-16	Methode zur teilung eines substrates in mehrere teile.
DK229687A (da)	1987-11-07	Fremgangsmaade og genstand til dannelse af en forbindelse mellem genstande
FI885141A7 (fi)	1989-05-10	Menetelmä substraattien päällystämiseksi
DE69117891D1 (de)	1996-04-18	Verfahren zum Montieren von Halbleiterelementen
DE59104146D1 (de)	1995-02-16	Primer zum Metallisieren von Substratoberflächen.
PT86622A (pt)	1988-02-01	Filtergeraet zum filtern von verunreinigten fluessigkeiten
DE69200251D1 (de)	1994-08-25	Verfahren zum Verlängern der Topfzeit von Polyol-Polyisocyanat-Mischungen.
KR900008664A (ko)	1990-06-03	캐리어기판 및 그 제조방법
DE3582586D1 (de)	1991-05-23	Verfahren zum vernetzen von gummi- und plastikgegenstaenden.
DE59208722D1 (de)	1997-08-28	Verfahren zur kontinuierlichen Umsetzung von Halogenpyrimidinen mit Aminen
DE69121031D1 (de)	1996-08-29	Einrichtung zum Fördern von Flachgut
DK0663792T3 (da)	1999-12-06	Jordløst kultursubstrat
DE69026105D1 (de)	1996-04-25	Hochleistendes verfahren zum bleichen von zellstoff mit chlordioxyd
DE3883332D1 (de)	1993-09-23	Voraetzbehandlung eines plastiksubstrats.
DE69228872D1 (de)	1999-05-12	Hochleistendes verfahren zum bleichen von zellstoff mit chlordioxyd

Legal Events

Date	Code	Title	Description
2001-08-02	8364	No opposition during term of opposition
2007-08-23	8339	Ceased/non-payment of the annual fee