DE69033794D1 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE69033794D1 DE69033794D1 DE69033794T DE69033794T DE69033794D1 DE 69033794 D1 DE69033794 D1 DE 69033794D1 DE 69033794 T DE69033794 T DE 69033794T DE 69033794 T DE69033794 T DE 69033794T DE 69033794 D1 DE69033794 D1 DE 69033794D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
- H10B20/27—ROM only
- H10B20/30—ROM only having the source region and the drain region on the same level, e.g. lateral transistors
- H10B20/34—Source electrode or drain electrode programmed
-
- H10W20/056—
-
- H10W20/081—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1068826A JP2647188B2 (ja) | 1989-03-20 | 1989-03-20 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69033794D1 true DE69033794D1 (de) | 2001-10-18 |
| DE69033794T2 DE69033794T2 (de) | 2002-05-02 |
Family
ID=13384901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69033794T Expired - Fee Related DE69033794T2 (de) | 1989-03-20 | 1990-03-20 | Halbleiteranordnung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5164814A (de) |
| EP (1) | EP0388891B1 (de) |
| JP (1) | JP2647188B2 (de) |
| KR (1) | KR930009018B1 (de) |
| DE (1) | DE69033794T2 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2911980B2 (ja) * | 1990-08-18 | 1999-06-28 | 日本電気株式会社 | 半導体集積回路装置 |
| JP2681427B2 (ja) * | 1992-01-06 | 1997-11-26 | 三菱電機株式会社 | 半導体装置 |
| US5455461A (en) * | 1992-09-21 | 1995-10-03 | Fujitsu Limited | Semiconductor device having reformed pad |
| US5244299A (en) * | 1992-12-04 | 1993-09-14 | Chu Wei Y | Apparatus used in writing and massaging alternatively |
| JPH06333944A (ja) * | 1993-05-25 | 1994-12-02 | Nippondenso Co Ltd | 半導体装置 |
| JPH07307388A (ja) * | 1994-02-04 | 1995-11-21 | Advanced Micro Devices Inc | トランジスタのアレイおよびその形成方法 |
| US5985717A (en) * | 1996-05-06 | 1999-11-16 | United Microelectronics Corp. | Method of fabricating a semiconductor device |
| US6111756A (en) * | 1998-09-11 | 2000-08-29 | Fujitsu Limited | Universal multichip interconnect systems |
| US6355550B1 (en) * | 2000-05-19 | 2002-03-12 | Motorola, Inc. | Ultra-late programming ROM and method of manufacture |
| US6570235B2 (en) * | 2001-03-20 | 2003-05-27 | Macronix International Co., Ltd. | Cells array of mask read only memory |
| US7053447B2 (en) * | 2004-09-14 | 2006-05-30 | Infineon Technologies Ag | Charge-trapping semiconductor memory device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59198733A (ja) * | 1983-04-26 | 1984-11-10 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| JPS62260340A (ja) * | 1986-05-06 | 1987-11-12 | Toshiba Corp | 半導体装置の製造方法 |
| JPS62263653A (ja) * | 1986-05-12 | 1987-11-16 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
| JPH084089B2 (ja) * | 1986-12-22 | 1996-01-17 | 株式会社日立製作所 | Ic素子並びにic素子における配線接続方法 |
| JPS6317543A (ja) * | 1986-07-10 | 1988-01-25 | Nec Corp | 配線修正方法 |
| JPS6370440A (ja) * | 1986-09-11 | 1988-03-30 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| JPS6371538U (de) * | 1986-10-30 | 1988-05-13 | ||
| JPS63278256A (ja) * | 1987-05-09 | 1988-11-15 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2527183B2 (ja) * | 1987-05-20 | 1996-08-21 | 株式会社日立製作所 | 処理方法及び半導体装置の配線修正方法 |
-
1989
- 1989-03-20 JP JP1068826A patent/JP2647188B2/ja not_active Expired - Fee Related
-
1990
- 1990-03-20 DE DE69033794T patent/DE69033794T2/de not_active Expired - Fee Related
- 1990-03-20 KR KR1019900003731A patent/KR930009018B1/ko not_active Expired - Fee Related
- 1990-03-20 EP EP90105245A patent/EP0388891B1/de not_active Expired - Lifetime
-
1991
- 1991-09-04 US US07/759,818 patent/US5164814A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2647188B2 (ja) | 1997-08-27 |
| EP0388891B1 (de) | 2001-09-12 |
| JPH02246364A (ja) | 1990-10-02 |
| EP0388891A2 (de) | 1990-09-26 |
| KR900015301A (ko) | 1990-10-26 |
| US5164814A (en) | 1992-11-17 |
| EP0388891A3 (de) | 1991-11-21 |
| KR930009018B1 (ko) | 1993-09-18 |
| DE69033794T2 (de) | 2002-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |