DE69030484D1 - Fotoempfindliche Harzzusammensetzung - Google Patents
Fotoempfindliche HarzzusammensetzungInfo
- Publication number
- DE69030484D1 DE69030484D1 DE69030484T DE69030484T DE69030484D1 DE 69030484 D1 DE69030484 D1 DE 69030484D1 DE 69030484 T DE69030484 T DE 69030484T DE 69030484 T DE69030484 T DE 69030484T DE 69030484 D1 DE69030484 D1 DE 69030484D1
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- photosensitive resin
- photosensitive
- composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S522/906—Preparing shrinkable material
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1309310A JPH03170547A (ja) | 1989-11-30 | 1989-11-30 | 感光性樹脂組成物 |
| JP2089167A JPH03288154A (ja) | 1990-04-05 | 1990-04-05 | 感光性樹脂組成物 |
| JP2093943A JPH03293357A (ja) | 1990-04-11 | 1990-04-11 | 感光性樹脂組成物 |
| JP2099304A JPH0827536B2 (ja) | 1990-04-17 | 1990-04-17 | 感光性樹脂組成物の製造方法 |
| JP2115058A JPH0412358A (ja) | 1990-05-02 | 1990-05-02 | 感光性樹脂組成物 |
| JP2177375A JPH0827537B2 (ja) | 1990-07-06 | 1990-07-06 | 感光性樹脂組成物 |
| JP2190609A JPH0827538B2 (ja) | 1990-07-20 | 1990-07-20 | 感光性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69030484D1 true DE69030484D1 (de) | 1997-05-22 |
| DE69030484T2 DE69030484T2 (de) | 1997-08-28 |
Family
ID=27565469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69030484T Expired - Fee Related DE69030484T2 (de) | 1989-11-30 | 1990-11-28 | Fotoempfindliche Harzzusammensetzung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5238784A (de) |
| EP (1) | EP0430221B1 (de) |
| KR (1) | KR0147279B1 (de) |
| DE (1) | DE69030484T2 (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310862A (en) * | 1991-08-20 | 1994-05-10 | Toray Industries, Inc. | Photosensitive polyimide precursor compositions and process for preparing same |
| DE4217688A1 (de) * | 1992-05-29 | 1993-12-02 | Basf Lacke & Farben | Durch Einwirkung von Strahlung vernetzendes Gemisch und dessen Verwendung zur Herstellung hochtemperaturbeständiger Reliefstrukturen |
| WO1994018607A1 (fr) * | 1993-02-03 | 1994-08-18 | Toray Industries, Inc. | Procede de formation d'un motif en polyimide positif |
| KR0134753B1 (ko) * | 1993-02-26 | 1998-04-18 | 사토 후미오 | 폴리아미드산 조성물 |
| JP3687988B2 (ja) | 1993-09-03 | 2005-08-24 | 日立化成工業株式会社 | i線ステッパ用感光性樹脂組成物 |
| US5446074A (en) * | 1993-12-17 | 1995-08-29 | International Business Machines Corporation | Photosensitive polyimide precursors |
| KR100384746B1 (ko) * | 1994-09-13 | 2003-08-25 | 제온 코포레이션 | 감광성 폴리이미드 수지 조성물 |
| US6071667A (en) | 1995-04-13 | 2000-06-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition containing a photosensitive polyamide resin |
| US5886136A (en) * | 1995-09-12 | 1999-03-23 | Nippon Zeon Co., Ltd. | Pattern forming process |
| US6001517A (en) * | 1996-10-31 | 1999-12-14 | Kabushiki Kaisha Toshiba | Positive photosensitive polymer composition, method of forming a pattern and electronic parts |
| TWI249650B (en) * | 1997-05-16 | 2006-02-21 | Toray Industries | Actinic radiation sensitive polymer composition and method of preparing a polyimide precursor composition for an actinic radiation sensitive polymer composition |
| US6160081A (en) * | 1997-10-31 | 2000-12-12 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
| US6403289B1 (en) | 1997-10-31 | 2002-06-11 | Nippon Zeon Co., Ltd. | Developer for photosensitive polyimide resin composition |
| JP3895945B2 (ja) * | 2001-04-24 | 2007-03-22 | ソニーケミカル&インフォメーションデバイス株式会社 | 樹脂組成物及び樹脂組成物製造方法 |
| JP3485183B1 (ja) * | 2002-06-28 | 2004-01-13 | 東京応化工業株式会社 | パターン微細化用被覆形成剤およびそれを用いた微細パターンの形成方法 |
| JP5217435B2 (ja) * | 2005-06-20 | 2013-06-19 | 日産化学工業株式会社 | ポリアミド酸又はポリイミドを含有する電極パターニング層、及びこれを用いた電子デバイス |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952822B2 (ja) * | 1978-04-14 | 1984-12-21 | 東レ株式会社 | 耐熱性感光材料 |
| GB2092164B (en) * | 1980-12-17 | 1984-12-05 | Hitachi Ltd | Loght or radiation-sensitive polymer composition |
| JPS58223149A (ja) * | 1982-06-22 | 1983-12-24 | Toray Ind Inc | 感光性ポリイミド用現像液 |
| DE3463576D1 (en) * | 1983-03-03 | 1987-06-11 | Toray Industries | Radiation sensitive polymer composition |
| JPS59160139A (ja) * | 1983-03-04 | 1984-09-10 | Hitachi Ltd | 感光性重合体組成物 |
| JPS62273260A (ja) * | 1986-05-21 | 1987-11-27 | Asahi Chem Ind Co Ltd | 新しい感光性組成物 |
| JP2626696B2 (ja) * | 1988-04-11 | 1997-07-02 | チッソ株式会社 | 感光性重合体 |
-
1990
- 1990-11-28 DE DE69030484T patent/DE69030484T2/de not_active Expired - Fee Related
- 1990-11-28 EP EP90122781A patent/EP0430221B1/de not_active Expired - Lifetime
- 1990-11-28 US US07/618,794 patent/US5238784A/en not_active Expired - Fee Related
- 1990-11-30 KR KR1019900019634A patent/KR0147279B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0430221B1 (de) | 1997-04-16 |
| KR910010244A (ko) | 1991-06-29 |
| EP0430221A2 (de) | 1991-06-05 |
| DE69030484T2 (de) | 1997-08-28 |
| US5238784A (en) | 1993-08-24 |
| KR0147279B1 (ko) | 1998-08-01 |
| EP0430221A3 (en) | 1991-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |