DE69910464D1 - Verfahren zum Verbinden von unterschiedlichen Elementen - Google Patents

Verfahren zum Verbinden von unterschiedlichen Elementen

Info

Publication number: DE69910464D1
Authority: DE; Germany
Prior art keywords: different elements; connecting different; elements; different
Prior art date: 1998-02-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69910464T

Other languages

English (en)

Other versions

DE69910464T2 (de

Inventor

Takuma Makino

Masayuki Shinkai

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NGK Insulators Ltd

Original Assignee

NGK Insulators Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-02-18

Filing date

1999-02-17

Publication date

2003-09-25

1999-02-17 Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd

2003-09-25 Application granted granted Critical

2003-09-25 Publication of DE69910464D1 publication Critical patent/DE69910464D1/de

2004-07-08 Publication of DE69910464T2 publication Critical patent/DE69910464T2/de

2019-02-18 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Ceramic Products (AREA)
Adhesives Or Adhesive Processes (AREA)

DE69910464T 1998-02-18 1999-02-17 Verfahren zum Verbinden von unterschiedlichen Elementen Expired - Lifetime DE69910464T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP05297198A JP3315919B2 (ja)	1998-02-18	1998-02-18	２種類以上の異種部材よりなる複合部材を製造する方法
JP5297198		1998-02-18

Publications (2)

Publication Number	Publication Date
DE69910464D1 true DE69910464D1 (de)	2003-09-25
DE69910464T2 DE69910464T2 (de)	2004-07-08

Family

ID=12929787

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69910464T Expired - Lifetime DE69910464T2 (de)	1998-02-18	1999-02-17	Verfahren zum Verbinden von unterschiedlichen Elementen

Country Status (4)

Country	Link
US (2)	US6390354B1 (de)
EP (1)	EP0937536B1 (de)
JP (1)	JP3315919B2 (de)
DE (1)	DE69910464T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3792440B2 (ja) *	1999-06-25	2006-07-05	日本碍子株式会社	異種部材の接合方法、および同接合方法により接合された複合部材
US6605316B1 (en)	1999-07-31	2003-08-12	The Regents Of The University Of California	Structures and fabrication techniques for solid state electrochemical devices
JP4367675B2 (ja)	1999-10-21	2009-11-18	日本碍子株式会社	セラミック製部材と金属製部材の接合用接着剤組成物、同組成物を用いた複合部材の製造方法、および同製造方法により得られた複合部材
EP1122780A3 (de) *	2000-01-31	2004-01-02	Ngk Insulators, Ltd.	Laminatkühler, Leistungshalbleiter und seine Herstellung
DE10233530A1 (de) *	2002-07-23	2004-02-12	Komet Präzisionswerkzeuge Robert Breuning Gmbh	Maschinenwerkzeug mit einem Werkzeugschaft und einem Schneidkopf
JP3967278B2 (ja)	2003-03-07	2007-08-29	日本碍子株式会社	接合部材及び静電チャック
US7347354B2 (en) *	2004-03-23	2008-03-25	Intel Corporation	Metallic solder thermal interface material layer and application of the same
US7179558B2 (en) *	2004-07-15	2007-02-20	Delphi Technologies, Inc.	Braze alloy containing particulate material
US8287673B2 (en) *	2004-11-30	2012-10-16	The Regents Of The University Of California	Joining of dissimilar materials
RU2403136C2 (ru) *	2004-11-30	2010-11-10	Члены Правления Университета Калифорнии	Паяная система с согласованными коэффициентами термического расширения
EP1825541A4 (de) *	2004-11-30	2010-01-13	Univ California	Abgedichtete gelenkstruktur für elektrochemische vorrichtung
US7185545B2 (en) *	2004-12-29	2007-03-06	General Electric Company	Instrumentation and method for monitoring change in electric potential to detect crack growth
US7559202B2 (en) *	2005-11-15	2009-07-14	Pratt & Whitney Canada Corp.	Reduced thermal stress fuel nozzle assembly
JP4162094B2 (ja) *	2006-05-30	2008-10-08	三菱重工業株式会社	常温接合によるデバイス、デバイス製造方法ならびに常温接合装置
JP2008044009A (ja) *	2006-07-19	2008-02-28	Honda Motor Co Ltd	熱膨張係数が異なる部材の接合方法
BRPI0621912A2 (pt) *	2006-07-28	2011-12-20	Univ California	método de unir estruturas tubulares concêntricas para formar uma estrutura tubular compósita e estrutura tubular compósita
US20080217382A1 (en) *	2007-03-07	2008-09-11	Battelle Memorial Institute	Metal-ceramic composite air braze with ceramic particulate
US7691488B2 (en) *	2007-06-11	2010-04-06	Battelle Memorial Institute	Diffusion barriers in modified air brazes
MY149355A (en) *	2007-07-25	2013-08-30	Univ California	High temperature electrochemical device with interlocking structure
BRPI0821954A2 (pt) *	2008-02-04	2015-06-23	Univ California	Cermet a base de cobre para célula combustivel de alta temperatura
US8486580B2 (en)	2008-04-18	2013-07-16	The Regents Of The University Of California	Integrated seal for high-temperature electrochemical device
KR102329588B1 (ko)	2014-03-07	2021-11-22	엔지케이 인슐레이터 엘티디	접합체의 제조 방법
JP6921532B2 (ja) *	2014-03-07	2021-08-18	日本碍子株式会社	接合体の製造方法及び接合体
KR101477077B1 (ko) *	2014-05-09	2014-12-29	국방과학연구소	몰리브덴과 티타늄 합금의 브레이징 방법
CN109643685B (zh) *	2016-08-26	2023-04-07	日本碍子株式会社	晶片载置台

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1590695A (en)	1977-08-08	1981-06-10	Fusion Inc	Method of brazing
CA1202768A (en)	1981-11-05	1986-04-08	Kenneth R. Cross	Method for forming braze-bonded abrasive turbine blade tip
US4729504A (en) *	1985-06-01	1988-03-08	Mizuo Edamura	Method of bonding ceramics and metal, or bonding similar ceramics among themselves; or bonding dissimilar ceramics
JPS62179889A (ja)	1986-01-31	1987-08-07	Senjiyu Kinzoku Kogyo Kk	クリ−ムはんだ
JPS638273A (ja)	1986-06-28	1988-01-14	日本碍子株式会社	セラミツクス部材と金属部材の結合方法
JPH0657622B2 (ja)	1988-03-30	1994-08-03	松下電器産業株式会社	ろう付けペースト
JPH025541A (ja)	1988-06-24	1990-01-10	Asahi Daiyamondo Kogyo Kk	ボンディングツールの製造方法
JPH0238376A (ja)	1988-07-28	1990-02-07	Ngk Insulators Ltd	セラミック部材間のガラス接合方法
US6413589B1 (en) *	1988-11-29	2002-07-02	Chou H. Li	Ceramic coating method
US5161728A (en) *	1988-11-29	1992-11-10	Li Chou H	Ceramic-metal bonding
US4919974A (en) *	1989-01-12	1990-04-24	Ford Motor Company	Making diamond composite coated cutting tools
JP2764990B2 (ja)	1989-01-31	1998-06-11	旭硝子株式会社	複合型回路装置及び接合用ペースト
US5127969A (en)	1990-03-22	1992-07-07	University Of Cincinnati	Reinforced solder, brazing and welding compositions and methods for preparation thereof
JPH05246769A (ja)	1991-03-15	1993-09-24	Toshiba Corp	セラミックス−金属接合用組成物およびそれを用いたセラミックス−金属接合体
US5820721A (en) *	1991-07-17	1998-10-13	Beane; Alan F.	Manufacturing particles and articles having engineered properties
JPH0531994A (ja)	1991-07-31	1993-02-09	Toshiba Corp	プリンタ
JPH05163078A (ja)	1991-12-18	1993-06-29	Nippon Steel Corp	セラミックスと金属の接合体
JPH05319944A (ja)	1992-05-15	1993-12-03	Toshiba Corp	セラミックス回路基板および回路基板用接合剤
WO2004074210A1 (ja) *	1992-07-03	2004-09-02	Masanori Hirano	セラミックス－金属複合体およびその製造方法
FR2706139B1 (fr)	1993-06-08	1995-07-21	Thomson Csf	Matériau pour brasure.
JPH0769749A (ja)	1993-09-03	1995-03-14	Tanaka Kikinzoku Kogyo Kk	セラミックス用ろう材
US6203897B1 (en) *	1993-09-24	2001-03-20	The Ishizuka Research Institute, Ltd.	Sintered composites containing superabrasive particles
US6264882B1 (en) *	1994-05-20	2001-07-24	The Regents Of The University Of California	Process for fabricating composite material having high thermal conductivity
JPH1180160A (ja)	1997-09-04	1999-03-26	Dong Kook Pharmaceut Co	ベンゾジアゼピン誘導体の調製プロセス
JP3190300B2 (ja)	1998-01-19	2001-07-23	日本電信電話株式会社	パケット中継制御方法

1998
- 1998-02-18 JP JP05297198A patent/JP3315919B2/ja not_active Expired - Lifetime
1999
- 1999-01-28 US US09/238,731 patent/US6390354B1/en not_active Expired - Lifetime
- 1999-02-17 DE DE69910464T patent/DE69910464T2/de not_active Expired - Lifetime
- 1999-02-17 EP EP99301187A patent/EP0937536B1/de not_active Expired - Lifetime
2002
- 2002-02-27 US US10/083,374 patent/US6742700B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0937536A1 (de)	1999-08-25
US6742700B2 (en)	2004-06-01
DE69910464T2 (de)	2004-07-08
JPH11228245A (ja)	1999-08-24
US20020092896A1 (en)	2002-07-18
EP0937536B1 (de)	2003-08-20
US6390354B1 (en)	2002-05-21
JP3315919B2 (ja)	2002-08-19

Publication	Publication Date	Title
DE69910464D1 (de)	2003-09-25	Verfahren zum Verbinden von unterschiedlichen Elementen
DE59814043D1 (de)	2007-08-09	Verfahren zum anisotropen ätzen von silizium
DE69820814D1 (de)	2004-02-05	Verfahren zum Verbinden von metallischen Elementen
DE60044907D1 (de)	2010-10-14	Verfahren zum bestimmen von glykoproteinen
DE69720465D1 (de)	2003-05-08	Verfahren zum wiedergewinnen von prozessflüssigkeiten
DE69827657D1 (de)	2004-12-23	Verfahren zum trennen von aromaten
DE60013420D1 (de)	2004-10-07	Verfahren zum ringförmigen abdichten
DE69910025D1 (de)	2003-09-04	Verfahren zum Verpacken
DE69716301D1 (de)	2002-11-14	Verfahren zum formen von stielenden von befestigungselementen
DE69711425D1 (de)	2002-05-02	Verfahren zum formen von konfekt
DE69910466D1 (de)	2003-09-25	Verfahren zum Verfeinern von Deskriptoren
DE60032438D1 (de)	2007-02-01	Verbessertes Verfahren zum Einbetten von passiven Bauteilen
DE69508921D1 (de)	1999-05-12	Verfahren zum nachweis von staphylokokken
DE69522809D1 (de)	2001-10-25	Verfahren zum Verblasen von Kupferstein
DE69926436D1 (de)	2005-09-08	Verfahren zum Entfernen von Leukozyten
DE69724192D1 (de)	2003-09-25	Verfahren zum Ätzen von Polyzidstrukturen
DE59905412D1 (de)	2003-06-12	Verfahren zum Betreiben von Turboverdichtern
DE19982873T1 (de)	2001-07-26	Verfahren zum Verbinden von Anrufen
ATA121798A (de)	2000-10-15	Verfahren zum beizen von edelstahl
DE59812633D1 (de)	2005-04-14	Verfahren zum Verbinden von Bauteilen
DE59813943D1 (de)	2007-04-26	Verfahren zum Herstellen von elektronischen Elementen
DE69903299D1 (de)	2002-11-07	Verfahren ZUM VERFESTIGEN VON BÖDEN
DE69938233D1 (de)	2008-04-10	Verfahren zum weiterreichen
DE59801033D1 (de)	2001-08-23	Verfahren zum Beschichten von Elastomerkomponenten
DE69522828D1 (de)	2001-10-25	Verfahren zum entmetallieren von raffinerieeizätzen

Legal Events

Date	Code	Title	Description
2004-09-16	8364	No opposition during term of opposition