DE69821149D1 - Vorrichtung zum Polieren - Google Patents

Vorrichtung zum Polieren

Info

Publication number: DE69821149D1
Authority: DE; Germany
Prior art keywords: polishing device; polishing
Prior art date: 1997-02-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69821149T

Other languages

English (en)

Other versions

DE69821149T2 (de

Inventor

Norio Kimura

Hozumi Yasuda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ebara Corp

Original Assignee

Ebara Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-02-27

Filing date

1998-02-27

Publication date

2004-02-26

1998-02-27 Application filed by Ebara Corp filed Critical Ebara Corp

2004-02-26 Application granted granted Critical

2004-02-26 Publication of DE69821149D1 publication Critical patent/DE69821149D1/de

2004-09-02 Publication of DE69821149T2 publication Critical patent/DE69821149T2/de

2018-02-28 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- H10P52/402—

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

DE69821149T 1997-02-27 1998-02-27 Vorrichtung zum Polieren Expired - Lifetime DE69821149T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP5993397		1997-02-27
JP5993397A JP3807807B2 (ja)	1997-02-27	1997-02-27	ポリッシング装置

Publications (2)

Publication Number	Publication Date
DE69821149D1 true DE69821149D1 (de)	2004-02-26
DE69821149T2 DE69821149T2 (de)	2004-09-02

Family

ID=13127438

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69821149T Expired - Lifetime DE69821149T2 (de)	1997-02-27	1998-02-27	Vorrichtung zum Polieren

Country Status (5)

Country	Link
US (1)	US6019868A (de)
EP (1)	EP0861706B1 (de)
JP (1)	JP3807807B2 (de)
KR (1)	KR100478989B1 (de)
DE (1)	DE69821149T2 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE69516035T2 (de) *	1994-05-23	2000-08-31	Sumitomo Electric Industries, Ltd.	Verfharen zum Herstellen eines mit hartem Material bedeckten Halbleiters
JPH10230455A (ja) *	1997-02-17	1998-09-02	Nec Corp	研磨装置
JP3807807B2 (ja) *	1997-02-27	2006-08-09	株式会社荏原製作所	ポリッシング装置
JP3959173B2 (ja) *	1998-03-27	2007-08-15	株式会社東芝	研磨装置及び研磨加工方法
JPH11277406A (ja) *	1998-03-27	1999-10-12	Ebara Corp	ポリッシング装置
US6572462B1 (en) *	1998-05-04	2003-06-03	Motorola, Inc.	Carrier assembly for chemical mechanical planarization systems and method
US6102779A (en) *	1998-06-17	2000-08-15	Speedfam-Ipec, Inc.	Method and apparatus for improved semiconductor wafer polishing
US6283828B1 (en) *	1998-11-09	2001-09-04	Tokyo Seimitsu Co., Ltd.	Wafer polishing apparatus
DE19853059A1 (de) *	1998-11-17	2000-05-25	Siemens Ag	Werkstückhalter
TW467792B (en) *	1999-03-11	2001-12-11	Ebara Corp	Polishing apparatus including attitude controller for turntable and/or wafer carrier
JP3085948B1 (ja) *	1999-05-10	2000-09-11	株式会社東京精密	ウェーハ研磨装置
US6722963B1 (en) *	1999-08-03	2004-04-20	Micron Technology, Inc.	Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
US6093086A (en) *	1999-09-24	2000-07-25	Lucent Technologies Inc.	Polishing head release mechanism
US6386962B1 (en)	2000-06-30	2002-05-14	Lam Research Corporation	Wafer carrier with groove for decoupling retainer ring from water
US6652357B1 (en) *	2000-09-22	2003-11-25	Lam Research Corporation	Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6454637B1 (en) *	2000-09-26	2002-09-24	Lam Research Corporation	Edge instability suppressing device and system
TWI261009B (en) *	2001-05-02	2006-09-01	Hitoshi Suwabe	Polishing machine
JP4269259B2 (ja) *	2003-05-30	2009-05-27	株式会社ニコン	加工装置、この加工装置を用いた半導体デバイスの製造方法
JP4465645B2 (ja)	2003-06-03	2010-05-19	株式会社ニコン	研磨装置、これを用いた半導体デバイス製造方法
US7150673B2 (en) *	2004-07-09	2006-12-19	Ebara Corporation	Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
EP2418677B1 (de) *	2004-11-01	2016-12-07	Ebara Corporation	Poliervorrichtung
US20060100634A1 (en) *	2004-11-09	2006-05-11	Sdgi Holdings, Inc.	Technique and instrumentation for measuring and preparing a vertebral body for device implantation using datum block
JP4762647B2 (ja) *	2005-02-25	2011-08-31	株式会社荏原製作所	研磨装置及び研磨方法
TWI386989B (zh) *	2005-02-25	2013-02-21	荏原製作所股份有限公司	研磨裝置及研磨方法
JP5199691B2 (ja) *	2008-02-13	2013-05-15	株式会社荏原製作所	研磨装置
US8740673B2 (en) *	2010-10-05	2014-06-03	Strasbaugh	CMP retaining ring with soft retaining ring insert
US10857649B2 (en) *	2011-09-22	2020-12-08	Taiwan Semiconductor Manufacturing Company, Ltd.	Method and apparatus for performing a polishing process in semiconductor fabrication
US10702972B2 (en)	2012-05-31	2020-07-07	Ebara Corporation	Polishing apparatus
JP5976522B2 (ja) *	2012-05-31	2016-08-23	株式会社荏原製作所	研磨装置および研磨方法
KR102191916B1 (ko) *	2013-06-26	2020-12-16	주식회사 케이씨텍	화학 기계적 연마 장치의 캐리어 헤드
JP6445924B2 (ja) *	2014-05-14	2018-12-26	株式会社荏原製作所	研磨装置
TWI656944B (zh) *	2014-05-14	2019-04-21	日商荏原製作所股份有限公司	研磨裝置
JP7178259B2 (ja) *	2018-12-27	2022-11-25	株式会社荏原製作所	研磨装置および研磨方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5205082A (en) *	1991-12-20	1993-04-27	Cybeq Systems, Inc.	Wafer polisher head having floating retainer ring
DE69333322T2 (de) *	1992-09-24	2004-09-30	Ebara Corp.	Poliergerät
JP3370112B2 (ja) *	1992-10-12	2003-01-27	不二越機械工業株式会社	ウエハーの研磨装置
JP3158934B2 (ja) *	1995-02-28	2001-04-23	三菱マテリアル株式会社	ウェーハ研磨装置
JPH08257893A (ja) *	1995-03-29	1996-10-08	Mitsubishi Materials Corp	ウェーハ研磨装置および研磨方法
JP3704175B2 (ja) *	1995-04-17	2005-10-05	不二越機械工業株式会社	研磨装置のワーク押圧機構
US5795215A (en) *	1995-06-09	1998-08-18	Applied Materials, Inc.	Method and apparatus for using a retaining ring to control the edge effect
JP3807807B2 (ja) *	1997-02-27	2006-08-09	株式会社荏原製作所	ポリッシング装置

1997
- 1997-02-27 JP JP5993397A patent/JP3807807B2/ja not_active Expired - Fee Related
1998
- 1998-02-24 US US09/028,661 patent/US6019868A/en not_active Expired - Fee Related
- 1998-02-27 KR KR10-1998-0006360A patent/KR100478989B1/ko not_active Expired - Lifetime
- 1998-02-27 DE DE69821149T patent/DE69821149T2/de not_active Expired - Lifetime
- 1998-02-27 EP EP98103462A patent/EP0861706B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPH10235555A (ja)	1998-09-08
KR100478989B1 (ko)	2005-07-18
JP3807807B2 (ja)	2006-08-09
US6019868A (en)	2000-02-01
KR19980071792A (ko)	1998-10-26
DE69821149T2 (de)	2004-09-02
EP0861706B1 (de)	2004-01-21
EP0861706A1 (de)	1998-09-02

Publication	Publication Date	Title
DE69827062D1 (de)	2004-11-25	Vorrichtung zum Polieren
DE69821149D1 (de)	2004-02-26	Vorrichtung zum Polieren
DE69825143D1 (de)	2004-08-26	Vorrichtung zum polieren
DE69836868D1 (de)	2007-02-22	Vorrichtung zum abtrennen von läsionen
DE59703595D1 (de)	2001-06-28	Vorrichtung zum Halten von Rohren
DE59706348D1 (de)	2002-03-21	Vorrichtung zum bearbeiten von fahrbahnen
DE69900398D1 (de)	2001-12-06	Träger und Vorrichtung zum Polieren
EP0987084A4 (de)	2006-11-15	Schleifmaschine
DE69829919D1 (de)	2005-06-02	Polierverfahren und Vorrichtung
DE69937935D1 (de)	2008-02-21	Einrichtung zum bestücken von bauteilen
DE69834536D1 (de)	2006-06-22	Vorrichtung zum Eingeben von Koordinaten
DE69837298D1 (de)	2007-04-19	Vorrichtung zum Bereitstellen von Bauteilen
DE69721909D1 (de)	2003-06-18	Vorrichtung zum Formationstesten
DE69902021D1 (de)	2002-08-08	Poliervorrichtung
DE69802993D1 (de)	2002-01-31	Einrichtung zum Beschichten
DE69932219D1 (de)	2006-08-17	Abgeschlossene Vorrichtung
DE69500334D1 (de)	1997-07-10	Vorrichtung zum elektro-fischen
DE69820319D1 (de)	2004-01-22	Vorrichtung zum Ausrichten von Gegenständen
DE69901636D1 (de)	2002-07-11	Vorrichtung zum Schleifen von Spiegeloberflächen
DE69515779D1 (de)	2000-04-27	Schleifvorrichtung
DE69820328D1 (de)	2004-01-22	Schleifgerät zum Schleifen von Brillengläsern
DE69922088D1 (de)	2004-12-30	Schleifgerät zum Schleifen von Brillengläsern
DE69908743D1 (de)	2003-07-17	Vorrichtung zum Drehen von flachen Gegenständen
DE69805356D1 (de)	2002-06-20	Vorrichtung zum Polieren von Endflächen
DE59812310D1 (de)	2004-12-30	Vorrichtung zum lösbaren festlegen von gegenständen

Legal Events

Date	Code	Title	Description
2005-02-17	8364	No opposition during term of opposition