[go: up one dir, main page]

DE69617651D1 - Halbleiteranordnung mit einem Element hoher Zusammenbruchsspannung - Google Patents

Halbleiteranordnung mit einem Element hoher Zusammenbruchsspannung

Info

Publication number
DE69617651D1
DE69617651D1 DE69617651T DE69617651T DE69617651D1 DE 69617651 D1 DE69617651 D1 DE 69617651D1 DE 69617651 T DE69617651 T DE 69617651T DE 69617651 T DE69617651 T DE 69617651T DE 69617651 D1 DE69617651 D1 DE 69617651D1
Authority
DE
Germany
Prior art keywords
semiconductor device
breakdown voltage
high breakdown
voltage element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69617651T
Other languages
English (en)
Other versions
DE69617651T2 (de
Inventor
Tomohide Terashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of DE69617651D1 publication Critical patent/DE69617651D1/de
Publication of DE69617651T2 publication Critical patent/DE69617651T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/118Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
    • H10P14/60
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0186Manufacturing their interconnections or electrodes, e.g. source or drain electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • H10D84/856Complementary IGFETs, e.g. CMOS the complementary IGFETs having different architectures than each other, e.g. high-voltage and low-voltage CMOS
    • H10W20/495
    • H10W74/121
    • H10W74/137
DE69617651T 1996-06-21 1996-07-10 Halbleiteranordnung mit einem Element hoher Zusammenbruchsspannung Expired - Lifetime DE69617651T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16162096A JP3563877B2 (ja) 1996-06-21 1996-06-21 半導体装置

Publications (2)

Publication Number Publication Date
DE69617651D1 true DE69617651D1 (de) 2002-01-17
DE69617651T2 DE69617651T2 (de) 2002-07-18

Family

ID=15738647

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69617651T Expired - Lifetime DE69617651T2 (de) 1996-06-21 1996-07-10 Halbleiteranordnung mit einem Element hoher Zusammenbruchsspannung

Country Status (5)

Country Link
US (2) US5731628A (de)
EP (1) EP0814508B1 (de)
JP (1) JP3563877B2 (de)
KR (1) KR100209979B1 (de)
DE (1) DE69617651T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09146108A (ja) 1995-11-17 1997-06-06 Semiconductor Energy Lab Co Ltd 液晶表示装置およびその駆動方法
TWI228625B (en) * 1995-11-17 2005-03-01 Semiconductor Energy Lab Display device
US6800875B1 (en) 1995-11-17 2004-10-05 Semiconductor Energy Laboratory Co., Ltd. Active matrix electro-luminescent display device with an organic leveling layer
TW309633B (de) 1995-12-14 1997-07-01 Handotai Energy Kenkyusho Kk
JP3563877B2 (ja) * 1996-06-21 2004-09-08 三菱電機株式会社 半導体装置
KR100571293B1 (ko) * 1997-02-07 2006-10-11 가부시키가이샤 주켄 산교 깔개바닥재의설치구조
US6475836B1 (en) * 1999-03-29 2002-11-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2001358153A (ja) * 2000-06-15 2001-12-26 Fuji Electric Co Ltd 半導体装置
GB2371922B (en) 2000-09-21 2004-12-15 Cambridge Semiconductor Ltd Semiconductor device and method of forming a semiconductor device
JP3846796B2 (ja) 2002-11-28 2006-11-15 三菱電機株式会社 半導体装置
JP4094984B2 (ja) * 2003-04-24 2008-06-04 三菱電機株式会社 半導体装置
JP4326835B2 (ja) 2003-05-20 2009-09-09 三菱電機株式会社 半導体装置、半導体装置の製造方法及び半導体装置の製造プロセス評価方法
JP4546796B2 (ja) * 2004-09-16 2010-09-15 パナソニック株式会社 半導体装置
US8618627B2 (en) 2010-06-24 2013-12-31 Fairchild Semiconductor Corporation Shielded level shift transistor
JP6319761B2 (ja) * 2013-06-25 2018-05-09 ローム株式会社 半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477578A (en) * 1977-12-02 1979-06-21 Nec Corp High frequency high output bipolar transistor
JPS59181022A (ja) * 1983-03-31 1984-10-15 Toshiba Corp 半導体装置
US4601939A (en) * 1983-09-20 1986-07-22 International Business Machines Corporation Composite insulator structure
ES2046984T3 (es) * 1986-12-19 1994-02-16 Philips Nv Metodo de fabricar un dispositivo semiconductor con tension de encapsulacion reducida.
US5061985A (en) * 1988-06-13 1991-10-29 Hitachi, Ltd. Semiconductor integrated circuit device and process for producing the same
EP0482247A1 (de) * 1990-10-26 1992-04-29 International Business Machines Corporation Verfahren zur Herstellung einer integrierten Schaltungsstruktur mit einer dicht mehrschichtigen Metallisierungsstruktur
JP3297220B2 (ja) * 1993-10-29 2002-07-02 株式会社東芝 半導体装置の製造方法および半導体装置
US5439849A (en) * 1994-02-02 1995-08-08 At&T Corp. Encapsulation techniques which include forming a thin glass layer onto a polymer layer
JP3563877B2 (ja) * 1996-06-21 2004-09-08 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
US5907182A (en) 1999-05-25
KR980005906A (ko) 1998-03-30
JPH1012607A (ja) 1998-01-16
DE69617651T2 (de) 2002-07-18
EP0814508B1 (de) 2001-12-05
US5731628A (en) 1998-03-24
KR100209979B1 (ko) 1999-07-15
JP3563877B2 (ja) 2004-09-08
EP0814508A1 (de) 1997-12-29

Similar Documents

Publication Publication Date Title
DE69224709D1 (de) Halbleiteranordnung mit verbesserter Durchbruchspannungs-Charakteristik
DE69427214D1 (de) Halbleiterspeicheranordnung mit Spannung-Erhöhungsschaltung
DE69528944D1 (de) Halbleiteranordnung mit hoher Durchbruchspannung und mit einer vergrabenen MOS-Gatestruktur
DE69319549D1 (de) Spannungsgesteuerte Halbleiteranordnung
DE69432643D1 (de) Halbleiterbauelement mit Kondensator
DE69706489D1 (de) Nichtflüchtige Halbleiterspeicheranordnung mit variabler Source-Spannung
DE69617651D1 (de) Halbleiteranordnung mit einem Element hoher Zusammenbruchsspannung
DE69526386D1 (de) Optoelektronische Halbleitervorrichtung mit einem integrierten Modenanpassungselement
DE69733193D1 (de) Halbleiteranordnung mit einem Leitersubstrat
DE69317940D1 (de) Halbleiterbauelement mit Kondensator
DE60029554D1 (de) Halbleiterbauelement mit hochspannungselement
DE69414305D1 (de) Hochspannungs-Halbleiterstruktur
DE69231832D1 (de) Halbleiteranordnung ausgerüstet mit einem Hochspannungs-MISFET
DE59407460D1 (de) Halbleiterbauelement mit hoher durchbruchsspannung
DE69626607D1 (de) Halbleiterspeicheranordnung mit Spannungsgeneratorschaltung
DE69219405D1 (de) Halbleiteranordnung mit hoher Durchbruchsspannung
DE69325278D1 (de) Nichtflüchtige, elektrisch programmierbare Halbleiterspeicheranordnung mit einem Spannungsregler
DE69624305D1 (de) Halbleiteranordnung mit einem ligbt element
DE69738058D1 (de) Halbleiteranordnung mit einem Leistungstransistor-Bauelement
DE59609905D1 (de) Halbleitervorrichtung mit einem Träger
BR9506229A (pt) Diodo livre de alta-tensão
DE59915043D1 (de) Integrierte Schaltung mit einem Spannungsregler
DE68921062D1 (de) Nichtflüchtige Halbleiterspeicheranordnung mit einer Referenzspannungsgeneratorschaltung.
DE69329139D1 (de) Halbleitervorrichtung mit einem programmierbaren Element
DE69431782D1 (de) Programmierbares Halbleiterbauelement

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)