DE69617651D1 - Halbleiteranordnung mit einem Element hoher Zusammenbruchsspannung - Google Patents
Halbleiteranordnung mit einem Element hoher ZusammenbruchsspannungInfo
- Publication number
- DE69617651D1 DE69617651D1 DE69617651T DE69617651T DE69617651D1 DE 69617651 D1 DE69617651 D1 DE 69617651D1 DE 69617651 T DE69617651 T DE 69617651T DE 69617651 T DE69617651 T DE 69617651T DE 69617651 D1 DE69617651 D1 DE 69617651D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- breakdown voltage
- high breakdown
- voltage element
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/118—Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
-
- H10P14/60—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
- H10D84/0186—Manufacturing their interconnections or electrodes, e.g. source or drain electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
- H10D84/856—Complementary IGFETs, e.g. CMOS the complementary IGFETs having different architectures than each other, e.g. high-voltage and low-voltage CMOS
-
- H10W20/495—
-
- H10W74/121—
-
- H10W74/137—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16162096A JP3563877B2 (ja) | 1996-06-21 | 1996-06-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69617651D1 true DE69617651D1 (de) | 2002-01-17 |
| DE69617651T2 DE69617651T2 (de) | 2002-07-18 |
Family
ID=15738647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69617651T Expired - Lifetime DE69617651T2 (de) | 1996-06-21 | 1996-07-10 | Halbleiteranordnung mit einem Element hoher Zusammenbruchsspannung |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US5731628A (de) |
| EP (1) | EP0814508B1 (de) |
| JP (1) | JP3563877B2 (de) |
| KR (1) | KR100209979B1 (de) |
| DE (1) | DE69617651T2 (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09146108A (ja) | 1995-11-17 | 1997-06-06 | Semiconductor Energy Lab Co Ltd | 液晶表示装置およびその駆動方法 |
| TWI228625B (en) * | 1995-11-17 | 2005-03-01 | Semiconductor Energy Lab | Display device |
| US6800875B1 (en) | 1995-11-17 | 2004-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix electro-luminescent display device with an organic leveling layer |
| TW309633B (de) | 1995-12-14 | 1997-07-01 | Handotai Energy Kenkyusho Kk | |
| JP3563877B2 (ja) * | 1996-06-21 | 2004-09-08 | 三菱電機株式会社 | 半導体装置 |
| KR100571293B1 (ko) * | 1997-02-07 | 2006-10-11 | 가부시키가이샤 주켄 산교 | 깔개바닥재의설치구조 |
| US6475836B1 (en) * | 1999-03-29 | 2002-11-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2001358153A (ja) * | 2000-06-15 | 2001-12-26 | Fuji Electric Co Ltd | 半導体装置 |
| GB2371922B (en) | 2000-09-21 | 2004-12-15 | Cambridge Semiconductor Ltd | Semiconductor device and method of forming a semiconductor device |
| JP3846796B2 (ja) | 2002-11-28 | 2006-11-15 | 三菱電機株式会社 | 半導体装置 |
| JP4094984B2 (ja) * | 2003-04-24 | 2008-06-04 | 三菱電機株式会社 | 半導体装置 |
| JP4326835B2 (ja) | 2003-05-20 | 2009-09-09 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び半導体装置の製造プロセス評価方法 |
| JP4546796B2 (ja) * | 2004-09-16 | 2010-09-15 | パナソニック株式会社 | 半導体装置 |
| US8618627B2 (en) | 2010-06-24 | 2013-12-31 | Fairchild Semiconductor Corporation | Shielded level shift transistor |
| JP6319761B2 (ja) * | 2013-06-25 | 2018-05-09 | ローム株式会社 | 半導体装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5477578A (en) * | 1977-12-02 | 1979-06-21 | Nec Corp | High frequency high output bipolar transistor |
| JPS59181022A (ja) * | 1983-03-31 | 1984-10-15 | Toshiba Corp | 半導体装置 |
| US4601939A (en) * | 1983-09-20 | 1986-07-22 | International Business Machines Corporation | Composite insulator structure |
| ES2046984T3 (es) * | 1986-12-19 | 1994-02-16 | Philips Nv | Metodo de fabricar un dispositivo semiconductor con tension de encapsulacion reducida. |
| US5061985A (en) * | 1988-06-13 | 1991-10-29 | Hitachi, Ltd. | Semiconductor integrated circuit device and process for producing the same |
| EP0482247A1 (de) * | 1990-10-26 | 1992-04-29 | International Business Machines Corporation | Verfahren zur Herstellung einer integrierten Schaltungsstruktur mit einer dicht mehrschichtigen Metallisierungsstruktur |
| JP3297220B2 (ja) * | 1993-10-29 | 2002-07-02 | 株式会社東芝 | 半導体装置の製造方法および半導体装置 |
| US5439849A (en) * | 1994-02-02 | 1995-08-08 | At&T Corp. | Encapsulation techniques which include forming a thin glass layer onto a polymer layer |
| JP3563877B2 (ja) * | 1996-06-21 | 2004-09-08 | 三菱電機株式会社 | 半導体装置 |
-
1996
- 1996-06-21 JP JP16162096A patent/JP3563877B2/ja not_active Expired - Lifetime
- 1996-07-10 EP EP96111089A patent/EP0814508B1/de not_active Expired - Lifetime
- 1996-07-10 DE DE69617651T patent/DE69617651T2/de not_active Expired - Lifetime
- 1996-08-22 US US08/701,291 patent/US5731628A/en not_active Expired - Lifetime
- 1996-11-30 KR KR1019960060272A patent/KR100209979B1/ko not_active Expired - Lifetime
-
1997
- 1997-11-20 US US08/975,290 patent/US5907182A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5907182A (en) | 1999-05-25 |
| KR980005906A (ko) | 1998-03-30 |
| JPH1012607A (ja) | 1998-01-16 |
| DE69617651T2 (de) | 2002-07-18 |
| EP0814508B1 (de) | 2001-12-05 |
| US5731628A (en) | 1998-03-24 |
| KR100209979B1 (ko) | 1999-07-15 |
| JP3563877B2 (ja) | 2004-09-08 |
| EP0814508A1 (de) | 1997-12-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8320 | Willingness to grant licences declared (paragraph 23) |