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DE60324998D1 - Polyimide blends as dielectric substrates for electronic applications, and method therefor - Google Patents

Polyimide blends as dielectric substrates for electronic applications, and method therefor

Info

Publication number
DE60324998D1
DE60324998D1 DE60324998T DE60324998T DE60324998D1 DE 60324998 D1 DE60324998 D1 DE 60324998D1 DE 60324998 T DE60324998 T DE 60324998T DE 60324998 T DE60324998 T DE 60324998T DE 60324998 D1 DE60324998 D1 DE 60324998D1
Authority
DE
Germany
Prior art keywords
method therefor
electronic applications
dielectric substrates
polyimide blends
blends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60324998T
Other languages
German (de)
Inventor
John Donald Summers
Brian Carl Auman
Richard Frederich Sutton Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE60324998D1 publication Critical patent/DE60324998D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE60324998T 2002-09-20 2003-09-22 Polyimide blends as dielectric substrates for electronic applications, and method therefor Expired - Lifetime DE60324998D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/251,134 US6956098B2 (en) 2002-09-20 2002-09-20 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto

Publications (1)

Publication Number Publication Date
DE60324998D1 true DE60324998D1 (en) 2009-01-15

Family

ID=31946459

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60324998T Expired - Lifetime DE60324998D1 (en) 2002-09-20 2003-09-22 Polyimide blends as dielectric substrates for electronic applications, and method therefor

Country Status (5)

Country Link
US (1) US6956098B2 (en)
EP (1) EP1400552B1 (en)
JP (1) JP2004115799A (en)
DE (1) DE60324998D1 (en)
TW (1) TWI258485B (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
JPWO2005051652A1 (en) * 2003-11-26 2007-06-21 Ｄｏｗａホールディングス株式会社 Metal-coated substrate and method for manufacturing the same
JP2005195690A (en) * 2003-12-26 2005-07-21 Toshiba Corp Metal-containing resin particles, resin particles, and manufacturing method of electronic circuit
CN100365158C (en) * 2004-08-17 2008-01-30 同济大学 Preparation method of ultra-thin self-supporting polyimide filter film by physical vapor deposition
WO2006038533A1 (en) 2004-10-05 2006-04-13 Kaneka Corporation Adhesive sheet and copper-clad laminate
JP4548828B2 (en) * 2004-10-29 2010-09-22 Ｄｏｗａホールディングス株式会社 Method for manufacturing metal-coated substrate
EP1867675A4 (en) * 2005-03-28 2010-06-09 Teijin Ltd Aromatic polyimide film and method for producing same
JP2006278664A (en) * 2005-03-29 2006-10-12 Toyobo Co Ltd Multilayer dielectric film for thin film capacitor and its deposition process
KR100786185B1 (en) 2005-12-07 2007-12-21 마이크로코즘 테크놀리지 씨오.,엘티디 Polyamic Acid Composition and Laminates Prepared Using the Same
EP2102268A2 (en) * 2006-12-12 2009-09-23 E.I. Du Pont De Nemours And Company Crystalline encapsulants
US8309627B2 (en) 2007-09-07 2012-11-13 Nexolve Corporation Polymeric coating for the protection of objects
JP2009120796A (en) * 2007-10-22 2009-06-04 Hitachi Chem Co Ltd Heat-resistant polyimide resin, and seamless tubular body, coated film, coated plate and heat-resistant coating material, using the same
US20110084419A1 (en) * 2008-06-02 2011-04-14 Ube Industries, Ltd. Method for producing aromatic polyimide film wherein linear expansion coefficient in transverse direction is lower than linear expansion coefficient in machine direction
KR101142723B1 (en) * 2009-07-31 2012-05-04 에스케이씨코오롱피아이 주식회사 Polyimide film
US9877673B2 (en) * 2010-12-10 2018-01-30 Clinitech, Llc Transdermal sampling and analysis device
JP6600943B2 (en) * 2012-12-21 2019-11-06 日立化成デュポンマイクロシステムズ株式会社 Polyimide precursor, photosensitive resin composition containing the polyimide precursor, pattern cured film manufacturing method using the same, and semiconductor device
US10898116B2 (en) 2013-03-15 2021-01-26 Cambridge Medical Technologies LLC Methods of manufacture to optimize performance of transdermal sampling and analysis device
JP6517146B2 (en) * 2013-11-01 2019-05-22 東レ・デュポン株式会社 Graphite laminate
CN105015099B (en) * 2014-04-30 2017-06-06 台虹科技股份有限公司 Polyimide/metal composite laminated plate and preparation method thereof
US9694569B2 (en) 2014-06-24 2017-07-04 Taiflex Scientific Co., Ltd. Polyimide metal laminated plate and method of making the same
US10511100B2 (en) * 2016-02-02 2019-12-17 Georgia Tech Research Corporation Inkjet printed flexible Van Atta array sensor
US11193031B2 (en) 2017-05-15 2021-12-07 Alpha Assembly Solutions Inc. Dielectric ink composition
US11633129B2 (en) 2019-04-05 2023-04-25 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating redox cofactors
TWI894071B (en) 2019-06-14 2025-08-11 美商杜邦電子股份有限公司 Polymer films and electronic devices
US11375931B2 (en) 2019-08-08 2022-07-05 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating an electrochemical bioassay
KR102396418B1 (en) * 2019-11-29 2022-05-12 피아이첨단소재 주식회사 Polyimide film, manufacturing method thereof, and flexible metal foil clad laminate comprising same
CN119081110A (en) * 2024-05-22 2024-12-06 哈尔滨理工大学 A high temperature corona resistant polyimide based composite dielectric and preparation method thereof

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451971A (en) * 1982-08-02 1984-06-05 Fairchild Camera And Instrument Corporation Lift-off wafer processing
JPS6012744A (en) 1983-07-01 1985-01-23 Hitachi Ltd Semiconductor device
JPS61111359A (en) 1984-11-06 1986-05-29 Ube Ind Ltd Polyamic acid solution composition and polyimide film
JPS61158025A (en) 1984-12-28 1986-07-17 Canon Inc Magnetic recording medium
JPH0768347B2 (en) 1985-09-25 1995-07-26 株式会社日立製作所 Organosilicon-terminated polyimide precursor and method for producing polyimide
JPH0745580B2 (en) 1986-05-16 1995-05-17 宇部興産株式会社 Aromatic polyimide film
JP2847701B2 (en) 1986-11-29 1999-01-20 鐘淵化学工業株式会社 Polyamic acid excellent in thermal dimensional stability and method for producing polyimide comprising the same
JPH0762082B2 (en) 1988-07-29 1995-07-05 宇部興産株式会社 Polyimide film for recording medium and manufacturing method thereof
JP2626827B2 (en) 1990-03-15 1997-07-02 宇部興産株式会社 Polyimide stretch molded article and method for producing the same
US5166308A (en) 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
US5272247A (en) * 1990-10-19 1993-12-21 Hitachi, Ltd. Polyimide precursor, cured product thereof, and processes for producing them
JP2676650B2 (en) 1990-11-02 1997-11-17 宇部興産株式会社 Abrasive sheet and its manufacturing method
US5219977A (en) * 1990-12-17 1993-06-15 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing oxydipthalic dianhydride
US5196500A (en) 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
US5260408A (en) * 1991-10-29 1993-11-09 E. I. Du Pont De Nemours And Company Low thermal expansion coefficient polyimides with improved elongation
US5460890A (en) * 1991-10-30 1995-10-24 E. I. Du Pont De Nemours And Company Biaxially stretched isotropic polyimide film having specific properties
US5356656A (en) 1993-03-26 1994-10-18 Industrial Technology Research Institute Method for manufacturing flexible amorphous silicon solar cell
KR0146671B1 (en) 1994-02-25 1998-08-17 김충환 Cyclosporin-containing powder composition
JP2722333B2 (en) 1995-03-27 1998-03-04 宇部興産株式会社 Manufacturing method of roughened polyimide film
US5958600A (en) 1995-07-10 1999-09-28 Hitachi, Ltd. Circuit board and method of manufacturing the same
US5731088A (en) 1996-06-04 1998-03-24 E. I. Du Pont De Nemours And Company Multilayer polyimide-fluoropolymer insulation having superior cut-through resistance
US5952448A (en) 1996-12-31 1999-09-14 Korea Research Institute Of Chemical Technology Stable precursor of polyimide and a process for preparing the same
JP2982745B2 (en) 1997-06-02 1999-11-29 宇部興産株式会社 Polyimide film
US6201945B1 (en) 1998-01-08 2001-03-13 Xerox Corporation Polyimide and doped metal oxide fuser components
KR100572646B1 (en) * 1998-07-17 2006-04-24 제이에스알 가부시끼가이샤 Polyimide-based composites, electronic components using the composites, and polyimide-based aqueous dispersions
US6653433B2 (en) * 1999-11-24 2003-11-25 E. I. Du Pont De Nemours And Company Polyimide composition having improved peel strength when clad
TW574261B (en) 2000-08-28 2004-02-01 Ube Industries Method of producing through-hole in aromatic polyimide film
US6476177B2 (en) * 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6469126B1 (en) * 2000-12-21 2002-10-22 E. I. Du Pont De Nmeours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476182B1 (en) * 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes

Also Published As

Publication number Publication date
JP2004115799A (en) 2004-04-15
TWI258485B (en) 2006-07-21
US20040058172A1 (en) 2004-03-25
TW200416242A (en) 2004-09-01
EP1400552B1 (en) 2008-12-03
EP1400552A1 (en) 2004-03-24
US6956098B2 (en) 2005-10-18

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