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DE102006032925B8 - Electronic assembly and method for encapsulating electronic components and integrated circuits - Google Patents

Electronic assembly and method for encapsulating electronic components and integrated circuits Download PDF

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Publication number
DE102006032925B8
DE102006032925B8 DE102006032925A DE102006032925A DE102006032925B8 DE 102006032925 B8 DE102006032925 B8 DE 102006032925B8 DE 102006032925 A DE102006032925 A DE 102006032925A DE 102006032925 A DE102006032925 A DE 102006032925A DE 102006032925 B8 DE102006032925 B8 DE 102006032925B8
Authority
DE
Germany
Prior art keywords
integrated circuits
encapsulating
electronic components
electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102006032925A
Other languages
German (de)
Other versions
DE102006032925A1 (en
DE102006032925B4 (en
Inventor
Jürgen Dr. Leib
Hidefumi Dr. Takatsuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102006032925A priority Critical patent/DE102006032925B8/en
Application filed by Schott AG filed Critical Schott AG
Priority to KR1020087030560A priority patent/KR20090031360A/en
Priority to PCT/EP2007/004847 priority patent/WO2008009328A1/en
Priority to JP2009519810A priority patent/JP2009544161A/en
Priority to CA002653918A priority patent/CA2653918A1/en
Priority to CNA2007800238963A priority patent/CN101479844A/en
Priority to US12/307,174 priority patent/US8017435B2/en
Priority to AU2007276494A priority patent/AU2007276494A1/en
Priority to EP07725728A priority patent/EP2041787A1/en
Publication of DE102006032925A1 publication Critical patent/DE102006032925A1/en
Application granted granted Critical
Publication of DE102006032925B4 publication Critical patent/DE102006032925B4/en
Publication of DE102006032925B8 publication Critical patent/DE102006032925B8/en
Priority to US13/231,844 priority patent/US8399293B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
DE102006032925A 2006-07-15 2006-07-15 Electronic assembly and method for encapsulating electronic components and integrated circuits Expired - Fee Related DE102006032925B8 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE102006032925A DE102006032925B8 (en) 2006-07-15 2006-07-15 Electronic assembly and method for encapsulating electronic components and integrated circuits
EP07725728A EP2041787A1 (en) 2006-07-15 2007-06-01 Method for encasing electronic components and integrated circuits
JP2009519810A JP2009544161A (en) 2006-07-15 2007-06-01 Method for housing electronic components and integrated circuits
CA002653918A CA2653918A1 (en) 2006-07-15 2007-06-01 Method for encasing electronic components and integrated circuits
CNA2007800238963A CN101479844A (en) 2006-07-15 2007-06-01 Method for encasing electronic components and integrated circuits
US12/307,174 US8017435B2 (en) 2006-07-15 2007-06-01 Method for packaging electronic devices and integrated circuits
KR1020087030560A KR20090031360A (en) 2006-07-15 2007-06-01 Electronic device and integrated circuit packaging method
PCT/EP2007/004847 WO2008009328A1 (en) 2006-07-15 2007-06-01 Method for encasing electronic components and integrated circuits
AU2007276494A AU2007276494A1 (en) 2006-07-15 2007-06-01 Method for encasing electronic components and integrated circuits
US13/231,844 US8399293B2 (en) 2006-07-15 2011-09-13 Method for packaging electronic devices and integrated circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006062788 2006-07-15
DE102006032925A DE102006032925B8 (en) 2006-07-15 2006-07-15 Electronic assembly and method for encapsulating electronic components and integrated circuits

Publications (3)

Publication Number Publication Date
DE102006032925A1 DE102006032925A1 (en) 2008-01-24
DE102006032925B4 DE102006032925B4 (en) 2008-07-31
DE102006032925B8 true DE102006032925B8 (en) 2008-11-06

Family

ID=38728650

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006032925A Expired - Fee Related DE102006032925B8 (en) 2006-07-15 2006-07-15 Electronic assembly and method for encapsulating electronic components and integrated circuits

Country Status (9)

Country Link
US (2) US8017435B2 (en)
EP (1) EP2041787A1 (en)
JP (1) JP2009544161A (en)
KR (1) KR20090031360A (en)
CN (1) CN101479844A (en)
AU (1) AU2007276494A1 (en)
CA (1) CA2653918A1 (en)
DE (1) DE102006032925B8 (en)
WO (1) WO2008009328A1 (en)

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* Cited by examiner, † Cited by third party
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US7989248B2 (en) * 2009-07-02 2011-08-02 Advanced Microfab, LLC Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
US8390083B2 (en) * 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
US9406580B2 (en) 2011-03-16 2016-08-02 Synaptics Incorporated Packaging for fingerprint sensors and methods of manufacture
JP2012204403A (en) * 2011-03-23 2012-10-22 Toshiba Corp Solid-state imaging device and method of manufacturing the same
TWI479622B (en) * 2011-11-15 2015-04-01 Xintec Inc Chip package and method of forming same
DE102012202727B4 (en) * 2012-02-22 2015-07-02 Vectron International Gmbh Method for connecting a first electronic component to a second component
US9282642B2 (en) * 2012-09-28 2016-03-08 KYOCERA Circuit Solutions, Inc. Wiring board
US9173024B2 (en) * 2013-01-31 2015-10-27 Invensense, Inc. Noise mitigating microphone system
US9847462B2 (en) 2013-10-29 2017-12-19 Point Engineering Co., Ltd. Array substrate for mounting chip and method for manufacturing the same
CN104332452B (en) * 2014-08-20 2017-04-19 深圳市汇顶科技股份有限公司 Chip packaging module
DE102015104410B4 (en) 2015-03-24 2018-09-13 Tdk-Micronas Gmbh pressure sensor
KR101689018B1 (en) * 2015-04-28 2016-12-22 (주) 씨앤아이테크놀로지 EMI Shielding Method of Semiconductor Packages by Pocket on Adhesive-Pad
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
KR102507947B1 (en) * 2015-10-15 2023-03-09 삼성전자주식회사 Case and Electronic device including the same
DE102016113347A1 (en) * 2016-07-20 2018-01-25 Infineon Technologies Ag METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
DE102019101325A1 (en) * 2019-01-17 2020-07-23 USound GmbH Manufacturing process for multiple MEMS transducers
CN111665640B (en) * 2019-03-08 2022-07-26 三赢科技（深圳）有限公司 Structured light projection module and electronic device thereof
DE102020100819A1 (en) * 2020-01-15 2021-07-15 Schott Ag Hermetically sealed, transparent cavity and its housing
DE102020117194B4 (en) 2020-06-30 2023-06-22 Schott Ag Hermetically sealed enclosure and method of making same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0981159A1 (en) * 1998-08-18 2000-02-23 Siemens Building Technologies AG Method for making microconnections, micrelectronic system, and infrared sensor manufactured using the method
US6100108A (en) * 1997-02-17 2000-08-08 Denso Corporation Method of fabricating electronic circuit device
WO2001029529A2 (en) * 1999-10-21 2001-04-26 The Charles Stark Draper Laboratory, Inc. Integrated packaging of micromechanical sensors and control circuits
DE10147648A1 (en) * 2001-09-27 2003-04-17 Berliner Glas Kgaa Production of a passage in a glass pane comprises placing the pane on a negative mold having a recess, pressing and/or drawing the part of the pane lying over the recess of the negative mold, and removing a part of the recess
US20030104651A1 (en) * 2001-12-04 2003-06-05 Samsung Electronics Co., Ltd. Low temperature hermetic sealing method having passivation layer
DE10206919A1 (en) * 2002-02-19 2003-08-28 Infineon Technologies Ag Production of a cover for a region of a substrate used for a SAW or BAW filter or a micromechanical element comprises forming a frame structure in the region of the substrate, and applying a lid structure on the frame structure
US20040017004A1 (en) * 2001-08-17 2004-01-29 Takao Kasai Electronic device and production method therefor

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JPH05121985A (en) * 1991-10-25 1993-05-18 Seiko Epson Corp Manufacture of piezoelectric vibrator
JP3471111B2 (en) 1995-03-20 2003-11-25 三菱電機株式会社 Semiconductor device
US5796165A (en) 1996-03-19 1998-08-18 Matsushita Electronics Corporation High-frequency integrated circuit device having a multilayer structure
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
US6384473B1 (en) 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
JP3438709B2 (en) 2000-08-31 2003-08-18 セイコーエプソン株式会社 Piezoelectric device, method of manufacturing the same, and method of manufacturing piezoelectric oscillator
JP2002171150A (en) * 2000-11-30 2002-06-14 Seiko Epson Corp Package structure of piezoelectric device
JP3896285B2 (en) * 2002-01-24 2007-03-22 三菱電機株式会社 Manufacturing method of semiconductor device
US6806557B2 (en) * 2002-09-30 2004-10-19 Motorola, Inc. Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum
US6929974B2 (en) * 2002-10-18 2005-08-16 Motorola, Inc. Feedthrough design and method for a hermetically sealed microdevice
JP2004271312A (en) 2003-03-07 2004-09-30 Denso Corp Capacitance-type semiconductor sensor device

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
US6100108A (en) * 1997-02-17 2000-08-08 Denso Corporation Method of fabricating electronic circuit device
EP0981159A1 (en) * 1998-08-18 2000-02-23 Siemens Building Technologies AG Method for making microconnections, micrelectronic system, and infrared sensor manufactured using the method
WO2001029529A2 (en) * 1999-10-21 2001-04-26 The Charles Stark Draper Laboratory, Inc. Integrated packaging of micromechanical sensors and control circuits
US20040017004A1 (en) * 2001-08-17 2004-01-29 Takao Kasai Electronic device and production method therefor
DE10147648A1 (en) * 2001-09-27 2003-04-17 Berliner Glas Kgaa Production of a passage in a glass pane comprises placing the pane on a negative mold having a recess, pressing and/or drawing the part of the pane lying over the recess of the negative mold, and removing a part of the recess
US20030104651A1 (en) * 2001-12-04 2003-06-05 Samsung Electronics Co., Ltd. Low temperature hermetic sealing method having passivation layer
DE10206919A1 (en) * 2002-02-19 2003-08-28 Infineon Technologies Ag Production of a cover for a region of a substrate used for a SAW or BAW filter or a micromechanical element comprises forming a frame structure in the region of the substrate, and applying a lid structure on the frame structure

Also Published As

Publication number Publication date
WO2008009328A1 (en) 2008-01-24
DE102006032925A1 (en) 2008-01-24
US8017435B2 (en) 2011-09-13
AU2007276494A1 (en) 2008-01-24
CA2653918A1 (en) 2008-01-24
KR20090031360A (en) 2009-03-25
US20100059877A1 (en) 2010-03-11
DE102006032925B4 (en) 2008-07-31
EP2041787A1 (en) 2009-04-01
US20120003791A1 (en) 2012-01-05
CN101479844A (en) 2009-07-08
JP2009544161A (en) 2009-12-10
US8399293B2 (en) 2013-03-19

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Effective date: 20150203