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DE60322808D1 - Verfahren zur Herstellung von einer Halbleitervorrichtung und einer Festkörperbildaufnahmevorrichtung - Google Patents

Verfahren zur Herstellung von einer Halbleitervorrichtung und einer Festkörperbildaufnahmevorrichtung

Info

Publication number
DE60322808D1
DE60322808D1 DE60322808T DE60322808T DE60322808D1 DE 60322808 D1 DE60322808 D1 DE 60322808D1 DE 60322808 T DE60322808 T DE 60322808T DE 60322808 T DE60322808 T DE 60322808T DE 60322808 D1 DE60322808 D1 DE 60322808D1
Authority
DE
Germany
Prior art keywords
manufacturing
image pickup
solid state
state image
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60322808T
Other languages
English (en)
Inventor
Tetsuya Itano
Fumihiro Inui
Masanori Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE60322808D1 publication Critical patent/DE60322808D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE60322808T 2002-09-20 2003-09-18 Verfahren zur Herstellung von einer Halbleitervorrichtung und einer Festkörperbildaufnahmevorrichtung Expired - Lifetime DE60322808D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002275019A JP4109944B2 (ja) 2002-09-20 2002-09-20 固体撮像装置の製造方法

Publications (1)

Publication Number Publication Date
DE60322808D1 true DE60322808D1 (de) 2008-09-25

Family

ID=31944600

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60322808T Expired - Lifetime DE60322808D1 (de) 2002-09-20 2003-09-18 Verfahren zur Herstellung von einer Halbleitervorrichtung und einer Festkörperbildaufnahmevorrichtung

Country Status (7)

Country Link
US (3) US7087983B2 (de)
EP (1) EP1401023B1 (de)
JP (1) JP4109944B2 (de)
KR (1) KR100533400B1 (de)
CN (1) CN1252800C (de)
DE (1) DE60322808D1 (de)
TW (1) TWI228824B (de)

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JP3890333B2 (ja) * 2004-02-06 2007-03-07 キヤノン株式会社 固体撮像装置
JP4646575B2 (ja) 2004-08-31 2011-03-09 キヤノン株式会社 半導体装置の製造方法
JP2006203032A (ja) * 2005-01-21 2006-08-03 Victor Co Of Japan Ltd 素子の製造方法
JP4508891B2 (ja) * 2005-01-28 2010-07-21 キヤノン株式会社 光電変換装置、マルチチップ型イメージセンサ、密着型イメージセンサおよび画像読取装置
JP4852263B2 (ja) * 2005-06-03 2012-01-11 株式会社ニューフレアテクノロジー 半導体装置の製造方法と、半導体装置のチップパタンの補正プログラム
KR20070093335A (ko) * 2006-03-13 2007-09-18 마쯔시다덴기산교 가부시키가이샤 고체 촬상장치 및 그 구동방법
KR100881200B1 (ko) * 2007-07-30 2009-02-05 삼성전자주식회사 씨모스 이미지 센서 및 그 제조방법
US8035716B2 (en) * 2008-06-13 2011-10-11 Omnivision Technologies, Inc. Wide aperture image sensor pixel
WO2012119105A2 (en) * 2011-03-02 2012-09-07 Texas Instruments Incorporated Hybrid pitch-split pattern-split litrography process
JP2013033870A (ja) * 2011-08-02 2013-02-14 Canon Inc 半導体デバイスおよびその製造方法
JP2013182943A (ja) * 2012-02-29 2013-09-12 Canon Inc 固体撮像装置の製造方法
JP5768073B2 (ja) * 2013-02-27 2015-08-26 ルネサスエレクトロニクス株式会社 固体撮像素子の製造方法及び固体撮像素子
JP5855695B2 (ja) * 2014-03-24 2016-02-09 ルネサスエレクトロニクス株式会社 固体撮像素子の製造方法及び固体撮像素子
KR102171022B1 (ko) * 2014-05-14 2020-10-28 삼성전자주식회사 픽셀 간 간섭 영향을 개선한 이미지 센서
US9741669B2 (en) * 2016-01-26 2017-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Forming large chips through stitching
JP2017183658A (ja) * 2016-03-31 2017-10-05 ソニー株式会社 固体撮像素子、撮像装置、および電子機器
JP7404317B2 (ja) 2021-08-13 2023-12-25 キヤノン株式会社 液体吐出ヘッド用基板の製造方法および液体吐出ヘッドの製造方法

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JPS5710926A (en) * 1980-06-25 1982-01-20 Toshiba Corp Manufacture of semiconductor device
EP0440470B1 (de) * 1990-02-02 1996-12-18 Canon Kabushiki Kaisha Belichtungsverfahren
US5561317A (en) * 1990-08-24 1996-10-01 Canon Kabushiki Kaisha Method of manufacturing semiconductor devices
JP2902506B2 (ja) 1990-08-24 1999-06-07 キヤノン株式会社 半導体装置の製造方法及び半導体装置
JPH04326507A (ja) 1991-04-25 1992-11-16 Canon Inc 半導体露光方法
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JP3085259B2 (ja) * 1997-09-17 2000-09-04 日本電気株式会社 露光パターン及びその発生方法
US6369853B1 (en) * 1997-11-13 2002-04-09 Foveon, Inc. Intra-pixel frame storage element, array, and electronic shutter method suitable for electronic still camera applications
US6977684B1 (en) * 1998-04-30 2005-12-20 Canon Kabushiki Kaisha Arrangement of circuits in pixels, each circuit shared by a plurality of pixels, in image sensing apparatus
US6192290B1 (en) * 1998-05-21 2001-02-20 Lucent Technologies Inc. System and method of manufacturing semicustom integrated circuits using reticle primitives from a library and interconnect reticles
KR100699941B1 (ko) * 1998-10-23 2007-03-26 가부시키가이샤 히타치세이사쿠쇼 반도체장치의 제조방법과 그에 적합한 마스크의 작성방법
US6073343A (en) * 1998-12-22 2000-06-13 General Electric Company Method of providing a variable guard ring width between detectors on a substrate
US6833234B1 (en) * 2000-08-04 2004-12-21 Massachusetts Institute Of Technology Stereolithographic patterning with variable size exposure areas
JP4507392B2 (ja) * 2000-11-15 2010-07-21 株式会社ニコン 電子カメラ
US6580106B2 (en) * 2001-01-12 2003-06-17 Isetex. Inc CMOS image sensor with complete pixel reset without kTC noise generation
JP5144863B2 (ja) * 2001-06-29 2013-02-13 株式会社オーク製作所 多重露光描画方法及び多重露光描画装置
JP3940310B2 (ja) * 2002-04-04 2007-07-04 株式会社日立ハイテクノロジーズ 電子ビーム描画方法及び描画装置、並びにこれを用いた半導体製造方法
JP4326507B2 (ja) 2005-07-11 2009-09-09 株式会社トプコン レンズ周縁加工装置

Also Published As

Publication number Publication date
JP4109944B2 (ja) 2008-07-02
KR100533400B1 (ko) 2005-12-02
EP1401023B1 (de) 2008-08-13
CN1495855A (zh) 2004-05-12
TW200414526A (en) 2004-08-01
EP1401023A2 (de) 2004-03-24
JP2004111802A (ja) 2004-04-08
US20050212096A1 (en) 2005-09-29
US8183084B2 (en) 2012-05-22
EP1401023A3 (de) 2006-03-15
US20110045632A1 (en) 2011-02-24
KR20040025836A (ko) 2004-03-26
US20040126934A1 (en) 2004-07-01
US7838957B2 (en) 2010-11-23
CN1252800C (zh) 2006-04-19
TWI228824B (en) 2005-03-01
US7087983B2 (en) 2006-08-08

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