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DE60316624D1 - Anlage zum Behandeln von Substraten - Google Patents

Anlage zum Behandeln von Substraten

Info

Publication number
DE60316624D1
DE60316624D1 DE60316624T DE60316624T DE60316624D1 DE 60316624 D1 DE60316624 D1 DE 60316624D1 DE 60316624 T DE60316624 T DE 60316624T DE 60316624 T DE60316624 T DE 60316624T DE 60316624 D1 DE60316624 D1 DE 60316624D1
Authority
DE
Germany
Prior art keywords
vacuum
process chamber
plant
substrates
permitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60316624T
Other languages
English (en)
Other versions
DE60316624T2 (de
Inventor
Marinus Franciscus Johan Evers
Peter Brier
Leonardus Peterus Mari Clijsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OTB Solar BV
Original Assignee
OTB Group BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OTB Group BV filed Critical OTB Group BV
Application granted granted Critical
Publication of DE60316624D1 publication Critical patent/DE60316624D1/de
Publication of DE60316624T2 publication Critical patent/DE60316624T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • H10P72/3304—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H10P72/3314—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60316624T 2002-05-21 2003-05-20 Anlage zum Behandeln von Substraten Expired - Lifetime DE60316624T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1020633A NL1020633C2 (nl) 2002-05-21 2002-05-21 Samenstel voor het behandelen van substraten.
NL1020633 2002-05-21

Publications (2)

Publication Number Publication Date
DE60316624D1 true DE60316624D1 (de) 2007-11-15
DE60316624T2 DE60316624T2 (de) 2008-07-24

Family

ID=29398574

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60316624T Expired - Lifetime DE60316624T2 (de) 2002-05-21 2003-05-20 Anlage zum Behandeln von Substraten

Country Status (9)

Country Link
US (1) US7351292B2 (de)
EP (1) EP1365040B1 (de)
JP (1) JP4578784B2 (de)
KR (1) KR20030091719A (de)
AT (1) ATE374847T1 (de)
DE (1) DE60316624T2 (de)
ES (1) ES2292901T3 (de)
NL (1) NL1020633C2 (de)
TW (1) TWI248980B (de)

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JP4712379B2 (ja) 2002-07-22 2011-06-29 ブルックス オートメーション インコーポレイテッド 基板処理装置
US7959395B2 (en) 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
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US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
US7354845B2 (en) * 2004-08-24 2008-04-08 Otb Group B.V. In-line process for making thin film electronic devices
KR101032438B1 (ko) * 2004-05-31 2011-05-03 엘지디스플레이 주식회사 액정표시패널의 제조장치
US7297397B2 (en) * 2004-07-26 2007-11-20 Npa Coatings, Inc. Method for applying a decorative metal layer
US7611322B2 (en) * 2004-11-18 2009-11-03 Intevac, Inc. Processing thin wafers
US20060102078A1 (en) * 2004-11-18 2006-05-18 Intevac Inc. Wafer fab
WO2007067031A1 (en) * 2005-12-07 2007-06-14 Otb Group B.V. System and method for coating products, and a product obtained with such a system and method
WO2007067030A1 (en) * 2005-12-07 2007-06-14 Otb Group B.V. System and method for coating substrates and obtained products
WO2009060540A1 (ja) * 2007-11-09 2009-05-14 Canon Anelva Corporation インライン型ウェハ搬送装置
CN101441278A (zh) * 2007-11-20 2009-05-27 鸿富锦精密工业（深圳）有限公司 固持装置及固持方法
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
NL2001910C (en) * 2008-08-22 2010-03-10 Otb Solar Bv Conveyor assembly and method for conveying a substrate.
US20100162954A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Integrated facility and process chamber for substrate processing
US20100162955A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Systems and methods for substrate processing
US8367565B2 (en) * 2008-12-31 2013-02-05 Archers Inc. Methods and systems of transferring, docking and processing substrates
US7897525B2 (en) * 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
US8101054B2 (en) * 2009-05-28 2012-01-24 Wd Media, Inc. Magnetic particle trapper for a disk sputtering system
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
NL2003514C2 (en) * 2009-09-18 2011-03-21 Otb Solar Bv Thin film deposition apparatus and method for the same.
US8865259B2 (en) * 2010-04-26 2014-10-21 Singulus Mocvd Gmbh I.Gr. Method and system for inline chemical vapor deposition
NL2006113C2 (en) 2011-02-01 2012-08-02 Otb Solar Bv Water inspection system.
CN103205725A (zh) * 2012-01-17 2013-07-17 上海北玻镀膜技术工业有限公司 单元式溅射抽气模块
SG10201608512QA (en) 2012-04-19 2016-12-29 Intevac Inc Dual-mask arrangement for solar cell fabrication
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
EP2852469B1 (de) * 2012-04-26 2019-04-24 Intevac, Inc. Systemarchitektur für eine vakuumbehandlung
EP2746201B1 (de) 2012-12-21 2015-09-30 Robert Bosch Gmbh Vorrichtung und Verfahren zur Förderung von Trägern in einer Maschine
EP2746880B1 (de) * 2012-12-21 2018-04-25 Robert Bosch Gmbh Ladungsträgersynchronisierung eines Fördersystems einer Maschine
EP2746200B2 (de) 2012-12-21 2018-09-12 Robert Bosch Gmbh Vorrichtung und Verfahren zur Steuerung von Trägern in einer Maschine
EP2746882B1 (de) 2012-12-21 2018-09-05 Robert Bosch Gmbh Fördersystem einer Maschine
TWI468543B (zh) * 2013-08-30 2015-01-11 亞智科技股份有限公司 Substrate transfer and processing system and substrate transfer and processing methods
TWI468544B (zh) * 2013-08-30 2015-01-11 Substrate transfer and processing system and its equipment
CN106688088B (zh) 2014-08-05 2020-01-10 因特瓦克公司 注入掩膜及对齐
DE102015113962A1 (de) * 2015-08-24 2017-03-02 Meyer Burger (Germany) Ag Substratbehandlungsvorrichtung
US9862006B2 (en) 2015-12-29 2018-01-09 Solarcity Corporation Systems for levitating a metallic tray
WO2020072507A1 (en) 2018-10-04 2020-04-09 Applied Materials, Inc. Transport system
US11521870B2 (en) * 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber
US20220293435A1 (en) * 2021-03-11 2022-09-15 Applied Materials, Inc. Systems and methods for fabrication of micro-led displays
TWI883497B (zh) * 2023-08-02 2025-05-11 友威科技股份有限公司 雙效電漿蝕刻的連續式製程機構

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Also Published As

Publication number Publication date
US7351292B2 (en) 2008-04-01
EP1365040A1 (de) 2003-11-26
JP2004040089A (ja) 2004-02-05
ES2292901T3 (es) 2008-03-16
DE60316624T2 (de) 2008-07-24
KR20030091719A (ko) 2003-12-03
US20040049308A1 (en) 2004-03-11
ATE374847T1 (de) 2007-10-15
NL1020633C2 (nl) 2003-11-24
EP1365040B1 (de) 2007-10-03
TW200401046A (en) 2004-01-16
TWI248980B (en) 2006-02-11
JP4578784B2 (ja) 2010-11-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: OTB SOLAR B.V., EINDHOVEN, NL