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DE60314164D1 - Prüfverbinder mit anisotroper leitfähigkeit - Google Patents

Prüfverbinder mit anisotroper leitfähigkeit

Info

Publication number
DE60314164D1
DE60314164D1 DE60314164T DE60314164T DE60314164D1 DE 60314164 D1 DE60314164 D1 DE 60314164D1 DE 60314164 T DE60314164 T DE 60314164T DE 60314164 T DE60314164 T DE 60314164T DE 60314164 D1 DE60314164 D1 DE 60314164D1
Authority
DE
Germany
Prior art keywords
conductive
particles
anisotropically conductive
wafer
anisotropically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60314164T
Other languages
English (en)
Other versions
DE60314164T2 (de
Inventor
Ryoji Setaka
Terukazu Kokubo
Koji Seno
Takeo Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60314164D1 publication Critical patent/DE60314164D1/de
Publication of DE60314164T2 publication Critical patent/DE60314164T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H10P74/00—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H10W70/635—
    • H10W70/66—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE60314164T 2002-08-09 2003-08-07 Prüfverbinder mit anisotroper leitfähigkeit Expired - Lifetime DE60314164T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002232203 2002-08-09
JP2002232204 2002-08-09
JP2002232203 2002-08-09
JP2002232204 2002-08-09
PCT/JP2003/010056 WO2004015761A1 (ja) 2002-08-09 2003-08-07 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法

Publications (2)

Publication Number Publication Date
DE60314164D1 true DE60314164D1 (de) 2007-07-12
DE60314164T2 DE60314164T2 (de) 2008-02-07

Family

ID=31719858

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60314164T Expired - Lifetime DE60314164T2 (de) 2002-08-09 2003-08-07 Prüfverbinder mit anisotroper leitfähigkeit

Country Status (9)

Country Link
US (1) US7131851B2 (de)
EP (1) EP1553622B1 (de)
KR (1) KR100714327B1 (de)
CN (1) CN100369226C (de)
AT (1) ATE363729T1 (de)
AU (1) AU2003254854A1 (de)
DE (1) DE60314164T2 (de)
TW (1) TWI239404B (de)
WO (1) WO2004015761A1 (de)

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JP3573120B2 (ja) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品
US7288950B2 (en) * 2002-08-07 2007-10-30 Hoya Corporation Contacting component, method of producing the same, and test tool having the contacting component
EP1553622B1 (de) 2002-08-09 2007-05-30 JSR Corporation Prüfverbinder mit anisotroper leitfähigkeit
CN1765032A (zh) * 2003-03-26 2006-04-26 Jsr株式会社 各向异性导电连接器、导电膏组分、探针部件、以及晶片检查装置和晶片检查方法
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
CN1806368B (zh) * 2003-06-12 2010-09-01 Jsr株式会社 各向异性导电连接器装置及其制造方法以及电路装置的检查装置
US20060177971A1 (en) * 2004-01-13 2006-08-10 Jsr Corporation Anisotropically conductive connector, production process thereof and application product thereof
EP1806589A4 (de) * 2004-10-29 2012-02-29 Jsr Corp Sondenglied zur wafer-inspektion, sondenkarte zur wafer-inspektion und wafer-inspektionsgeräte
EP1811310A4 (de) * 2004-11-12 2012-02-29 Jsr Corp Sondenglied zur waferinspektion, sondenkarten zu waferinspektion und wafer-inspektionsvorrichtung
US7442049B2 (en) * 2005-02-09 2008-10-28 International Business Machines Corporation Electrical connecting device and method of forming same
US7052290B1 (en) * 2005-08-10 2006-05-30 Sony Ericsson Mobile Communications Ab Low profile connector for electronic interface modules
EP2015399A4 (de) * 2006-04-11 2013-01-30 Jsr Corp Anisotroper leitfähiger verbinder und anisotrope leitfähige verbinderanordnung
JP4913523B2 (ja) * 2006-09-29 2012-04-11 北陸電気工業株式会社 回路基板相互接続用コネクタ装置
KR100875142B1 (ko) 2007-01-22 2008-12-22 리노공업주식회사 검사용 탐침 장치
US8723537B2 (en) * 2008-02-26 2014-05-13 Denki Kagaku Kogyo Kabushiki Kaisha Probe inspecting method and curable resin composition
US8419448B2 (en) * 2009-03-05 2013-04-16 Polymatech Co., Ltd. Elastic connector, method of manufacturing elastic connector, and electric connection tool
JP5880428B2 (ja) * 2012-12-28 2016-03-09 株式会社オートネットワーク技術研究所 カードエッジコネクタ
JP6476747B2 (ja) * 2014-10-28 2019-03-06 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体
US9820664B2 (en) 2014-11-20 2017-11-21 Biosense Webster (Israel) Ltd. Catheter with high density electrode spine array
US10537259B2 (en) 2015-06-29 2020-01-21 Biosense Webster (Israel) Ltd. Catheter having closed loop array with in-plane linear electrode portion
US9949656B2 (en) 2015-06-29 2018-04-24 Biosense Webster (Israel) Ltd. Catheter with stacked spine electrode assembly
US10575742B2 (en) 2015-06-30 2020-03-03 Biosense Webster (Israel) Ltd. Catheter having closed electrode assembly with spines of uniform length
KR101959536B1 (ko) * 2016-04-05 2019-03-18 주식회사 아이에스시 이종의 입자가 혼합된 도전성 입자를 포함하는 이방도전성 시트
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
WO2019191621A1 (en) 2018-03-30 2019-10-03 Samtec, Inc. Electrically conductive vias and methods for producing same
JP7405337B2 (ja) * 2018-10-11 2023-12-26 積水ポリマテック株式会社 電気接続シート、及び端子付きガラス板構造
KR102046283B1 (ko) * 2019-07-29 2019-11-18 주식회사 새한마이크로텍 이방 전도성 시트
TW202450042A (zh) * 2019-09-30 2024-12-16 美商山姆科技公司 導電通孔和其製造方法
WO2021107484A1 (ko) 2019-11-26 2021-06-03 주식회사 스노우 도전성 입자 및 이를 갖는 검사용 소켓
KR102195339B1 (ko) * 2019-11-26 2020-12-24 김규선 도전성 입자
KR102220172B1 (ko) * 2020-03-03 2021-02-25 (주)티에스이 신호 전송 커넥터
KR20220164169A (ko) * 2021-06-04 2022-12-13 주식회사 스노우 도전성 입자 및 이를 포함하는 검사용 소켓
CN114286261B (zh) * 2021-12-30 2024-11-22 歌尔股份有限公司 振膜及其制备方法、发声装置、电子设备
CN114302302B (zh) * 2021-12-30 2024-02-02 歌尔股份有限公司 振膜及其制备方法、发声装置、电子设备
CN114268887B (zh) * 2021-12-30 2024-10-01 歌尔股份有限公司 振膜及其制备方法、发声装置、电子设备
CN114222227B (zh) * 2021-12-30 2024-06-11 歌尔股份有限公司 振膜及其制备方法、发声装置、电子设备

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JP2737647B2 (ja) * 1994-03-10 1998-04-08 カシオ計算機株式会社 異方導電性接着剤およびそれを用いた導電接続構造
KR0122107B1 (ko) * 1994-06-04 1997-12-05 김광호 저전력 셀프리프레쉬 및 번-인 기능을 가지는 반도체메모리장치
KR100247149B1 (ko) * 1997-04-23 2000-03-15 김봉노 제국기의 교반 및 입,출곡장치
JP3541777B2 (ja) * 2000-03-15 2004-07-14 ソニーケミカル株式会社 異方性導電接続材料
KR20030078870A (ko) * 2000-12-08 2003-10-08 제이에스알 가부시끼가이샤 이방 도전성 시트 및 웨이퍼 검사 장치
JP3543765B2 (ja) * 2000-12-28 2004-07-21 Ｊｓｒ株式会社 ウエハ検査用プローブ装置
EP1553622B1 (de) 2002-08-09 2007-05-30 JSR Corporation Prüfverbinder mit anisotroper leitfähigkeit
AU2003247705A1 (en) * 2003-07-02 2005-02-15 Paricon Technologies Corporation Pin-array, separable, compliant electrical contact member

Also Published As

Publication number Publication date
WO2004015761A1 (ja) 2004-02-19
ATE363729T1 (de) 2007-06-15
CN1675756A (zh) 2005-09-28
AU2003254854A1 (en) 2004-02-25
CN100369226C (zh) 2008-02-13
TWI239404B (en) 2005-09-11
DE60314164T2 (de) 2008-02-07
EP1553622A4 (de) 2006-05-24
KR100714327B1 (ko) 2007-05-04
EP1553622B1 (de) 2007-05-30
US20050272282A1 (en) 2005-12-08
EP1553622A1 (de) 2005-07-13
KR20050027251A (ko) 2005-03-18
US7131851B2 (en) 2006-11-07
TW200408816A (en) 2004-06-01

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