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DE60305114D1 - Imidsiliconharz und Verfahren zu dessen Herstellung - Google Patents

Imidsiliconharz und Verfahren zu dessen Herstellung

Info

Publication number
DE60305114D1
DE60305114D1 DE60305114T DE60305114T DE60305114D1 DE 60305114 D1 DE60305114 D1 DE 60305114D1 DE 60305114 T DE60305114 T DE 60305114T DE 60305114 T DE60305114 T DE 60305114T DE 60305114 D1 DE60305114 D1 DE 60305114D1
Authority
DE
Germany
Prior art keywords
preparation
silicone resin
imide silicone
imide
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60305114T
Other languages
English (en)
Other versions
DE60305114T2 (de
Inventor
Michihiro Sugo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE60305114D1 publication Critical patent/DE60305114D1/de
Publication of DE60305114T2 publication Critical patent/DE60305114T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09D179/085Unsaturated polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • C08G73/125Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE60305114T 2002-09-04 2003-09-03 Imidsiliconharz und Verfahren zu dessen Herstellung Expired - Lifetime DE60305114T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002259317A JP2004099638A (ja) 2002-09-04 2002-09-04 イミドシリコーン樹脂およびその製造方法
JP2002259317 2002-09-04

Publications (2)

Publication Number Publication Date
DE60305114D1 true DE60305114D1 (de) 2006-06-14
DE60305114T2 DE60305114T2 (de) 2006-11-30

Family

ID=31712314

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60305114T Expired - Lifetime DE60305114T2 (de) 2002-09-04 2003-09-03 Imidsiliconharz und Verfahren zu dessen Herstellung

Country Status (5)

Country Link
US (1) US7256248B2 (de)
EP (1) EP1396515B1 (de)
JP (1) JP2004099638A (de)
KR (1) KR100938043B1 (de)
DE (1) DE60305114T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3952194B2 (ja) * 2003-06-02 2007-08-01 信越化学工業株式会社 シロキサン共重合体及びその製造方法並びにそれを用いた熱硬化性樹脂組成物
KR101235808B1 (ko) 2007-08-27 2013-02-21 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
JP2012025903A (ja) * 2010-07-27 2012-02-09 Nitto Denko Corp 熱可塑性シリコーン樹脂用組成物
US8592546B2 (en) * 2010-08-09 2013-11-26 Hitachi Chemical Company, Ltd. Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same
US11497681B2 (en) 2012-02-28 2022-11-15 Corning Incorporated Glass articles with low-friction coatings
SG10201806654PA (en) 2012-02-28 2018-09-27 Corning Inc Glass articles with low-friction coatings
US10737973B2 (en) 2012-02-28 2020-08-11 Corning Incorporated Pharmaceutical glass coating for achieving particle reduction
US10273048B2 (en) 2012-06-07 2019-04-30 Corning Incorporated Delamination resistant glass containers with heat-tolerant coatings
US9034442B2 (en) 2012-11-30 2015-05-19 Corning Incorporated Strengthened borosilicate glass containers with improved damage tolerance
EP3189017B1 (de) 2014-09-05 2022-11-16 Corning Incorporated Glasartikel und verfahren zur verbesserung der zuverlässigkeit von glasartikeln
EP3150564B1 (de) 2015-09-30 2018-12-05 Corning Incorporated Halogenierte chemische polyimidsiloxanzusammensetzungen und glasgegenstände mit halogenierten polylmidsiloxanbeschichtungen mit geringer reibung
EP4008695B1 (de) 2015-10-30 2024-11-20 Corning Incorporated Glasartikel mit gemischtem polymer und metalloxidbeschichtungen
US10308787B2 (en) * 2016-04-05 2019-06-04 Shin-Etsu Chemical Co., Ltd. Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
JP6683559B2 (ja) * 2016-04-05 2020-04-22 信越化学工業株式会社 樹脂組成物、樹脂フィルム、樹脂フィルムの製造方法、半導体装置の製造方法及び半導体装置
JP6616743B2 (ja) * 2016-06-30 2019-12-04 信越化学工業株式会社 シリコーン骨格含有高分子化合物、光硬化性樹脂組成物、光硬化性ドライフィルム、積層体、及びパターン形成方法
WO2018111337A1 (en) 2016-12-16 2018-06-21 Novoset, Llc Resin compositions
JP6856037B2 (ja) 2017-02-03 2021-04-07 信越化学工業株式会社 シリコーン変性ポリベンゾオキサゾール樹脂及びその製造方法
US11472925B2 (en) * 2018-03-22 2022-10-18 Momentive Performance Materials Inc. Silicone polymer
JP7024660B2 (ja) * 2018-08-10 2022-02-24 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
JP2023540736A (ja) 2020-09-04 2023-09-26 コーニング インコーポレイテッド 紫外光を遮断するコーティングされた医薬品包装
CN112694451B (zh) * 2020-12-24 2023-03-07 广东盈骅新材料科技有限公司 改性烯丙基化合物、双马来酰亚胺预聚物及其应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404350A (en) * 1982-07-07 1983-09-13 General Electric Company Silicone-imide copolymers and method for making
US4472565A (en) 1982-11-18 1984-09-18 General Electric Company Silicone-polyimide copolymers, condensation vulcanizable compositions obtained therefrom, and methods for making
US4517342A (en) 1983-06-23 1985-05-14 General Electric Company Heat curable compositions
US4533737A (en) 1984-04-02 1985-08-06 General Electric Company Silicon functionalized norbornane carboxyimide and methods for making
US4522985A (en) 1984-04-27 1985-06-11 General Electric Company Heat curable silicone-polyimide block copolymers
US4595732A (en) * 1984-04-27 1986-06-17 General Electric Company Siloxane imide diols and siloxane imide organic block polymers obtained therefrom
US5094919A (en) 1988-06-30 1992-03-10 Nippon Steel Chemical Co., Ltd. Polyimide copolymers and process for preparing the same
JP2002012667A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP2002012666A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その製造方法およびその組成物

Also Published As

Publication number Publication date
US7256248B2 (en) 2007-08-14
US20040048997A1 (en) 2004-03-11
DE60305114T2 (de) 2006-11-30
KR20040021544A (ko) 2004-03-10
KR100938043B1 (ko) 2010-01-21
JP2004099638A (ja) 2004-04-02
EP1396515A1 (de) 2004-03-10
EP1396515B1 (de) 2006-05-10

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