DE60303140D1 - Optische verbindungsanordnung - Google Patents
Optische verbindungsanordnungInfo
- Publication number
- DE60303140D1 DE60303140D1 DE60303140T DE60303140T DE60303140D1 DE 60303140 D1 DE60303140 D1 DE 60303140D1 DE 60303140 T DE60303140 T DE 60303140T DE 60303140 T DE60303140 T DE 60303140T DE 60303140 D1 DE60303140 D1 DE 60303140D1
- Authority
- DE
- Germany
- Prior art keywords
- chip
- optical
- carrier
- optical connection
- connection arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 title abstract 6
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Optical Communication System (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/254,955 US6793407B2 (en) | 2002-09-25 | 2002-09-25 | Manufacturable optical connection assemblies |
| US254955 | 2002-09-25 | ||
| PCT/EP2003/050388 WO2004029684A1 (en) | 2002-09-25 | 2003-08-28 | Optical connection assemblies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60303140D1 true DE60303140D1 (de) | 2006-03-30 |
| DE60303140T2 DE60303140T2 (de) | 2006-08-31 |
Family
ID=31993415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60303140T Expired - Lifetime DE60303140T2 (de) | 2002-09-25 | 2003-08-28 | Optische verbindungsanordnung |
Country Status (12)
| Country | Link |
|---|---|
| US (2) | US6793407B2 (de) |
| EP (1) | EP1543366B1 (de) |
| JP (1) | JP4378285B2 (de) |
| KR (1) | KR100719410B1 (de) |
| CN (1) | CN100388034C (de) |
| AT (1) | ATE315240T1 (de) |
| AU (1) | AU2003268949A1 (de) |
| DE (1) | DE60303140T2 (de) |
| ES (1) | ES2253697T3 (de) |
| IL (1) | IL167668A (de) |
| TW (3) | TWI269895B (de) |
| WO (1) | WO2004029684A1 (de) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6793407B2 (en) * | 2002-09-25 | 2004-09-21 | International Business Machines Corporation | Manufacturable optical connection assemblies |
| DE50207958D1 (de) * | 2002-12-04 | 2006-10-05 | Infineon Technologies Ag | Bidirektionales sende- und empfangsmodul |
| US6863453B2 (en) * | 2003-01-28 | 2005-03-08 | Emcore Corporation | Method and apparatus for parallel optical transceiver module assembly |
| US7200295B2 (en) * | 2004-12-07 | 2007-04-03 | Reflex Photonics, Inc. | Optically enabled hybrid semiconductor package |
| JP4704126B2 (ja) * | 2005-06-23 | 2011-06-15 | 富士通株式会社 | 光モジュール |
| CN100458484C (zh) * | 2005-12-23 | 2009-02-04 | 国际商业机器公司 | 光电板及其制造方法 |
| DE102006017293A1 (de) * | 2005-12-30 | 2007-07-05 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer optisch pumpbaren Halbleitervorrichtung |
| CN101501543B (zh) * | 2006-06-30 | 2013-04-17 | 应用材料公司 | 晶片等级的光学组件对准 |
| US7344383B1 (en) * | 2006-12-27 | 2008-03-18 | Intel Corporation | Split socket optical interconnect |
| US8526811B2 (en) * | 2009-10-20 | 2013-09-03 | Sumitomo Electric Device Innovations, U.S.A., Inc. | Power monitoring photodiode array with integrated, current sourced reference photodiode |
| US9229169B2 (en) * | 2011-08-16 | 2016-01-05 | International Business Machines Corporation | Lens array optical coupling to photonic chip |
| TWI461775B (zh) * | 2012-09-26 | 2014-11-21 | Delta Electronics Inc | 光通訊模組及其耦光組接方法 |
| US20140161385A1 (en) * | 2012-12-07 | 2014-06-12 | Telefonaktiebolaget Lm Ericsson (Publ) | Method and Apparatus for Coupling to an Optical Waveguide in a Silicon Photonics Die |
| TW201506481A (zh) * | 2013-07-02 | 2015-02-16 | Sumitomo Bakelite Co | 光模組用構件、光模組及電子機器 |
| US9606308B2 (en) | 2015-02-27 | 2017-03-28 | International Business Machines Corporation | Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow |
| US10025033B2 (en) | 2016-03-01 | 2018-07-17 | Advanced Semiconductor Engineering, Inc. | Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same |
| US10241264B2 (en) | 2016-07-01 | 2019-03-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages |
| WO2018063227A1 (en) * | 2016-09-29 | 2018-04-05 | Intel Corporation | Free air intrasystem interconnect |
| CN111352192B (zh) * | 2018-12-20 | 2021-08-10 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
| TW202240808A (zh) * | 2021-01-08 | 2022-10-16 | 成真股份有限公司 | 使用於積體電路晶片封裝結構中的微型熱導管 |
| CN117588709A (zh) * | 2023-11-22 | 2024-02-23 | 佛山市青松科技股份有限公司 | Led灯具的装配装置及制作led灯具方法 |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3663194A (en) | 1970-05-25 | 1972-05-16 | Ibm | Method for making monolithic opto-electronic structure |
| US4070516A (en) | 1976-10-18 | 1978-01-24 | International Business Machines Corporation | Multilayer module having optical channels therein |
| US5061027A (en) | 1990-09-04 | 1991-10-29 | Motorola, Inc. | Solder-bump attached optical interconnect structure utilizing holographic elements and method of making same |
| US5200631A (en) | 1991-08-06 | 1993-04-06 | International Business Machines Corporation | High speed optical interconnect |
| US5237434A (en) * | 1991-11-05 | 1993-08-17 | Mcnc | Microelectronic module having optical and electrical interconnects |
| EP0548440A1 (de) | 1991-12-23 | 1993-06-30 | International Business Machines Corporation | Zweiteilige Zusammensetzung für optoelektronische Integration |
| US5432630A (en) | 1992-09-11 | 1995-07-11 | Motorola, Inc. | Optical bus with optical transceiver modules and method of manufacture |
| US5420954A (en) | 1993-05-24 | 1995-05-30 | Photonics Research Incorporated | Parallel optical interconnect |
| US5428704A (en) | 1993-07-19 | 1995-06-27 | Motorola, Inc. | Optoelectronic interface and method of making |
| US5384873A (en) | 1993-10-04 | 1995-01-24 | Motorola, Inc. | Optical interface unit and method of making |
| TW255015B (de) | 1993-11-05 | 1995-08-21 | Motorola Inc | |
| US5500540A (en) | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
| US5521992A (en) | 1994-08-01 | 1996-05-28 | Motorola, Inc. | Molded optical interconnect |
| US5545359A (en) | 1994-08-11 | 1996-08-13 | Motorola | Method of making a plastic molded optoelectronic interface |
| US5619359A (en) * | 1994-11-16 | 1997-04-08 | Nec Research Institute, Inc. | Optoelectronic apparatus |
| JP3828179B2 (ja) | 1995-05-12 | 2006-10-04 | 富士通株式会社 | 半導体光検出装置およびその製造方法 |
| JPH0943459A (ja) | 1995-08-01 | 1997-02-14 | Canon Inc | 光モジュール及びその製造方法 |
| US5781682A (en) | 1996-02-01 | 1998-07-14 | International Business Machines Corporation | Low-cost packaging for parallel optical computer link |
| US5774614A (en) | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
| JPH10126002A (ja) | 1996-10-23 | 1998-05-15 | Matsushita Electron Corp | 光伝送モジュール |
| JP3485455B2 (ja) | 1997-10-24 | 2004-01-13 | 京セラ株式会社 | 光モジュール |
| US6056448A (en) | 1998-04-16 | 2000-05-02 | Lockheed Martin Corporation | Vertical cavity surface emitting laser array packaging |
| US6706546B2 (en) * | 1998-10-09 | 2004-03-16 | Fujitsu Limited | Optical reflective structures and method for making |
| US6229712B1 (en) | 1999-03-31 | 2001-05-08 | International Business Machines Corporation | Printed circuit board for coupling surface mounted optoelectric semiconductor devices |
| US6201908B1 (en) | 1999-07-02 | 2001-03-13 | Blaze Network Products, Inc. | Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| US6234687B1 (en) | 1999-08-27 | 2001-05-22 | International Business Machines Corporation | Self-aligning method and interlocking assembly for attaching an optoelectronic device to a coupler |
| AU7885900A (en) | 1999-08-27 | 2001-03-26 | Board Of Regents, The University Of Texas System | Packaging enhanced board level opto-electronic interconnects |
| JP4096469B2 (ja) | 1999-09-09 | 2008-06-04 | 株式会社デンソー | 光受信モジュール及び光受信モジュールの製造方法 |
| US6374004B1 (en) * | 1999-10-14 | 2002-04-16 | Digital Optics Corporation | Optical subassembly |
| JP3741911B2 (ja) | 1999-10-19 | 2006-02-01 | 日本オプネクスト株式会社 | 光素子アレイモジュールおよびその製造方法 |
| KR100347521B1 (ko) * | 2000-01-28 | 2002-08-07 | 한국전자통신연구원 | 실리콘 광학벤치와 이것을 수용하는 플라스틱 리셉터클 및 이것들을 조립한 광부모듈 |
| US6477290B1 (en) * | 2000-02-15 | 2002-11-05 | Optic Net, Inc. | Fiber optic switch using MEMS |
| US6641310B2 (en) * | 2000-04-21 | 2003-11-04 | Teraconnect, Inc. | Fiber optic cable connector |
| DE10023221C2 (de) | 2000-05-08 | 2002-03-14 | Infineon Technologies Ag | Optoelektronisches Kopplungselement und Verfahren zu dessen Herstellung |
| US20020067882A1 (en) | 2000-05-26 | 2002-06-06 | Guilfoyle Peter S. | Virtual optoelectronic crossbar switch |
| US6522798B2 (en) * | 2001-01-27 | 2003-02-18 | Stratalynx Corporation | Modular optoelectric array transducer |
| US6636653B2 (en) | 2001-02-02 | 2003-10-21 | Teravicta Technologies, Inc. | Integrated optical micro-electromechanical systems and methods of fabricating and operating the same |
| EP1384102A4 (de) * | 2001-05-01 | 2005-05-11 | Corona Optical Systems Inc | Ausrichtungsaperturen in einem optisch transparenten substrat |
| US6754407B2 (en) * | 2001-06-26 | 2004-06-22 | Intel Corporation | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| US6676302B2 (en) * | 2001-09-17 | 2004-01-13 | Stratos Lightwave, Inc. | Method of constructing a fiber optics communications module |
| US6661943B2 (en) * | 2002-01-30 | 2003-12-09 | Intel Corporation | Fiber-free optical interconnect system for chip-to-chip signaling |
| US7418163B2 (en) * | 2002-03-28 | 2008-08-26 | Chakravorty Kishore K | Optoelectrical package |
| US6793407B2 (en) * | 2002-09-25 | 2004-09-21 | International Business Machines Corporation | Manufacturable optical connection assemblies |
| US7271461B2 (en) * | 2004-02-27 | 2007-09-18 | Banpil Photonics | Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
-
2002
- 2002-09-25 US US10/254,955 patent/US6793407B2/en not_active Expired - Lifetime
-
2003
- 2003-06-30 TW TW094132567A patent/TWI269895B/zh not_active IP Right Cessation
- 2003-06-30 TW TW092117808A patent/TW200405036A/zh unknown
- 2003-08-28 EP EP03750726A patent/EP1543366B1/de not_active Expired - Lifetime
- 2003-08-28 CN CNB038225514A patent/CN100388034C/zh not_active Expired - Lifetime
- 2003-08-28 KR KR1020057003154A patent/KR100719410B1/ko not_active Expired - Fee Related
- 2003-08-28 JP JP2004539065A patent/JP4378285B2/ja not_active Expired - Lifetime
- 2003-08-28 AU AU2003268949A patent/AU2003268949A1/en not_active Abandoned
- 2003-08-28 DE DE60303140T patent/DE60303140T2/de not_active Expired - Lifetime
- 2003-08-28 AT AT03750726T patent/ATE315240T1/de not_active IP Right Cessation
- 2003-08-28 ES ES03750726T patent/ES2253697T3/es not_active Expired - Lifetime
- 2003-08-28 WO PCT/EP2003/050388 patent/WO2004029684A1/en not_active Ceased
-
2004
- 2004-06-29 US US10/880,289 patent/US8913856B2/en not_active Expired - Lifetime
-
2005
- 2005-03-24 IL IL167668A patent/IL167668A/en unknown
-
2006
- 2006-07-21 TW TW95212848A patent/TWI269086B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1685262A (zh) | 2005-10-19 |
| EP1543366A1 (de) | 2005-06-22 |
| JP2006500625A (ja) | 2006-01-05 |
| KR20050058510A (ko) | 2005-06-16 |
| TW200602706A (en) | 2006-01-16 |
| EP1543366B1 (de) | 2006-01-04 |
| US20040057677A1 (en) | 2004-03-25 |
| KR100719410B1 (ko) | 2007-05-21 |
| CN100388034C (zh) | 2008-05-14 |
| JP4378285B2 (ja) | 2009-12-02 |
| US20040240774A1 (en) | 2004-12-02 |
| TWI269895B (en) | 2007-01-01 |
| AU2003268949A1 (en) | 2004-04-19 |
| ES2253697T3 (es) | 2006-06-01 |
| US8913856B2 (en) | 2014-12-16 |
| TWI269086B (en) | 2006-12-21 |
| TW200405036A (en) | 2004-04-01 |
| US6793407B2 (en) | 2004-09-21 |
| WO2004029684A1 (en) | 2004-04-08 |
| DE60303140T2 (de) | 2006-08-31 |
| ATE315240T1 (de) | 2006-02-15 |
| IL167668A (en) | 2009-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8320 | Willingness to grant licences declared (paragraph 23) |