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DE60300675D1 - Die Verwendung von Lötmetallen auf Nickel-plattierten stromlosen Oberflächen - Google Patents

Die Verwendung von Lötmetallen auf Nickel-plattierten stromlosen Oberflächen

Info

Publication number
DE60300675D1
DE60300675D1 DE60300675T DE60300675T DE60300675D1 DE 60300675 D1 DE60300675 D1 DE 60300675D1 DE 60300675 T DE60300675 T DE 60300675T DE 60300675 T DE60300675 T DE 60300675T DE 60300675 D1 DE60300675 D1 DE 60300675D1
Authority
DE
Germany
Prior art keywords
solder
nickel
plated electroless
electroless
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60300675T
Other languages
English (en)
Other versions
DE60300675T2 (de
Inventor
Iwao Nozawa
Takashi Hori
Daisuke Souma
Takahiro Roppongi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of DE60300675D1 publication Critical patent/DE60300675D1/de
Application granted granted Critical
Publication of DE60300675T2 publication Critical patent/DE60300675T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H05K3/346—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemically Coating (AREA)
DE60300675T 2002-09-25 2003-09-25 Die Verwendung von Lötmetallen auf Nickel-plattierten stromlosen Oberflächen Expired - Lifetime DE60300675T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002278476 2002-09-25
JP2002278476A JP3682654B2 (ja) 2002-09-25 2002-09-25 無電解Ｎｉメッキ部分へのはんだ付け用はんだ合金

Publications (2)

Publication Number Publication Date
DE60300675D1 true DE60300675D1 (de) 2005-06-23
DE60300675T2 DE60300675T2 (de) 2006-04-27

Family

ID=31973265

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60300675T Expired - Lifetime DE60300675T2 (de) 2002-09-25 2003-09-25 Die Verwendung von Lötmetallen auf Nickel-plattierten stromlosen Oberflächen

Country Status (7)

Country Link
US (1) US7132020B2 (de)
EP (1) EP1402988B1 (de)
JP (1) JP3682654B2 (de)
KR (1) KR100567611B1 (de)
AT (1) ATE295769T1 (de)
DE (1) DE60300675T2 (de)
TW (1) TWI270428B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007533457A (ja) * 2003-09-08 2007-11-22 ハネウエル・インターナシヨナル・インコーポレーテツド 電気的相互接続用のドープされた合金、製造方法およびその使用
JP2006032851A (ja) * 2004-07-21 2006-02-02 Mitsui Mining & Smelting Co Ltd 被覆銅、ホイスカの発生抑制方法、プリント配線基板および半導体装置
US20060068218A1 (en) * 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
WO2006131979A1 (ja) * 2005-06-10 2006-12-14 Senju Metal Industry Co., Ltd. 無電解Ｎiめっき部のはんだ付け方法
US20090057909A1 (en) * 2007-06-20 2009-03-05 Flipchip International, Llc Under bump metallization structure having a seed layer for electroless nickel deposition
US8242378B2 (en) 2007-09-21 2012-08-14 Agere Systems Inc. Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an Ni layer which has a low concentration of P, wherein the amount of P in the underlying Ni layer is controlled as a function of the expected volume of the solder mass
US8252677B2 (en) * 2007-09-28 2012-08-28 Intel Corporation Method of forming solder bumps on substrates
EP2340554B1 (de) * 2008-09-18 2017-05-10 Imec Verfahren und systeme zum bonden von materialien
JP5552957B2 (ja) * 2010-08-17 2014-07-16 Ｔｄｋ株式会社 端子構造、プリント配線板、モジュール基板及び電子デバイス
TWI436710B (zh) * 2011-02-09 2014-05-01 村田製作所股份有限公司 Connection structure
CN102248241B (zh) * 2011-05-18 2013-12-04 清华大学 含Co基薄膜的凸点底部金属层与无铅焊点连接的方法
JP6046406B2 (ja) * 2011-07-26 2016-12-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 高温耐性銀コート基体
WO2014097641A1 (ja) 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
US9825209B2 (en) * 2012-12-21 2017-11-21 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing the same
WO2014097643A1 (ja) 2012-12-21 2014-06-26 パナソニック株式会社 電子部品パッケージおよびその製造方法
JP5624696B1 (ja) 2012-12-21 2014-11-12 パナソニック株式会社 電子部品パッケージおよびその製造方法
ES2702152T3 (es) * 2013-04-18 2019-02-27 Senju Metal Industry Co Aleación de soldadura sin plomo
JP2016076534A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 金属ポスト付きプリント配線板およびその製造方法
DE102018105166B4 (de) 2017-11-15 2024-01-18 Taiwan Semiconductor Manufacturing Co., Ltd. Zwei vorrichtungen zu einem halbleiter-package und verfahren zur herstellung eines halbleiter-package
US10529650B2 (en) * 2017-11-15 2020-01-07 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method
WO2020158660A1 (ja) 2019-01-28 2020-08-06 富士電機株式会社 はんだ接合部

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0652072A1 (de) 1993-11-09 1995-05-10 Matsushita Electric Industrial Co., Ltd. Weichlot
JP3423387B2 (ja) * 1993-12-30 2003-07-07 内橋エステック株式会社 電子部品用はんだ合金
US6033488A (en) 1996-11-05 2000-03-07 Samsung Electronics Co., Ltd. Solder alloy
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11267880A (ja) * 1998-03-23 1999-10-05 Ishikawa Kinzoku Kk はんだ合金
US6307160B1 (en) 1998-10-29 2001-10-23 Agilent Technologies, Inc. High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method
JP2000277895A (ja) * 1999-01-21 2000-10-06 Furukawa Electric Co Ltd:The 半田接合方法

Also Published As

Publication number Publication date
TWI270428B (en) 2007-01-11
KR100567611B1 (ko) 2006-04-04
JP3682654B2 (ja) 2005-08-10
EP1402988A1 (de) 2004-03-31
DE60300675T2 (de) 2006-04-27
EP1402988B1 (de) 2005-05-18
KR20040027413A (ko) 2004-04-01
ATE295769T1 (de) 2005-06-15
US7132020B2 (en) 2006-11-07
TW200417436A (en) 2004-09-16
US20040126269A1 (en) 2004-07-01
JP2004114069A (ja) 2004-04-15

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