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DE602008000878D1 - Solution and method for the electrochemical deposition of a metal onto a substrate - Google Patents

Solution and method for the electrochemical deposition of a metal onto a substrate

Info

Publication number
DE602008000878D1
DE602008000878D1 DE602008000878T DE602008000878T DE602008000878D1 DE 602008000878 D1 DE602008000878 D1 DE 602008000878D1 DE 602008000878 T DE602008000878 T DE 602008000878T DE 602008000878 T DE602008000878 T DE 602008000878T DE 602008000878 D1 DE602008000878 D1 DE 602008000878D1
Authority
DE
Germany
Prior art keywords
solution
silica particles
substrate
metal
quaternized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008000878T
Other languages
German (de)
Inventor
Hermann-Josef Middeke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of DE602008000878D1 publication Critical patent/DE602008000878D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

To electroplate a metal layer which has silica particles dispersed therein, a solution and a method for electrochemically depositing a metal on a substrate are provided, wherein the solution contains ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles , said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with the solution.
DE602008000878T 2008-07-15 2008-07-15 Solution and method for the electrochemical deposition of a metal onto a substrate Active DE602008000878D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08075637A EP2145986B1 (en) 2008-07-15 2008-07-15 Solution and method for electrochemically depositing a metal on a substrate

Publications (1)

Publication Number Publication Date
DE602008000878D1 true DE602008000878D1 (en) 2010-05-06

Family

ID=40010705

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008000878T Active DE602008000878D1 (en) 2008-07-15 2008-07-15 Solution and method for the electrochemical deposition of a metal onto a substrate

Country Status (12)

Country Link
US (1) US20110132766A1 (en)
EP (1) EP2145986B1 (en)
JP (1) JP5674655B2 (en)
KR (1) KR20110039438A (en)
CN (1) CN102066622B (en)
AT (1) ATE462025T1 (en)
BR (1) BRPI0915785A2 (en)
CA (1) CA2723827A1 (en)
DE (1) DE602008000878D1 (en)
ES (1) ES2339614T3 (en)
PL (1) PL2145986T3 (en)
WO (1) WO2010006800A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
EP2551375A1 (en) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Electroless nickel plating bath composition
US8871077B2 (en) * 2011-10-14 2014-10-28 GM Global Technology Operations LLC Corrosion-resistant plating system
JP6024714B2 (en) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 Nickel solution for film formation and film forming method using the same
DE102014207778B3 (en) 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Use of a mixture for use in a plating bath or plating bath to produce a bright nickel plating, and to a method of making an article having a bright nickel plating
WO2015199646A1 (en) * 2014-06-23 2015-12-30 Hewlett-Packard Development Company, L.P. Multilayer coatings on substrates
RU2707051C2 (en) * 2014-10-24 2019-11-21 Басф Се Non-ampholytic, quaternizable and water-soluble polymers for modifying surface charge of solid particles
CN104790004A (en) * 2015-03-11 2015-07-22 嘉兴敏惠汽车零部件有限公司 Nickel and/or chromium plated component and manufacturing method thereof
JP6524939B2 (en) * 2016-02-26 2019-06-05 豊田合成株式会社 Nickel plating film and method of manufacturing the same
EP3456870A1 (en) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
PL238262B1 (en) * 2017-12-04 2021-08-02 Zakl Wyrobow Galanteryjnych Spolka Z Ograniczona Odpowiedzialnoscia Method for electrochemical production of multi-layered metallic coatings, preferably nickel coatings, with increased corrosion resistance
DE102018005348B4 (en) * 2018-07-05 2025-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG Contact surfaces with dispersion silver layers
CN108914173B (en) * 2018-07-13 2021-03-23 中国科学院金属研究所 A kind of preparation method of iron-nickel composite coating containing silicon dioxide particles
CN109183131B (en) * 2018-07-16 2020-06-16 东南大学 SiO (silicon dioxide)2Preparation method of base composite super-hydrophobic metal surface
CN112899741B (en) * 2021-01-21 2022-03-15 长春理工大学 Method for processing silica-nickel composite hydrophobic corrosion-resistant coating on metal surface
CN113436775B (en) * 2021-06-23 2022-11-08 中国核动力研究设计院 Method for preparing substrate-free ultrathin nickel-63 radioactive source
CN115012008B (en) * 2022-03-31 2023-09-19 九牧厨卫股份有限公司 Environment-friendly composite coating layer capable of improving adhesive force and preparation method thereof
CN118272877B (en) * 2024-04-07 2024-10-15 深圳御矿新材料有限公司 Nickel-plated strip material for high-strength aluminum-magnesium alloy and production process thereof
CN119530910A (en) * 2024-12-03 2025-02-28 崇辉半导体(江门)有限公司 A process for electroplating rough nickel

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US3866289A (en) * 1969-10-06 1975-02-18 Oxy Metal Finishing Corp Micro-porous chromium on nickel-cobalt duplex composite plates
GB1282373A (en) * 1969-10-15 1972-07-19 A I C Approvvigionamenti Ind C Nickel-chromium electroplating
DE2236443C3 (en) * 1972-07-25 1978-05-24 Elektroschmelzwerk Kempten Gmbh, 8000 Muenchen Aqueous bath for the production of metallic coatings which contain non-metallic, finely divided solids
US3825478A (en) * 1972-10-30 1974-07-23 Oxy Metal Finishing Corp Electrolyte and method for electrodepositing microporous chromium-nickel composite coatings
JPS534498B2 (en) * 1973-06-23 1978-02-17
SU475874A1 (en) 1973-07-24 1977-12-05 Ордена Трудового Красного Знамени Институт Химии И Химической Технологии Ан Литовской Сср Electrolyte for nickel-plating with embedded inert particles
US4222828A (en) * 1978-06-06 1980-09-16 Akzo N.V. Process for electro-codepositing inorganic particles and a metal on a surface
JPS61143597A (en) 1984-12-15 1986-07-01 Okayama Pref Gov Manufacture of zinc-silica composite plated steel material
US4734350A (en) * 1986-12-29 1988-03-29 Xerox Corporation Positively charged developer compositions with modified charge enhancing additives containing amino alcohols
JPS63277797A (en) * 1987-05-11 1988-11-15 Kobe Steel Ltd Composite plating method
JPH01309997A (en) * 1988-06-09 1989-12-14 Kanto Kasei Kogyo Kk Method for obtaining copper-nickel-chromium bright electroplating having excellent corrosion resistance and plating film obtained thereby
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JP2741126B2 (en) * 1991-12-16 1998-04-15 荏原ユージライト株式会社 Nickel-chrome plated products
JPH05331693A (en) * 1992-05-27 1993-12-14 Mitsubishi Heavy Ind Ltd Electroplated steel seet and its manufacture
US5332505A (en) * 1992-10-02 1994-07-26 Betz Laboratories, Inc. Method for inhibiting silica and silicate deposition
JPH06146070A (en) * 1992-10-30 1994-05-27 Toyoda Gosei Co Ltd Formation of ornamental chrome plating film
JPH07278845A (en) * 1994-04-14 1995-10-24 Marui Kogyo Kk Chromium-plated product and its production
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CN1394988A (en) * 2002-08-20 2003-02-05 中国科学院电子学研究所 Multi-layer nickel-plating process by adopting single bath process
CN100513650C (en) * 2003-11-21 2009-07-15 关西工程有限会社 Nickel coated metallic wire, metallic wire processed by wiredrawing, electroplating device and method
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DE102007012578A1 (en) * 2006-09-01 2008-03-06 Bühler PARTEC GmbH Cationically stabilized aqueous silica dispersion, process for their preparation and their use

Also Published As

Publication number Publication date
EP2145986A1 (en) 2010-01-20
US20110132766A1 (en) 2011-06-09
BRPI0915785A2 (en) 2015-11-10
CN102066622A (en) 2011-05-18
ES2339614T3 (en) 2010-05-21
PL2145986T3 (en) 2010-09-30
CN102066622B (en) 2013-03-27
ATE462025T1 (en) 2010-04-15
KR20110039438A (en) 2011-04-18
CA2723827A1 (en) 2010-01-21
JP2011528063A (en) 2011-11-10
JP5674655B2 (en) 2015-02-25
WO2010006800A1 (en) 2010-01-21
EP2145986B1 (en) 2010-03-24

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