[go: up one dir, main page]

BRPI0915785A2 - method for electrochemically depositing a metal on a substrate - Google Patents

method for electrochemically depositing a metal on a substrate

Info

Publication number
BRPI0915785A2
BRPI0915785A2 BRPI0915785A BRPI0915785A BRPI0915785A2 BR PI0915785 A2 BRPI0915785 A2 BR PI0915785A2 BR PI0915785 A BRPI0915785 A BR PI0915785A BR PI0915785 A BRPI0915785 A BR PI0915785A BR PI0915785 A2 BRPI0915785 A2 BR PI0915785A2
Authority
BR
Brazil
Prior art keywords
metal
silica particles
substrate
quaternized
solution
Prior art date
Application number
BRPI0915785A
Other languages
Portuguese (pt)
Inventor
Hermann-Josef Middeke
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI0915785A2 publication Critical patent/BRPI0915785A2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

To electroplate a metal layer which has silica particles dispersed therein, a solution and a method for electrochemically depositing a metal on a substrate are provided, wherein the solution contains ions of the metal to be deposited and silica particles, wherein at least one silicon containing organic moiety is provided to said silica particles , said silicon containing organic moiety comprising at least one functional group selected from the group comprising amino, quaternized ammonium, quaternized phosphonium and quaternized arsonium which imparts the silica particles a positive electric charge while being in contact with the solution.
BRPI0915785A 2008-07-15 2009-07-10 method for electrochemically depositing a metal on a substrate BRPI0915785A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08075637A EP2145986B1 (en) 2008-07-15 2008-07-15 Solution and method for electrochemically depositing a metal on a substrate
PCT/EP2009/005192 WO2010006800A1 (en) 2008-07-15 2009-07-10 Method for electrochemically depositing a metal on a substrate

Publications (1)

Publication Number Publication Date
BRPI0915785A2 true BRPI0915785A2 (en) 2015-11-10

Family

ID=40010705

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0915785A BRPI0915785A2 (en) 2008-07-15 2009-07-10 method for electrochemically depositing a metal on a substrate

Country Status (12)

Country Link
US (1) US20110132766A1 (en)
EP (1) EP2145986B1 (en)
JP (1) JP5674655B2 (en)
KR (1) KR20110039438A (en)
CN (1) CN102066622B (en)
AT (1) ATE462025T1 (en)
BR (1) BRPI0915785A2 (en)
CA (1) CA2723827A1 (en)
DE (1) DE602008000878D1 (en)
ES (1) ES2339614T3 (en)
PL (1) PL2145986T3 (en)
WO (1) WO2010006800A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
EP2551375A1 (en) * 2011-07-26 2013-01-30 Atotech Deutschland GmbH Electroless nickel plating bath composition
US8871077B2 (en) * 2011-10-14 2014-10-28 GM Global Technology Operations LLC Corrosion-resistant plating system
JP6024714B2 (en) * 2013-10-03 2016-11-16 トヨタ自動車株式会社 Nickel solution for film formation and film forming method using the same
DE102014207778B3 (en) 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Use of a mixture for use in a plating bath or plating bath to produce a bright nickel plating, and to a method of making an article having a bright nickel plating
WO2015199646A1 (en) * 2014-06-23 2015-12-30 Hewlett-Packard Development Company, L.P. Multilayer coatings on substrates
RU2707051C2 (en) * 2014-10-24 2019-11-21 Басф Се Non-ampholytic, quaternizable and water-soluble polymers for modifying surface charge of solid particles
CN104790004A (en) * 2015-03-11 2015-07-22 嘉兴敏惠汽车零部件有限公司 Nickel and/or chromium plated component and manufacturing method thereof
JP6524939B2 (en) * 2016-02-26 2019-06-05 豊田合成株式会社 Nickel plating film and method of manufacturing the same
EP3456870A1 (en) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
PL238262B1 (en) * 2017-12-04 2021-08-02 Zakl Wyrobow Galanteryjnych Spolka Z Ograniczona Odpowiedzialnoscia Method for electrochemical production of multi-layered metallic coatings, preferably nickel coatings, with increased corrosion resistance
DE102018005348B4 (en) * 2018-07-05 2025-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG Contact surfaces with dispersion silver layers
CN108914173B (en) * 2018-07-13 2021-03-23 中国科学院金属研究所 A kind of preparation method of iron-nickel composite coating containing silicon dioxide particles
CN109183131B (en) * 2018-07-16 2020-06-16 东南大学 SiO (silicon dioxide)2Preparation method of base composite super-hydrophobic metal surface
CN112899741B (en) * 2021-01-21 2022-03-15 长春理工大学 Method for processing silica-nickel composite hydrophobic corrosion-resistant coating on metal surface
CN113436775B (en) * 2021-06-23 2022-11-08 中国核动力研究设计院 Method for preparing substrate-free ultrathin nickel-63 radioactive source
CN115012008B (en) * 2022-03-31 2023-09-19 九牧厨卫股份有限公司 Environment-friendly composite coating layer capable of improving adhesive force and preparation method thereof
CN118272877B (en) * 2024-04-07 2024-10-15 深圳御矿新材料有限公司 Nickel-plated strip material for high-strength aluminum-magnesium alloy and production process thereof
CN119530910A (en) * 2024-12-03 2025-02-28 崇辉半导体(江门)有限公司 A process for electroplating rough nickel

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL279109A (en) * 1962-05-30
GB1051685A (en) * 1963-03-01
US3866289A (en) * 1969-10-06 1975-02-18 Oxy Metal Finishing Corp Micro-porous chromium on nickel-cobalt duplex composite plates
GB1282373A (en) * 1969-10-15 1972-07-19 A I C Approvvigionamenti Ind C Nickel-chromium electroplating
DE2236443C3 (en) * 1972-07-25 1978-05-24 Elektroschmelzwerk Kempten Gmbh, 8000 Muenchen Aqueous bath for the production of metallic coatings which contain non-metallic, finely divided solids
US3825478A (en) * 1972-10-30 1974-07-23 Oxy Metal Finishing Corp Electrolyte and method for electrodepositing microporous chromium-nickel composite coatings
JPS534498B2 (en) * 1973-06-23 1978-02-17
SU475874A1 (en) 1973-07-24 1977-12-05 Ордена Трудового Красного Знамени Институт Химии И Химической Технологии Ан Литовской Сср Electrolyte for nickel-plating with embedded inert particles
US4222828A (en) * 1978-06-06 1980-09-16 Akzo N.V. Process for electro-codepositing inorganic particles and a metal on a surface
JPS61143597A (en) 1984-12-15 1986-07-01 Okayama Pref Gov Manufacture of zinc-silica composite plated steel material
US4734350A (en) * 1986-12-29 1988-03-29 Xerox Corporation Positively charged developer compositions with modified charge enhancing additives containing amino alcohols
JPS63277797A (en) * 1987-05-11 1988-11-15 Kobe Steel Ltd Composite plating method
JPH01309997A (en) * 1988-06-09 1989-12-14 Kanto Kasei Kogyo Kk Method for obtaining copper-nickel-chromium bright electroplating having excellent corrosion resistance and plating film obtained thereby
BE1002885A7 (en) * 1989-03-03 1991-07-16 Centre Rech Metallurgique Steel product provided with a composite coating and method for depositingsuch a coating
JP2741126B2 (en) * 1991-12-16 1998-04-15 荏原ユージライト株式会社 Nickel-chrome plated products
JPH05331693A (en) * 1992-05-27 1993-12-14 Mitsubishi Heavy Ind Ltd Electroplated steel seet and its manufacture
US5332505A (en) * 1992-10-02 1994-07-26 Betz Laboratories, Inc. Method for inhibiting silica and silicate deposition
JPH06146070A (en) * 1992-10-30 1994-05-27 Toyoda Gosei Co Ltd Formation of ornamental chrome plating film
JPH07278845A (en) * 1994-04-14 1995-10-24 Marui Kogyo Kk Chromium-plated product and its production
JPH10251870A (en) * 1998-03-09 1998-09-22 Marui Kogyo Kk Chrome plate products
JP2000313997A (en) * 1999-04-26 2000-11-14 Osaka Gas Co Ltd Composite plating solution and formation of composite plating coating film
DE10144250A1 (en) * 2001-08-31 2003-04-03 Fraunhofer Ges Forschung Improved mass spectrometric analysis using nanoparticles
DE10164309A1 (en) * 2001-12-28 2003-07-10 Fraunhofer Ges Forschung Improved structured-functional binding matrices for biomolecules
CN1394988A (en) * 2002-08-20 2003-02-05 中国科学院电子学研究所 Multi-layer nickel-plating process by adopting single bath process
CN100513650C (en) * 2003-11-21 2009-07-15 关西工程有限会社 Nickel coated metallic wire, metallic wire processed by wiredrawing, electroplating device and method
US7435450B2 (en) * 2004-01-30 2008-10-14 Hewlett-Packard Development Company, L.P. Surface modification of silica in an aqueous environment
DE102004021092A1 (en) 2004-04-29 2005-11-24 Degussa Ag Use of a cationic silica dispersion as a textile finishing agent
CL2007000734A1 (en) * 2006-03-22 2008-05-02 Grace W R & Co TRANSPARENT INORGANIC OXIDE COATING PRODUCED WHEN PREPARING COMPOSITION OF COATING, INCLUDING INORGANIC AND POLYMER OXIDE PARTICLES, APPLY SUBSTRATE COMPOSITION, FORM COATING AND HEATING COATING FOR ELIMI
DE102007012578A1 (en) * 2006-09-01 2008-03-06 Bühler PARTEC GmbH Cationically stabilized aqueous silica dispersion, process for their preparation and their use

Also Published As

Publication number Publication date
EP2145986A1 (en) 2010-01-20
US20110132766A1 (en) 2011-06-09
CN102066622A (en) 2011-05-18
ES2339614T3 (en) 2010-05-21
PL2145986T3 (en) 2010-09-30
DE602008000878D1 (en) 2010-05-06
CN102066622B (en) 2013-03-27
ATE462025T1 (en) 2010-04-15
KR20110039438A (en) 2011-04-18
CA2723827A1 (en) 2010-01-21
JP2011528063A (en) 2011-11-10
JP5674655B2 (en) 2015-02-25
WO2010006800A1 (en) 2010-01-21
EP2145986B1 (en) 2010-03-24

Similar Documents

Publication Publication Date Title
BRPI0915785A2 (en) method for electrochemically depositing a metal on a substrate
ATE530506T1 (en) METHOD FOR PRODUCING AN ELECTRODE FOR LEAD-ACID BATTERY
WO2011126660A3 (en) Method of forming a negatively charged passivation layer over a diffused p-type region
WO2005089383A3 (en) Corrosion protection using protected electron collector
BR112013001158A2 (en) process of obtaining a material comprising a substrate provided with a coating
WO2012037389A3 (en) Inks with alkali metals for thin film solar cell processes
WO2012034925A8 (en) Diamond electrodes for electrochemical devices
EP2119681A4 (en) GLASS SUBSTRATE FOR SOLAR BATTERY
WO2011109477A3 (en) Template electrode structures for depositing active materials
FR2982422B1 (en) CONDUCTIVE SUBSTRATE FOR PHOTOVOLTAIC CELL
WO2010021524A3 (en) Material for organic electronic device, and organic electronic device using the same
MX2016005353A (en) Printed digital microfluidic devices methods of use and manufacture thereof.
EP2242104A3 (en) Thin-film photovoltaics
WO2009102160A3 (en) Solar cell and mehtod of texturing solar cell
WO2012055749A3 (en) Diffusion barrier layer for thin film solar cell
WO2012050406A3 (en) Separator for electrochemical device and preparation method thereof
EP2369668A3 (en) Metal separator for fuel cell and method of manufacturing the same
WO2009041660A1 (en) Substrate for solar cell and solar cell
WO2011133435A3 (en) Enhanced silicon-tco interface in thin film silicon solar cells using nickel nanowires
WO2013058505A3 (en) Substrate for organic electronic device
EP2458643A4 (en) GLASS SUBSTRATE WITH CONDUCTIVE FILM FOR SOLAR CELL
EA201190323A1 (en) PROTECTIVE COATING, METHOD OF PROTECTING SUBSTRATES AND USING THIS METHOD
WO2014000849A3 (en) Method for coating a substrate with a spray material and functional layer achievable with this method
ATE483832T1 (en) METHOD FOR SURFACE MODIFICATION OF FLAT SUBSTRATES
WO2011003498A3 (en) Method and system for the manipulation of cells

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2376 DE 19-07-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.