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DE602006004624D1 - Chemisch-mechanisches Polierverfahren - Google Patents

Chemisch-mechanisches Polierverfahren

Info

Publication number
DE602006004624D1
DE602006004624D1 DE602006004624T DE602006004624T DE602006004624D1 DE 602006004624 D1 DE602006004624 D1 DE 602006004624D1 DE 602006004624 T DE602006004624 T DE 602006004624T DE 602006004624 T DE602006004624 T DE 602006004624T DE 602006004624 D1 DE602006004624 D1 DE 602006004624D1
Authority
DE
Germany
Prior art keywords
chemical
mechanical polishing
polishing process
mechanical
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006004624T
Other languages
English (en)
Inventor
Hirotaka Shida
Masayuki Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE602006004624D1 publication Critical patent/DE602006004624D1/de
Anticipated expiration legal-status Critical
Active legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01M—CATCHING, TRAPPING OR SCARING OF ANIMALS; APPARATUS FOR THE DESTRUCTION OF NOXIOUS ANIMALS OR NOXIOUS PLANTS
    • A01M1/00—Stationary means for catching or killing insects
    • A01M1/06—Catching insects by using a suction effect
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01M—CATCHING, TRAPPING OR SCARING OF ANIMALS; APPARATUS FOR THE DESTRUCTION OF NOXIOUS ANIMALS OR NOXIOUS PLANTS
    • A01M1/00—Stationary means for catching or killing insects
    • A01M1/02—Stationary means for catching or killing insects with devices or substances, e.g. food, pheronones attracting the insects
    • A01M1/023—Attracting insects by the simulation of a living being, i.e. emission of carbon dioxide, heat, sound waves or vibrations
    • H10P52/403—
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01M—CATCHING, TRAPPING OR SCARING OF ANIMALS; APPARATUS FOR THE DESTRUCTION OF NOXIOUS ANIMALS OR NOXIOUS PLANTS
    • A01M2200/00—Kind of animal
    • A01M2200/01—Insects
    • A01M2200/012—Flying insects

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Engineering & Computer Science (AREA)
  • Insects & Arthropods (AREA)
  • Wood Science & Technology (AREA)
  • Zoology (AREA)
  • Environmental Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
DE602006004624T 2005-02-23 2006-02-22 Chemisch-mechanisches Polierverfahren Active DE602006004624D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005046374 2005-02-23

Publications (1)

Publication Number Publication Date
DE602006004624D1 true DE602006004624D1 (de) 2009-02-26

Family

ID=36579204

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006004624T Active DE602006004624D1 (de) 2005-02-23 2006-02-22 Chemisch-mechanisches Polierverfahren

Country Status (6)

Country Link
US (2) US7560384B2 (de)
EP (1) EP1696011B1 (de)
KR (1) KR101275964B1 (de)
CN (2) CN101537599B (de)
DE (1) DE602006004624D1 (de)
TW (1) TWI413172B (de)

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EP1477538B1 (de) * 2003-05-12 2007-07-25 JSR Corporation Chemisch-mechanisches Poliermittel-Kit und chemisch-mechanisches Polierverfahren unter Verwendung desselben
EP1696011B1 (de) * 2005-02-23 2009-01-07 JSR Corporation Chemisch-mechanisches Polierverfahren
EP1757665B8 (de) * 2005-08-24 2012-04-11 JSR Corporation Wässrige Dispersionsaufschlämmung für chemisch-mechanisches Polierverfahren, Kit zur Herstellung dieser Dispersionsaufschlämmung für ein chemisch-mechanisches Polierverfahren, und Verfahren zur Herstellung von Halbleitervorrichtungen
JP5182483B2 (ja) * 2005-12-16 2013-04-17 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット
JP5013732B2 (ja) * 2006-04-03 2012-08-29 Ｊｓｒ株式会社 化学機械研磨用水系分散体、化学機械研磨方法、化学機械研磨用キット、および化学機械研磨用水系分散体を調製するためのキット
JPWO2007116770A1 (ja) * 2006-04-03 2009-08-20 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット
US8574330B2 (en) * 2006-10-06 2013-11-05 Jsr Corporation Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device
JP2010512657A (ja) * 2006-12-22 2010-04-22 テクノ セミケム シーオー．， エルティーディー． ゼオライトを含有する銅化学機械的研磨組成物
JP4614981B2 (ja) * 2007-03-22 2011-01-19 Ｊｓｒ株式会社 化学機械研磨用水系分散体および半導体装置の化学機械研磨方法
EP2131389A4 (de) * 2007-03-26 2011-06-22 Jsr Corp Wässrige dispersion zum chemisch-mechanischen polieren und verfahren zum chemisch-mechanischen polieren für eine halbleiteranordnung
JP5327427B2 (ja) 2007-06-19 2013-10-30 Ｊｓｒ株式会社 化学機械研磨用水系分散体調製用セット、化学機械研磨用水系分散体の調製方法、化学機械研磨用水系分散体および化学機械研磨方法
JPWO2009031389A1 (ja) * 2007-09-03 2010-12-09 Jsr株式会社 化学機械研磨用水系分散体およびその調製方法、化学機械研磨用水系分散体を調製するためのキット、ならびに半導体装置の化学機械研磨方法
US8211846B2 (en) * 2007-12-14 2012-07-03 Lam Research Group Materials for particle removal by single-phase and two-phase media
KR101562416B1 (ko) * 2008-02-06 2015-10-21 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법
WO2009104517A1 (ja) * 2008-02-18 2009-08-27 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
WO2009104334A1 (ja) * 2008-02-18 2009-08-27 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
US8652350B2 (en) * 2008-02-27 2014-02-18 Jsr Corporation Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method using the same, and method of recycling chemical mechanical polishing aqueous dispersion
JP5472585B2 (ja) 2008-05-22 2014-04-16 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法
US8585825B2 (en) * 2008-10-30 2013-11-19 Lam Research Corporation Acoustic assisted single wafer wet clean for semiconductor wafer process
US8314055B2 (en) * 2008-06-02 2012-11-20 Lam Research Corporation Materials and systems for advanced substrate cleaning
US20100258142A1 (en) * 2009-04-14 2010-10-14 Mark Naoshi Kawaguchi Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate
JP5361306B2 (ja) * 2008-09-19 2013-12-04 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法
CN101684391A (zh) * 2008-09-26 2010-03-31 安集微电子（上海）有限公司 一种化学机械抛光液
EP2346069A4 (de) * 2008-11-07 2012-06-13 Asahi Glass Co Ltd Schleifmittel, polierverfahren und verfahren zur herstellung einer integrierten halbleiterschaltung
US8480920B2 (en) * 2009-04-02 2013-07-09 Jsr Corporation Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method
US8317934B2 (en) * 2009-05-13 2012-11-27 Lam Research Corporation Multi-stage substrate cleaning method and apparatus
SG177270A1 (en) * 2009-07-15 2012-02-28 Lam Res Corp Materials and systems for advanced substrate cleaning
CN102666771A (zh) * 2009-12-31 2012-09-12 第一毛织株式会社 化学机械抛光淤浆组合物以及使用它们的抛光方法
WO2012046183A1 (en) * 2010-10-05 2012-04-12 Basf Se Chemical mechanical polishing (cmp) composition
KR101389235B1 (ko) * 2010-12-24 2014-04-24 히타치가세이가부시끼가이샤 연마액 및 이 연마액을 이용한 기판의 연마 방법
CN102581750B (zh) * 2012-03-31 2015-04-29 天津西美科技有限公司 一种双镶嵌层无蜡研磨抛光模板
JP2013247341A (ja) * 2012-05-29 2013-12-09 Fujimi Inc 研磨用組成物並びにそれを用いた研磨方法及びデバイス製造方法
US9593259B2 (en) * 2012-11-30 2017-03-14 Nitta Haas Incorporated Polishing composition
KR101470978B1 (ko) * 2013-08-01 2014-12-09 주식회사 케이씨텍 구리 연마용 슬러리 조성물
US9238754B2 (en) * 2014-03-11 2016-01-19 Cabot Microelectronics Corporation Composition for tungsten CMP
DE102015206433A1 (de) * 2015-04-10 2016-10-13 Evonik Degussa Gmbh Verfahren zur Herstellung eines Wärmedämmformkörpers
KR101731523B1 (ko) 2015-04-22 2017-04-28 제이에스알 가부시끼가이샤 화학 기계 연마용 처리 조성물, 화학 기계 연마 방법 및 세정 방법
CN109971353B (zh) * 2017-12-27 2021-12-07 安集微电子（上海）有限公司 一种化学机械抛光液
CN115244659A (zh) * 2020-03-13 2022-10-25 福吉米株式会社 研磨用组合物及研磨方法
CN116375352B (zh) * 2022-12-07 2025-07-22 维达力科技股份有限公司 化学抛光试剂及其制备方法和应用

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US5858813A (en) 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
JPH10163141A (ja) 1996-12-02 1998-06-19 Fujimi Inkooporeetetsudo:Kk 銅の研磨用組成物
KR20000024726A (ko) * 1998-10-01 2000-05-06 윤종용 반도체 웨이퍼 연마방법
JP4053165B2 (ja) 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP3179064B2 (ja) * 1999-01-18 2001-06-25 株式会社東京精密 スラリーの供給装置
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
JP3692067B2 (ja) * 2001-11-30 2005-09-07 株式会社東芝 銅のｃｍｐ用研磨スラリーおよびそれを用いた半導体装置の製造方法
JP2004071674A (ja) * 2002-08-02 2004-03-04 Nec Electronics Corp 半導体装置の製造方法
US20040082274A1 (en) * 2002-10-24 2004-04-29 Yaojian Leng Polishing slurry used for copper chemical mechanical polishing (CMP) process
JP2004193377A (ja) * 2002-12-12 2004-07-08 Toshiba Corp 半導体装置の製造方法
CN1540741A (zh) 2003-04-24 2004-10-27 台湾积体电路制造股份有限公司 浅沟渠隔离的平坦化方法
JP4649871B2 (ja) * 2003-05-12 2011-03-16 Ｊｓｒ株式会社 化学機械研磨剤キットを用いた化学機械研磨方法
EP1477538B1 (de) 2003-05-12 2007-07-25 JSR Corporation Chemisch-mechanisches Poliermittel-Kit und chemisch-mechanisches Polierverfahren unter Verwendung desselben
JP2004349426A (ja) * 2003-05-21 2004-12-09 Jsr Corp Ｓｔｉ用化学機械研磨方法
TWI291987B (en) 2003-07-04 2008-01-01 Jsr Corp Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
JP2005203394A (ja) * 2004-01-13 2005-07-28 Nec Electronics Corp 半導体装置の製造方法
EP1696011B1 (de) * 2005-02-23 2009-01-07 JSR Corporation Chemisch-mechanisches Polierverfahren

Also Published As

Publication number Publication date
EP1696011B1 (de) 2009-01-07
TW200731379A (en) 2007-08-16
CN101537599A (zh) 2009-09-23
US7560384B2 (en) 2009-07-14
KR101275964B1 (ko) 2013-06-14
US20060186089A1 (en) 2006-08-24
US20090181540A1 (en) 2009-07-16
EP1696011A1 (de) 2006-08-30
CN100526015C (zh) 2009-08-12
CN101537599B (zh) 2011-06-08
KR20060094047A (ko) 2006-08-28
TWI413172B (zh) 2013-10-21
CN1824462A (zh) 2006-08-30

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Legal Events

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8364 No opposition during term of opposition