DE602006001415D1 - Poliervorrichtung - Google Patents

Poliervorrichtung

Info

Publication number: DE602006001415D1
Authority: DE; Germany
Prior art keywords: polisher
Prior art date: 2005-04-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

DE602006001415T

Other languages

English (en)

Inventor

Tadakazu Miyashita

Yoshikazu Nakamura

Yoshiyuki Nomura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fujikoshi Machinery Corp

Original Assignee

Fujikoshi Machinery Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-04-01

Filing date

2006-03-30

Publication date

2008-07-24

2006-03-30 Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp

2008-07-24 Publication of DE602006001415D1 publication Critical patent/DE602006001415D1/de

Status Active legal-status Critical Current

2026-03-31 Anticipated expiration legal-status Critical

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- H10P72/7608—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
- H10P52/00—
- H10P72/7611—
- H10P72/7624—

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

DE602006001415T 2005-04-01 2006-03-30 Poliervorrichtung Active DE602006001415D1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2005106895A JP4642532B2 (ja)	2005-04-01	2005-04-01	研磨装置

Publications (1)

Publication Number	Publication Date
DE602006001415D1 true DE602006001415D1 (de)	2008-07-24

Family

ID=36615722

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE602006001415T Active DE602006001415D1 (de)	2005-04-01	2006-03-30	Poliervorrichtung

Country Status (8)

Country	Link
US (1)	US7235001B2 (de)
EP (1)	EP1707314B1 (de)
JP (1)	JP4642532B2 (de)
KR (1)	KR101228178B1 (de)
CN (1)	CN100591480C (de)
DE (1)	DE602006001415D1 (de)
MY (1)	MY144252A (de)
TW (1)	TWI377113B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7644922B2 (en) *	2004-06-14	2010-01-12	Wms Gaming Inc.	Gaming terminal with transformable cabinet
JP5033354B2 (ja) *	2006-05-29	2012-09-26	不二越機械工業株式会社	ワークセンタリング装置
JP2009194134A (ja) *	2008-02-14	2009-08-27	Ebara Corp	研磨方法及び研磨装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4944119A (en) *	1988-06-20	1990-07-31	Westech Systems, Inc.	Apparatus for transporting wafer to and from polishing head
US5885138A (en) *	1993-09-21	1999-03-23	Ebara Corporation	Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
JP3580936B2 (ja) *	1996-02-26	2004-10-27	株式会社荏原製作所	ポリッシング装置のプッシャー及びポリッシング装置
US6312312B1 (en) *	1997-10-20	2001-11-06	Ebara Corporation	Polishing apparatus
US6332826B1 (en) *	1997-11-21	2001-12-25	Ebara Corporation	Polishing apparatus
JPH11347992A (ja)	1998-06-02	1999-12-21	Komoda Kogyo:Kk	配管切断システムおよびこのシステムにおいて使用されるコンピュータ読み取り可能な記録媒体
JP3675237B2 (ja) *	1999-07-09	2005-07-27	株式会社東京精密	平面加工装置
US6358126B1 (en) *	2000-05-23	2002-03-19	Ebara Corporation	Polishing apparatus
US6609950B2 (en) *	2000-07-05	2003-08-26	Ebara Corporation	Method for polishing a substrate
JP2002184732A (ja) *	2000-12-12	2002-06-28	Ebara Corp	受け渡し装置
JP3920720B2 (ja) *	2002-03-29	2007-05-30	株式会社荏原製作所	基板受渡し方法、基板受渡し機構及び基板研磨装置
KR100472959B1 (ko) *	2002-07-16	2005-03-10	삼성전자주식회사	언로딩구조가 개선된 반도체 웨이퍼의 표면평탄화설비
US7101253B2 (en) *	2002-08-27	2006-09-05	Applied Materials Inc.	Load cup for chemical mechanical polishing

2005
- 2005-04-01 JP JP2005106895A patent/JP4642532B2/ja not_active Expired - Fee Related
2006
- 2006-03-28 TW TW095110700A patent/TWI377113B/zh not_active IP Right Cessation
- 2006-03-29 KR KR1020060028228A patent/KR101228178B1/ko not_active Expired - Fee Related
- 2006-03-30 MY MYPI20061432A patent/MY144252A/en unknown
- 2006-03-30 DE DE602006001415T patent/DE602006001415D1/de active Active
- 2006-03-30 EP EP06251753A patent/EP1707314B1/de not_active Ceased
- 2006-03-30 US US11/392,697 patent/US7235001B2/en active Active
- 2006-04-03 CN CN200610074767A patent/CN100591480C/zh active Active

Also Published As

Publication number	Publication date
TW200635705A (en)	2006-10-16
CN1840290A (zh)	2006-10-04
US20060223421A1 (en)	2006-10-05
MY144252A (en)	2011-08-29
KR20060105511A (ko)	2006-10-11
JP4642532B2 (ja)	2011-03-02
TWI377113B (en)	2012-11-21
KR101228178B1 (ko)	2013-01-30
JP2006281400A (ja)	2006-10-19
EP1707314B1 (de)	2008-06-11
US7235001B2 (en)	2007-06-26
EP1707314A1 (de)	2006-10-04
CN100591480C (zh)	2010-02-24

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ATE549324T1 (de)	2012-03-15	Tetrahydrobenzoxazine
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DE602005009179D1 (de)	2008-10-02	Telekommunikatiosverbinder
DE602005023501D1 (de)	2010-10-21	Radhausbau
DE602006007847D1 (de)	2009-08-27	Gurtspannanzeige
DE602006002046D1 (de)	2008-09-18	Optometriegerät
DE602006008430D1 (de)	2009-09-24	Fikationseinrichtung
DE602005021060D1 (de)	2010-06-17	Notrufleitweglenkung
DE502006001397D1 (de)	2008-10-02	Lagerbuchse
DE602006007654D1 (de)	2009-08-20	Flüssigkeitejektionsgerät
DE602006001471D1 (de)	2008-07-31	Poliervorrichtung
DE602006001415D1 (de)	2008-07-24	Poliervorrichtung
DE502006000445D1 (de)	2008-04-24	Mulchmähdeck
FI20051311A0 (fi)	2005-12-21	Pilkekone
DE502006004709D1 (de)	2009-10-15	Gurtstraffvorrichtung
FR2891125B1 (fr)	2009-07-17	Caillebotis
DE502006004162D1 (de)	2009-08-20	Fahrzeugtemperiersystem
DE112005003683A5 (de)	2008-05-29	Ejektortriebwerk

Legal Events

Date	Code	Title	Description
2009-07-02	8364	No opposition during term of opposition