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DE602005008096D1 - Vorrichtung zur verkapselung von elektronischen bauteilen - Google Patents

Vorrichtung zur verkapselung von elektronischen bauteilen

Info

Publication number
DE602005008096D1
DE602005008096D1 DE602005008096T DE602005008096T DE602005008096D1 DE 602005008096 D1 DE602005008096 D1 DE 602005008096D1 DE 602005008096 T DE602005008096 T DE 602005008096T DE 602005008096 T DE602005008096 T DE 602005008096T DE 602005008096 D1 DE602005008096 D1 DE 602005008096D1
Authority
DE
Germany
Prior art keywords
electronic components
plastering
packing reel
secured
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602005008096T
Other languages
English (en)
Inventor
Stefan Dick
Michelle Martin
Francois Dessus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sued Chemie Inc
Original Assignee
Sued Chemie Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/996,916 external-priority patent/US7335422B2/en
Application filed by Sued Chemie Inc filed Critical Sued Chemie Inc
Publication of DE602005008096D1 publication Critical patent/DE602005008096D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • H10P34/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Magnetic Treatment Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
DE602005008096T 2004-11-24 2005-11-01 Vorrichtung zur verkapselung von elektronischen bauteilen Expired - Lifetime DE602005008096D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/996,916 US7335422B2 (en) 2002-04-25 2004-11-24 Absorbent polymeric material
US11/005,289 US7389877B2 (en) 2000-08-28 2004-12-06 Apparatus for packaging electronic components including a reel entrained with desiccating material
PCT/US2005/039427 WO2006057776A2 (en) 2004-11-24 2005-11-01 Apparatus for packaging electronic components

Publications (1)

Publication Number Publication Date
DE602005008096D1 true DE602005008096D1 (de) 2008-08-21

Family

ID=36498403

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005008096T Expired - Lifetime DE602005008096D1 (de) 2004-11-24 2005-11-01 Vorrichtung zur verkapselung von elektronischen bauteilen

Country Status (6)

Country Link
US (1) US7389877B2 (de)
EP (1) EP1815729B1 (de)
AT (1) ATE400990T1 (de)
DE (1) DE602005008096D1 (de)
TW (1) TW200626445A (de)
WO (1) WO2006057776A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002096974A (ja) * 2000-09-22 2002-04-02 Oki Electric Ind Co Ltd 搬送用リールとそれを用いた搬送方法、及び電子装置の製造方法
EP1776278A2 (de) * 2004-06-14 2007-04-25 Sports Media, Inc. Behälter und herstellungsverfahren dafür
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
KR20210114378A (ko) * 2018-10-18 2021-09-23 씨에스피 테크놀로지스, 인크. 릴 상에 건조제 혼입된 중합체를 갖는 테이프를 사용하여 전자 부품을 포장하기 위한 장치 및 방법
CN109612990B (zh) * 2018-12-14 2021-04-27 杭州家爽包装材料有限公司 一种任意设定干燥剂包指定失效点的方法及产品
MX2021008431A (es) * 2019-01-14 2021-09-08 Musco Corp Aparato, metodo y sistema para reducir la humedad en dispositivos de iluminacion led.
US11655966B2 (en) 2019-01-14 2023-05-23 Musco Corporation Apparatus, method, and system for reducing moisture in LED lighting fixtures
WO2025083922A1 (ja) * 2023-10-19 2025-04-24 信越ポリマー株式会社 物品の梱包袋及び梱包方法

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US5789044A (en) * 1996-01-24 1998-08-04 Eastman Kodak Company Zeolite molecular sieves for packaging structures
US5702508A (en) * 1996-01-25 1997-12-30 Moratalla; Jose Ceramic desiccant device
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SE516853C2 (sv) 2000-04-28 2002-03-12 Foerpackningsinnovation Norden Transportband för lagring och transport av komponenter samt förfarande för framställning av detta
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Also Published As

Publication number Publication date
EP1815729A2 (de) 2007-08-08
US7389877B2 (en) 2008-06-24
EP1815729B1 (de) 2008-07-09
WO2006057776A2 (en) 2006-06-01
ATE400990T1 (de) 2008-07-15
WO2006057776A3 (en) 2007-01-11
US20050098475A1 (en) 2005-05-12
TW200626445A (en) 2006-08-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: WESTENDORP SOMMER, 80336 MUENCHEN