DE60137387D1 - Verbindungsstruktur - Google Patents

Verbindungsstruktur

Info

Publication number: DE60137387D1
Authority: DE; Germany
Prior art keywords: connecting structure
Prior art date: 2000-09-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60137387T

Other languages

English (en)

Inventor

Yoshinori Murakami

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nissan Motor Co Ltd

Original Assignee

Nissan Motor Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-09-19

Filing date

2001-09-17

Publication date

2009-03-05

2001-09-17 Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd

2009-03-05 Application granted granted Critical

2009-03-05 Publication of DE60137387D1 publication Critical patent/DE60137387D1/de

2021-09-18 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
- H05K2201/0792—Means against parasitic impedance; Means against eddy currents
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10893—Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H10W72/5475—

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Combinations Of Printed Boards (AREA)
Structure Of Printed Boards (AREA)

DE60137387T 2000-09-19 2001-09-17 Verbindungsstruktur Expired - Lifetime DE60137387D1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2000282945A JP3826696B2 (ja)	2000-09-19	2000-09-19	配線構造

Publications (1)

Publication Number	Publication Date
DE60137387D1 true DE60137387D1 (de)	2009-03-05

Family

ID=18767370

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60137387T Expired - Lifetime DE60137387D1 (de)	2000-09-19	2001-09-17	Verbindungsstruktur

Country Status (4)

Country	Link
US (1)	US6641407B2 (de)
EP (2)	EP1191635B1 (de)
JP (1)	JP3826696B2 (de)
DE (1)	DE60137387D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7631242B2 (en)	2001-06-22	2009-12-08	Broadcom Corporation	System, method and computer program product for mitigating burst noise in a communications system
DE10336634B3 (de) *	2003-08-08	2005-02-03	Siemens Ag	Elektronisches Gerät
WO2005119765A2 (en) *	2004-06-02	2005-12-15	Tessera, Inc.	Assembly including vertical and horizontal joined circuit panels
US7658621B2 (en) *	2008-04-17	2010-02-09	Hon Hai Precision Ind. Co., Ltd.	Connector assembly having connecting device
AT506929B1 (de) *	2008-04-29	2012-10-15	Siemens Ag	Anordnung zweier schaltungsträger
US20100254109A1 (en)	2009-03-19	2010-10-07	Olympus Corporation	Mount assembly and method for manufacturing mount assembly
DE102009017621B3 (de) *	2009-04-16	2010-08-19	Semikron Elektronik Gmbh & Co. Kg	Vorrichtung zur Verringerung der Störabstrahlung in einem leistungselektronischen System
JP5097791B2 (ja) *	2010-04-05	2012-12-12	株式会社日立産機システム	電力変換装置
GB2484742B (en) *	2010-10-22	2013-06-12	Murata Power Solutions Milton Keynes Ltd	Electronic component for surface mounting
JPWO2013121732A1 (ja) *	2012-02-15	2015-05-11	パナソニックＩｐマネジメント株式会社	無線モジュール
JP5946339B2 (ja) *	2012-06-27	2016-07-06	双信電機株式会社	ノイズフィルタ
KR102034717B1 (ko)	2013-02-07	2019-10-21	삼성전자주식회사	파워모듈용 기판, 파워모듈용 터미널 및 이들을 포함하는 파워모듈
US9837380B2 (en)	2014-01-28	2017-12-05	Infineon Technologies Austria Ag	Semiconductor device having multiple contact clips
US9468103B2 (en) *	2014-10-08	2016-10-11	Raytheon Company	Interconnect transition apparatus
JP2016092024A (ja) *	2014-10-29	2016-05-23	株式会社豊田自動織機	電子機器
US9660333B2 (en)	2014-12-22	2017-05-23	Raytheon Company	Radiator, solderless interconnect thereof and grounding element thereof
US9780458B2 (en)	2015-10-13	2017-10-03	Raytheon Company	Methods and apparatus for antenna having dual polarized radiating elements with enhanced heat dissipation
US10361485B2 (en)	2017-08-04	2019-07-23	Raytheon Company	Tripole current loop radiating element with integrated circularly polarized feed
US10923830B2 (en) *	2019-01-18	2021-02-16	Pc-Tel, Inc.	Quick solder chip connector for massive multiple-input multiple-output antenna systems
TW202142517A (zh) *	2020-05-12	2021-11-16	台灣愛司帝科技股份有限公司	基板拼接結構、基板拼接系統以及基板拼接方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4878862A (en) *	1988-12-05	1989-11-07	Amp Incorporated	Connector for mating two bus bars
US5037311A (en) *	1989-05-05	1991-08-06	International Business Machines Corporation	High density interconnect strip
FR2753310B1 (fr) *	1996-09-12	1998-12-31	Gandois Jean Marie	Dispositif d'alimentation electrique par plinthe sans pose de cables
US5825633A (en) *	1996-11-05	1998-10-20	Motorola, Inc.	Multi-board electronic assembly including spacer for multiple electrical interconnections
GB9713849D0 (en) *	1997-06-30	1997-09-03	Amp Italia	Capacitance coupled cross-talk suppressing communication connector
DE29805943U1 (de) *	1998-03-26	1998-06-10	ABB Daimler-Benz Transportation (Technology) GmbH, 13627 Berlin	Niederinduktive Verschienung zweier mehrlagiger Stromschienenanordnungen für Stromrichter
US6468090B2 (en) *	1999-09-15	2002-10-22	Fci Americas Technology, Inc.	Low inductance power connector and method of reducing inductance in an electrical connector

2000
- 2000-09-19 JP JP2000282945A patent/JP3826696B2/ja not_active Expired - Fee Related
2001
- 2001-09-17 EP EP01122202A patent/EP1191635B1/de not_active Expired - Lifetime
- 2001-09-17 DE DE60137387T patent/DE60137387D1/de not_active Expired - Lifetime
- 2001-09-17 EP EP05027017A patent/EP1643596A2/de not_active Withdrawn
- 2001-09-19 US US09/955,302 patent/US6641407B2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
US6641407B2 (en)	2003-11-04
JP2002094209A (ja)	2002-03-29
EP1191635A3 (de)	2003-10-15
EP1643596A2 (de)	2006-04-05
US20020037656A1 (en)	2002-03-28
JP3826696B2 (ja)	2006-09-27
EP1191635A2 (de)	2002-03-27
EP1191635B1 (de)	2009-01-14

Publication	Publication Date	Title
DE60133295D1 (de)	2008-04-30	Sulphoniumsalz-verbindung
DE60013305D1 (de)	2004-09-30	Perkolationsvorrichtung
DE60112945D1 (de)	2005-09-29	Schädelkalottenfixiereinrichtung
DE60144317D1 (de)	2011-05-12	Ringverwirbelungsanordnung
DE60129698D1 (de)	2007-09-13	Thrombinrezeptorantagonisten
DE60139356D1 (de)	2009-09-03	Wirbelarthrodesevorrichtung
DE60024877D1 (de)	2006-01-19	Elektrokauterisationskatheter
DE60132227D1 (de)	2008-02-14	Tintenstrahlaufzeichungsmaterial
DE60112185D1 (de)	2005-09-01	Signalartbestimmung
DE50108963D1 (de)	2006-04-20	Schlauchklemme
EP1282428A4 (de)	2007-09-05	Biokompatible macromere
FI20002644A0 (fi)	2000-12-01	Liitäntäalusta
DE60138095D1 (de)	2009-05-07	Viskerales fettmessgerät
DE60135663D1 (de)	2008-10-16	Ngskopplung
DE60124039D1 (de)	2006-12-07	Bildaufzeichungsverfahren
DE50104056D1 (de)	2004-11-18	Gewichtsmanschette
EP1177860A4 (de)	2002-08-07	Schleifwerkzeug
DE60142951D1 (de)	2010-10-14	Evakuationssystem
DE60137387D1 (de)	2009-03-05	Verbindungsstruktur
DE60123981D1 (de)	2006-11-30	Gelenklager
DE60110671D1 (de)	2005-06-16	Umrichterwandler
DE60118868D1 (de)	2006-05-24	Turbomaschinenleitschaufel
DE60135277D1 (de)	2008-09-25	Elektrolumineszenselement
DE60138450D1 (de)	2009-06-04	Elektrolumineszenselement
DE50100817D1 (de)	2003-11-27	Kugelgelenk

Legal Events

Date	Code	Title	Description
2010-02-04	8364	No opposition during term of opposition