DE60111790D1 - Laserschweissverfahren - Google Patents

Laserschweissverfahren

Info

Publication number: DE60111790D1
Authority: DE; Germany
Prior art keywords: laser welding; welding processes; processes; laser; welding
Prior art date: 2000-03-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60111790T

Other languages

English (en)

Other versions

DE60111790T2 (de

Inventor

Susumu Tsukamoto

Isao Kawaguchi

Goro Arakane

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JP MINISTRY OF EDUCATION CULTU

IHI Corp

Original Assignee

JP MINISTRY OF EDUCATION CULTU

Ishikawajima Harima Heavy Industries Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-03-10

Filing date

2001-03-12

Publication date

2005-08-11

2001-03-12 Application filed by JP MINISTRY OF EDUCATION CULTU, Ishikawajima Harima Heavy Industries Co Ltd filed Critical JP MINISTRY OF EDUCATION CULTU

2005-08-11 Application granted granted Critical

2005-08-11 Publication of DE60111790D1 publication Critical patent/DE60111790D1/de

2006-04-20 Publication of DE60111790T2 publication Critical patent/DE60111790T2/de

2021-03-13 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Laser Beam Processing (AREA)

DE60111790T 2000-03-10 2001-03-12 Laserschweissverfahren Expired - Lifetime DE60111790T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2000067816		2000-03-10
JP2000067816A JP4408519B2 (ja)	2000-03-10	2000-03-10	レーザー溶接方法

Publications (2)

Publication Number	Publication Date
DE60111790D1 true DE60111790D1 (de)	2005-08-11
DE60111790T2 DE60111790T2 (de)	2006-04-20

Family

ID=18586951

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60111790T Expired - Lifetime DE60111790T2 (de)	2000-03-10	2001-03-12	Laserschweissverfahren

Country Status (4)

Country	Link
US (1)	US6483072B2 (de)
EP (1)	EP1132168B1 (de)
JP (1)	JP4408519B2 (de)
DE (1)	DE60111790T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW516981B (en) *	2000-12-22	2003-01-11	Koninkl Philips Electronics Nv	Method of laser welding
US6932879B2 (en) *	2002-08-13	2005-08-23	Edison Welding Institute	Method of weldbonding
US6974207B2 (en)	2002-11-19	2005-12-13	Lexmark International, Inc.	Laser welding methods and structures and control therefor including welded inkjet printheads
US20040150688A1 (en) *	2003-01-30	2004-08-05	Kin-Ming Kwan	Measuring laser light transmissivity in a to-be-welded region of a work piece
US20050099449A1 (en) *	2003-11-07	2005-05-12	Tim Frasure	Methods and structures for disassembling inkjet printhead components and control therefor
DE102004041502B4 (de) *	2004-08-27	2012-03-08	Audi Ag	Überlappschweißverfahren mittels Strahlschweißung, insbesondere mittels Laserstrahlschweißung, an beschichteten Blechen, insbesondere an verzinkten Stahlblechen
DE102009056592A1 (de) *	2009-11-30	2011-06-01	V&M Deutschland Gmbh	Verfahren zur Prozessstabilisierung beim Laserschweißen
JP6411013B2 (ja) *	2013-06-14	2018-10-24	日立オートモティブシステムズ株式会社	レーザ溶接方法および燃料噴射弁の製造方法
DE102015224765A1 (de) *	2015-12-10	2017-06-14	Bayerische Motoren Werke Aktiengesellschaft	Verfahren zur Ausbildung einer Schweißnaht, Schweißnaht und Verfahren zur Sichtkontrolle einer Schweißnaht
DE102016204578B3 (de)	2016-03-18	2017-08-17	Trumpf Laser- Und Systemtechnik Gmbh	Laserschweißen von Stahl mit Leistungsmodulation zur Heißrissvermeidung
JP7122171B2 (ja) *	2018-06-20	2022-08-19	コマツＮｔｃ株式会社	３次元造形方法および３次元造形装置
CN113275738B (zh) *	2021-05-12	2023-10-13	深圳市艾雷激光科技有限公司	一种type-c马口铁接头与壳体的焊接方法
US20250128353A1 (en) *	2022-07-08	2025-04-24	Lg Energy Solution, Ltd.	Welding device, welding method, battery manufacturing device and vehicle manufacturing device
CN119347113B (zh) *	2024-10-25	2025-08-26	北京中康增材科技有限公司	一种激光焊接方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2218660B (en) *	1988-05-16	1991-09-25	Lumonics Ltd	Method of material processing using a laser beam
EP0564995B1 (de) *	1992-04-03	1997-09-24	Mitsui Petrochemical Industries, Ltd.	Laserpuls-Ausstrahlungsgerät für bekleidetes metallisches Material
US5665255A (en) *	1995-08-01	1997-09-09	Progressive Tool & Industries Company	Laser welding apparatus and method for high temperature gradient cooling alloys
JPH10223950A (ja) *	1997-02-12	1998-08-21	Amada Eng Center:Kk	連続発振可能なパルスｙａｇレーザ発振器

2000
- 2000-03-10 JP JP2000067816A patent/JP4408519B2/ja not_active Expired - Fee Related
2001
- 2001-03-12 EP EP01302243A patent/EP1132168B1/de not_active Expired - Lifetime
- 2001-03-12 DE DE60111790T patent/DE60111790T2/de not_active Expired - Lifetime
- 2001-03-12 US US09/802,850 patent/US6483072B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US6483072B2 (en)	2002-11-19
JP4408519B2 (ja)	2010-02-03
EP1132168B1 (de)	2005-07-06
JP2001259873A (ja)	2001-09-25
DE60111790T2 (de)	2006-04-20
EP1132168A3 (de)	2002-05-29
EP1132168A2 (de)	2001-09-12
US20020014476A1 (en)	2002-02-07

Publication	Publication Date	Title
DE60140664D1 (de)	2010-01-14	Schweisssystem
DE50107051D1 (de)	2005-09-15	Laser-mikro-dissektionsgerät
DE60119186D1 (de)	2006-06-08	Robotischer Laserzeiger
FI20001907L (fi)	2002-03-01	Hitsausjärjestely ja -menetelmä
DE50115520D1 (de)	2010-07-29	Strahlformungsverfahren
DE60101190D1 (de)	2003-12-18	Laservorrichtung
DE60139698D1 (de)	2009-10-08	Laserstrahlbearbeitungsverfahren
DE60233774D1 (de)	2009-11-05	Lasermikroskop
DE60017273D1 (de)	2005-02-10	Laserschweisssystem
DE60129982D1 (de)	2007-09-27	Schweisshemmende zusammensetzungen
FI20002737A7 (fi)	2002-06-14	Säteenmuokkaaja
DE60116311D1 (de)	2006-02-02	Schweisshemmende zusammensetzungen
DE60111790D1 (de)	2005-08-11	Laserschweissverfahren
DE50009759D1 (de)	2005-04-21	Durchstrahl-Laser-Schweisseinrichtung
DE60123576D1 (de)	2006-11-16	Halbleiterlaserherstellungsverfahren
DE60023568D1 (de)	2005-12-01	Spannvorrichtung
DE60107036D1 (de)	2004-12-16	Spannvorrichtung
DE60108044D1 (de)	2005-02-03	Laser Mikroskop
DE50103796D1 (de)	2004-10-28	Schweisskopf
DE60110275D1 (de)	2005-06-02	Lasermarkierung
DE60139434D1 (de)	2009-09-17	Laserresonator
DE50104634D1 (de)	2004-12-30	Halbleiter-laser
DE10085421T1 (de)	2003-10-23	Festkörperlaser-Vorrichtung
DE60127710D1 (de)	2007-05-16	Punktschweissanlage
FR2818814B1 (fr)	2003-02-28	Source laser

Legal Events

Date	Code	Title	Description
2006-07-27	8364	No opposition during term of opposition
2010-10-14	8328	Change in the person/name/address of the agent	Representative=s name: KUDLEK & GRUNERT PATENTANWAELTE PARTNERSCHAFT, 803