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DE60020638D1 - Lithographischer Projektionsapparat - Google Patents

Lithographischer Projektionsapparat

Info

Publication number
DE60020638D1
DE60020638D1 DE60020638T DE60020638T DE60020638D1 DE 60020638 D1 DE60020638 D1 DE 60020638D1 DE 60020638 T DE60020638 T DE 60020638T DE 60020638 T DE60020638 T DE 60020638T DE 60020638 D1 DE60020638 D1 DE 60020638D1
Authority
DE
Germany
Prior art keywords
projection apparatus
lithographic projection
lithographic
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60020638T
Other languages
English (en)
Other versions
DE60020638T2 (de
Inventor
Hubert Marie Segers
Rudolf Maria Boon
Anton Adriaan Bijnagte
Franciscus Mathijs Jacobs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of DE60020638D1 publication Critical patent/DE60020638D1/de
Application granted granted Critical
Publication of DE60020638T2 publication Critical patent/DE60020638T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
DE60020638T 1999-04-21 2000-04-14 Lithographischer Projektionsapparat Expired - Fee Related DE60020638T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99201223 1999-04-21
EP99201223 1999-04-21

Publications (2)

Publication Number Publication Date
DE60020638D1 true DE60020638D1 (de) 2005-07-14
DE60020638T2 DE60020638T2 (de) 2006-05-04

Family

ID=8240117

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60013687T Expired - Fee Related DE60013687T2 (de) 1999-04-21 2000-04-10 Substrathandhabungsvorrichtung zur Verwendung in lithographischen Projektionsapparaten
DE60020638T Expired - Fee Related DE60020638T2 (de) 1999-04-21 2000-04-14 Lithographischer Projektionsapparat

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60013687T Expired - Fee Related DE60013687T2 (de) 1999-04-21 2000-04-10 Substrathandhabungsvorrichtung zur Verwendung in lithographischen Projektionsapparaten

Country Status (5)

Country Link
US (2) US6404483B1 (de)
JP (2) JP3840034B2 (de)
KR (2) KR100588129B1 (de)
DE (2) DE60013687T2 (de)
TW (2) TW513617B (de)

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US6826451B2 (en) * 2002-07-29 2004-11-30 Asml Holding N.V. Lithography tool having a vacuum reticle library coupled to a vacuum chamber
SG102718A1 (en) * 2002-07-29 2004-03-26 Asml Holding Nv Lithography tool having a vacuum reticle library coupled to a vacuum chamber
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SG115629A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Method and apparatus for maintaining a machine part
SG115631A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
SG125948A1 (en) * 2003-03-31 2006-10-30 Asml Netherlands Bv Supporting structure for use in a lithographic apparatus
JP4236252B2 (ja) * 2003-05-06 2009-03-11 キヤノン株式会社 ステージ装置及び露光装置
JP2005003799A (ja) * 2003-06-10 2005-01-06 Fuji Photo Film Co Ltd 感光性板状部材吸着機構及び画像記録装置
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005076324A1 (ja) * 2004-02-04 2005-08-18 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
JP5167572B2 (ja) * 2004-02-04 2013-03-21 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
WO2005096101A1 (ja) * 2004-03-30 2005-10-13 Pioneer Corporation 露光装置
US8749762B2 (en) * 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7349067B2 (en) * 2004-06-21 2008-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100596280B1 (ko) 2004-12-22 2006-06-30 동부일렉트로닉스 주식회사 오버레이 측정의 프리얼라인먼트 간소화 장치 및 방법
JP2006178318A (ja) * 2004-12-24 2006-07-06 Nsk Ltd 露光装置
US7456935B2 (en) * 2005-04-05 2008-11-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a positioning device for positioning an object table
KR100696380B1 (ko) * 2005-07-06 2007-03-19 삼성전자주식회사 엣지 노광 웨이퍼 방법
KR100689843B1 (ko) * 2006-01-03 2007-03-08 삼성전자주식회사 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법
DE502006008851D1 (de) * 2006-11-08 2011-03-17 Integrated Dynamics Eng Gmbh Kombiniertes Motion-Control-System
US20080117402A1 (en) * 2006-11-20 2008-05-22 Asml Netherlands B.V. Lithographic apparatus and method
US11136667B2 (en) 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
US20080316461A1 (en) * 2007-06-21 2008-12-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5058337B2 (ja) * 2007-06-21 2012-10-24 エーエスエムエル ネザーランズ ビー．ブイ． クランプデバイス、リソグラフィ装置およびオブジェクトロード方法
US9013682B2 (en) * 2007-06-21 2015-04-21 Asml Netherlands B.V. Clamping device and object loading method
US8446566B2 (en) * 2007-09-04 2013-05-21 Asml Netherlands B.V. Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method
US20090086187A1 (en) * 2007-08-09 2009-04-02 Asml Netherlands Lithographic Apparatus and Device Manufacturing Method
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
JP5743437B2 (ja) * 2009-07-09 2015-07-01 キヤノン株式会社 露光装置、露光方法、搬送方法及びデバイスの製造方法
KR101509809B1 (ko) * 2009-12-01 2015-04-08 현대자동차주식회사 차량의 커튼에어백용 램프브라켓
NL2006565A (en) * 2010-06-30 2012-01-02 Asml Holding Nv Reticle clamping system.
US9120344B2 (en) * 2011-08-09 2015-09-01 Kateeva, Inc. Apparatus and method for control of print gap
CN104303109B (zh) * 2012-05-17 2017-06-09 Asml荷兰有限公司 热调节单元、光刻设备以及器件制造方法
CN103972135B (zh) * 2013-01-25 2017-02-22 上海微电子装备有限公司 一种硅片精确定位传输装置及定位方法
CN111113437B (zh) * 2018-10-31 2024-07-19 上海微电子装备（集团）股份有限公司 一种机械手定位装置
CN112296997B (zh) * 2019-07-31 2022-01-14 上海微电子装备（集团）股份有限公司 一种机械手交接工位标定方法、装置、设备及存储介质
WO2021070265A1 (ja) * 2019-10-08 2021-04-15 株式会社日立ハイテク 試料ステージ及び光学式検査装置
JP2024126670A (ja) * 2023-03-08 2024-09-20 東レエンジニアリング株式会社 基板保持装置

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JP3779393B2 (ja) 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
DE69717975T2 (de) 1996-12-24 2003-05-28 Asml Netherlands B.V., Veldhoven In zwei richtungen ausgewogenes positioniergerät, sowie lithographisches gerät mit einem solchen positioniergerät
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JP3260096B2 (ja) 1997-03-19 2002-02-25 富士男 板垣 建築物の沈下修正用アンカーボルト装置
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Also Published As

Publication number Publication date
KR20010014775A (ko) 2001-02-26
DE60013687T2 (de) 2005-09-29
TW500980B (en) 2002-09-01
JP2000323406A (ja) 2000-11-24
US6404483B1 (en) 2002-06-11
KR100588129B1 (ko) 2006-06-09
DE60013687D1 (de) 2004-10-21
KR100540364B1 (ko) 2006-01-10
JP3840034B2 (ja) 2006-11-01
US6721035B1 (en) 2004-04-13
JP2000330294A (ja) 2000-11-30
TW513617B (en) 2002-12-11
KR20000077050A (ko) 2000-12-26
DE60020638T2 (de) 2006-05-04

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee