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DE60013113D1 - Verfahren zum bohren von leiterplatten - Google Patents

Verfahren zum bohren von leiterplatten

Info

Publication number
DE60013113D1
DE60013113D1 DE60013113T DE60013113T DE60013113D1 DE 60013113 D1 DE60013113 D1 DE 60013113D1 DE 60013113 T DE60013113 T DE 60013113T DE 60013113 T DE60013113 T DE 60013113T DE 60013113 D1 DE60013113 D1 DE 60013113D1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
drilling
lubricating
lubricant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60013113T
Other languages
English (en)
Other versions
DE60013113T2 (de
Inventor
J Miller
E Dinneweth
Hans Vandervelde
T Hegeduis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TRISTAR LAMINATES, INC., LAKE FOREST, CALIF., US
Original Assignee
LAMINATING Co OF AMERICA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LAMINATING Co OF AMERICA filed Critical LAMINATING Co OF AMERICA
Application granted granted Critical
Publication of DE60013113D1 publication Critical patent/DE60013113D1/de
Publication of DE60013113T2 publication Critical patent/DE60013113T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • B23B35/005—Measures for preventing splittering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2250/00—Compensating adverse effects during turning, boring or drilling
    • B23B2250/12—Cooling and lubrication
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
    • Y10T408/561—Having tool-opposing, work-engaging surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
    • Y10T408/561—Having tool-opposing, work-engaging surface
    • Y10T408/5623—Having tool-opposing, work-engaging surface with presser foot

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Exploitation, And Mining Machines And Methods (AREA)
DE60013113T 1999-04-07 2000-04-05 Verfahren zum bohren von leiterplatten Expired - Lifetime DE60013113T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US287811 1988-12-21
US09/287,811 US6200074B1 (en) 1999-04-07 1999-04-07 Method for drilling circuit boards
PCT/US2000/009001 WO2000060911A1 (en) 1999-04-07 2000-04-05 Method for drilling circuit boards

Publications (2)

Publication Number Publication Date
DE60013113D1 true DE60013113D1 (de) 2004-09-23
DE60013113T2 DE60013113T2 (de) 2005-09-01

Family

ID=23104462

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60013113T Expired - Lifetime DE60013113T2 (de) 1999-04-07 2000-04-05 Verfahren zum bohren von leiterplatten

Country Status (6)

Country Link
US (1) US6200074B1 (de)
EP (1) EP1174006B1 (de)
AT (1) ATE274290T1 (de)
AU (1) AU4198100A (de)
DE (1) DE60013113T2 (de)
WO (1) WO2000060911A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG115399A1 (en) * 2000-09-04 2005-10-28 Mitsubishi Gas Chemical Co Lubricant sheet for making hole and method of making hole with drill
US6669805B2 (en) * 2001-02-16 2003-12-30 International Business Machines Corporation Drill stack formation
US6783860B1 (en) * 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
US6866450B2 (en) * 2001-10-31 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling hole
US20030129030A1 (en) * 2002-01-04 2003-07-10 Jja, Inc. Lubricant sheet and method of forming the same
US20050035518A1 (en) * 2002-02-22 2005-02-17 Beat Ammann Workpiece clamp with two alternately applicable compression rings
KR20020082444A (ko) * 2002-09-26 2002-10-31 최인진 인쇄회로기판의 홀 천공방법
US20050003169A1 (en) * 2003-01-28 2005-01-06 Nobuyuki Ikeguchi Lubricant sheet for drilling and method of drilling
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
JP4352919B2 (ja) * 2004-02-05 2009-10-28 パナソニック電工株式会社 機械加工用バックアップボード
TWM279490U (en) * 2005-03-28 2005-11-01 Fu-Shiung Chen Cushion board for drilling holes of IC circuit board
US20060286372A1 (en) * 2005-06-21 2006-12-21 Uniplus Electronics Co., Ltd. High heat-dissipating lubricant aluminum-based cover plate and production process thereof
EP2191701B1 (de) * 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Eingangsfolie, herstellungsverfahren dafür und verfahren zur bohrung von löchern in bestückten leiterplatten
US8882411B2 (en) * 2009-04-27 2014-11-11 Kyocera Corporation Drill and method of cutting workpiece using the same
WO2013146612A1 (ja) 2012-03-27 2013-10-03 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート
BR112015021661B1 (pt) * 2013-03-27 2021-01-12 Mitsubishi Gas Chemical Company, Inc. Folha para ser usada no corte de um material compósito reforçado por fibras e/ou de ummetal, método de corte para cortar o material compósito reforçado por fibras e/ou o metal,método para produzir o material compósito reforçado por fibras, e, método para produzir ometal
KR102365234B1 (ko) 2014-03-31 2022-02-18 미츠비시 가스 가가쿠 가부시키가이샤 드릴 구멍 내기용 엔트리 시트
TWI764772B (zh) * 2021-07-01 2022-05-11 鋐正科技股份有限公司 電路板鑽孔用上蓋板及其製造方法
CN114340213A (zh) * 2021-12-29 2022-04-12 江苏苏杭电子有限公司 Pcb板阻焊塞孔用丝印网版的铝片的钻孔方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700341A (en) * 1970-07-27 1972-10-24 Lcoa Laminating Co Of America Laminated board and method of making same
US4311419A (en) * 1979-07-30 1982-01-19 Lcoa Laminating Company Of America Method for drilling circuit boards
US4269549A (en) * 1979-07-30 1981-05-26 Lcoa Laminating Company Of America Method for drilling circuit boards
US4781495A (en) 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards
JP2855824B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
CN1047716C (zh) 1991-02-07 1999-12-22 霍尔德斯科技有限公司 在印刷电路板钻孔过程中贴靠印刷电路板的引入板或垫板
GB9102672D0 (en) * 1991-02-07 1991-03-27 Holders Technology Plc Drilling printed circuit boards and dummy boards therefor
US5507603A (en) * 1993-08-05 1996-04-16 Dai-Ichi Kogyo Seiyaku Co., Ltd. Method for drilling thru-holes on a lamination substrate and a sheet used therein
US5524885A (en) * 1995-03-22 1996-06-11 Heo; Yeong K. Terry cloth golf club grip
TW315338B (de) * 1996-02-08 1997-09-11 Showa Aluminiun Co Ltd
JP3693787B2 (ja) * 1997-05-30 2005-09-07 三菱アルミニウム株式会社 プリント配線板の孔明け加工用当て板及びプリント配線板の孔明け加工法

Also Published As

Publication number Publication date
WO2000060911A1 (en) 2000-10-12
DE60013113T2 (de) 2005-09-01
EP1174006B1 (de) 2004-08-18
EP1174006A1 (de) 2002-01-23
US6200074B1 (en) 2001-03-13
ATE274290T1 (de) 2004-09-15
AU4198100A (en) 2000-10-23

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: TRI-STAR LAMINATES, INC., LAKE FOREST, CALIF., US

8327 Change in the person/name/address of the patent owner

Owner name: TRISTAR LAMINATES, INC., LAKE FOREST, CALIF., US

8380 Miscellaneous part iii

Free format text: DER VERTRETER IST ZU ERGAENZEN: PATENT- UND RECHTSANWAELTE DR. SOLF & ZAPF, CANDIDPLATZ 15, 81543 MUENCHEN

8364 No opposition during term of opposition