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DE59902817D1 - MACHINING HEAD FOR A LASER ENGRAVING OR cutting apparatus - Google Patents

MACHINING HEAD FOR A LASER ENGRAVING OR cutting apparatus

Info

Publication number
DE59902817D1
DE59902817D1 DE59902817T DE59902817T DE59902817D1 DE 59902817 D1 DE59902817 D1 DE 59902817D1 DE 59902817 T DE59902817 T DE 59902817T DE 59902817 T DE59902817 T DE 59902817T DE 59902817 D1 DE59902817 D1 DE 59902817D1
Authority
DE
Germany
Prior art keywords
processing head
cutting apparatus
workpiece
laser beam
gas blow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE59902817T
Other languages
German (de)
Inventor
Ernst Guettler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trodat GmbH
Original Assignee
Trodat GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trodat GmbH filed Critical Trodat GmbH
Application granted granted Critical
Publication of DE59902817D1 publication Critical patent/DE59902817D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

Processing head (1) for a laser engraving or cutting apparatus, especially for processing stamp plates, which is provided with an enclosed housing in which the processing head is moveable in a controlled manner relative to a base supporting the workpiece, the processing head being provided with a hood (6) connected to a dust suction device and terminating at a distance from the surface of the workpiece, the processing head being provided with at least two gas blow nozzles (7,8) one of the gas blow nozzles (7) being directed at an angle toward the vertically impinging laser beam (L), the other gas blow nozzle (8) which is also inclined at an angle relative to the laser beam (L) is directed toward a point (P') of the surface of the workpiece spaced from the impinging site (P) of the laser beam.
DE59902817T 1998-01-29 1999-01-08 MACHINING HEAD FOR A LASER ENGRAVING OR cutting apparatus Expired - Fee Related DE59902817D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0014698A AT408632B (en) 1998-01-29 1998-01-29 MACHINING HEAD FOR A LASER ENGRAVING OR cutting apparatus
PCT/AT1999/000004 WO1999038643A1 (en) 1998-01-29 1999-01-08 Processing head for a laser engraving or cutting device

Publications (1)

Publication Number Publication Date
DE59902817D1 true DE59902817D1 (en) 2002-10-31

Family

ID=3482760

Family Applications (2)

Application Number Title Priority Date Filing Date
DE29980010U Expired - Lifetime DE29980010U1 (en) 1998-01-29 1999-01-08 Processing head for a laser engraving or cutting device
DE59902817T Expired - Fee Related DE59902817D1 (en) 1998-01-29 1999-01-08 MACHINING HEAD FOR A LASER ENGRAVING OR cutting apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE29980010U Expired - Lifetime DE29980010U1 (en) 1998-01-29 1999-01-08 Processing head for a laser engraving or cutting device

Country Status (6)

Country Link
US (1) US6531682B1 (en)
EP (1) EP0969947B1 (en)
JP (1) JP2001518018A (en)
AT (2) AT408632B (en)
DE (2) DE29980010U1 (en)
WO (1) WO1999038643A1 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT408632B (en) * 1998-01-29 2002-01-25 Trodat Gmbh MACHINING HEAD FOR A LASER ENGRAVING OR cutting apparatus
FR2826893B1 (en) * 2001-07-05 2003-09-19 Snecma Moteurs MINIATURIZED LASER BEAM WELDING APPARATUS
DE10138867A1 (en) 2001-08-08 2003-03-06 Bosch Gmbh Robert Device for reducing ablation products on the workpiece surface during the laser drilling process
US6756564B2 (en) * 2001-12-31 2004-06-29 Andrx Pharmaceuticals Llc System and method for removing particulate created from a drilled or cut surface
ITBO20030156A1 (en) * 2003-03-20 2004-09-21 Gpiii S R L LASER ENGRAVING DEVICE.
US7501601B2 (en) * 2003-09-03 2009-03-10 Xenetech U.S.A., Inc. Automated laser engraver
DE10355991A1 (en) 2003-11-27 2005-06-30 Basf Drucksysteme Gmbh Process for the production of flexographic printing plates by means of laser engraving
DE10355996A1 (en) * 2003-11-27 2005-06-30 Stork Prints Austria Gmbh Process for the production of flexographic printing plates by means of laser engraving as well as suitable apparatus
DE102004021680A1 (en) * 2004-04-30 2005-11-24 Carl Zeiss Meditec Ag Arrangement for the removal of waste products during the ablation of biological tissue
US7947919B2 (en) 2008-03-04 2011-05-24 Universal Laser Systems, Inc. Laser-based material processing exhaust systems and methods for using such systems
DE102008030079B3 (en) * 2008-06-25 2009-08-20 Trumpf Werkzeugmaschinen Gmbh + Co. Kg A method for reducing the adhesion of slag when piercing a laser beam into a workpiece and laser processing head
CA2814185A1 (en) * 2010-09-10 2012-07-12 Christopher DACKSON Method and apparatus for laser welding with mixed gas plasma suppression
US9021948B2 (en) * 2011-04-27 2015-05-05 Xerox Corporation Environmental control subsystem for a variable data lithographic apparatus
AT512092B1 (en) 2011-11-07 2014-03-15 Trotec Produktions U Vertriebs Gmbh LASER PLOTTER AND METHOD FOR ENGRAVING, MARKING AND / OR LABELING A WORKPIECE
KR102096048B1 (en) * 2012-10-10 2020-04-02 삼성디스플레이 주식회사 Laser Processing apparatus
AT514337B1 (en) 2013-05-15 2015-06-15 Trodat Gmbh System for creating and creating a stamp plate
AT515839B1 (en) 2014-05-19 2016-06-15 Trotec Laser Gmbh Method and device for machining workpieces
CN103990909B (en) * 2014-06-10 2016-02-17 东莞台一盈拓科技股份有限公司 A kind of laser cutting machine and cutting method thereof
JP7071118B2 (en) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー Sapphire collector to reduce mechanical damage during die-level laser lift-off
EP3302865A4 (en) * 2015-01-25 2020-02-26 YTA Holdings, LLC Method protecting and maintaining laser systems and inkjet systems used for marking food products
US20160214399A1 (en) * 2015-01-25 2016-07-28 Ten Media, Llc Dba Ten Ag Tech Co. Method protecting and maintaining laser systems used for marking food products
US9945253B2 (en) * 2015-01-29 2018-04-17 Rohr, Inc. Collecting / removing byproducts of laser ablation
AT517185B1 (en) 2015-05-13 2017-06-15 Trotec Laser Gmbh Method for engraving, marking and / or inscribing a workpiece (10) with a
CN107924865B (en) * 2015-05-13 2022-03-11 亮锐控股有限公司 Sapphire collector for reducing mechanical damage during die-level laser lift-off
US10328529B2 (en) 2015-08-26 2019-06-25 Electro Scientific Industries, Inc Laser scan sequencing and direction with respect to gas flow
CN107584209A (en) * 2016-07-08 2018-01-16 京东方科技集团股份有限公司 Laser cutting device
JP6999264B2 (en) * 2016-08-04 2022-01-18 株式会社日本製鋼所 Laser peeling device, laser peeling method, and manufacturing method of organic EL display
DE102017000539A1 (en) 2017-01-23 2018-07-26 ALS Alu Laser Service Device on a laser cutting device
KR102532733B1 (en) * 2018-02-14 2023-05-16 삼성디스플레이 주식회사 Particle removal apparatus and laser cutting apparatus including the same
WO2021237095A1 (en) * 2020-05-22 2021-11-25 Bold Laser Automation, Inc. High velocity vacuum system for laser ablation
JP2022137716A (en) * 2021-03-09 2022-09-22 キヤノンマシナリー株式会社 Dust collection method, dust collection device, laser processing method, and laser processing device
US12023757B2 (en) * 2021-11-22 2024-07-02 GM Global Technology Operations LLC Air management system for laser welding with airflow optimizing deflector
CN114226965B (en) * 2021-12-28 2024-01-30 辽宁工业大学 Purification protection device of laser engraving machine
EP4516937A4 (en) * 2022-04-26 2025-08-20 Nippon Steel Corp LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315133A (en) * 1980-05-12 1982-02-09 Gte Automatic Electric Laboratories, Inc. Apparatus protecting a lens from airborne particulates
JPS5987996A (en) * 1982-11-10 1984-05-21 Ishikawajima Harima Heavy Ind Co Ltd Laser gas cutting equipment
DD225370A1 (en) * 1984-07-11 1985-07-31 Univ Rostock METHOD FOR INCREASING THE MACHINING RESULT IN LASER MATERIAL PROCESSING
JPS63241399A (en) * 1987-03-30 1988-10-06 株式会社東芝 Laser decontaminator
US4782205A (en) * 1987-06-25 1988-11-01 Shira Chester S Method of welding involving weld bead shaping and arc deflection and apparatus for practicing said method
JPS6462295A (en) * 1987-09-01 1989-03-08 Mitsubishi Electric Corp Laser beam machining head device
FR2627409A1 (en) * 1988-02-24 1989-08-25 Lectra Systemes Sa LASER CUTTING APPARATUS WITH A FUME EXHAUST DEVICE
DE3923829A1 (en) 1989-07-19 1991-01-31 Fraunhofer Ges Forschung Suction extraction hood for laser cutting and sputtering unit - has inclined nozzles to direct curtain of gas to focus of laser beam and esp. neutralise and remove dangerous reaction products
US5359176A (en) * 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
US5662762A (en) * 1995-07-07 1997-09-02 Clover Industries, Inc. Laser-based system and method for stripping coatings from substrates
JPH1128900A (en) * 1997-05-12 1999-02-02 Sumitomo Heavy Ind Ltd Paint removal method and laser processing device using laser light
JPH11158050A (en) 1997-11-25 1999-06-15 Michihiko Hayashi Addition of caffeine to tooth powder
AT408632B (en) * 1998-01-29 2002-01-25 Trodat Gmbh MACHINING HEAD FOR A LASER ENGRAVING OR cutting apparatus

Also Published As

Publication number Publication date
EP0969947A1 (en) 2000-01-12
EP0969947B1 (en) 2002-09-25
US6531682B1 (en) 2003-03-11
DE29980010U1 (en) 1999-12-16
JP2001518018A (en) 2001-10-09
WO1999038643A1 (en) 1999-08-05
AT408632B (en) 2002-01-25
ATE224788T1 (en) 2002-10-15
ATA14698A (en) 2001-06-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee