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DE29519294U1 - Electric device - Google Patents

Electric device

Info

Publication number
DE29519294U1
DE29519294U1 DE29519294U DE29519294U DE29519294U1 DE 29519294 U1 DE29519294 U1 DE 29519294U1 DE 29519294 U DE29519294 U DE 29519294U DE 29519294 U DE29519294 U DE 29519294U DE 29519294 U1 DE29519294 U1 DE 29519294U1
Authority
DE
Germany
Prior art keywords
circuit board
contact strip
solder
contact
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29519294U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE29519294U priority Critical patent/DE29519294U1/en
Priority to IT1996MI000773U priority patent/IT241029Y1/en
Priority to FR9614753A priority patent/FR2742295B3/en
Priority to GB9625027A priority patent/GB2308015A/en
Publication of DE29519294U1 publication Critical patent/DE29519294U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Surgical Instruments (AREA)
  • Dry Shavers And Clippers (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Power Steering Mechanism (AREA)

Description

R. 29683
01.12.95 Gf/BrR.29683
01.12.95 Gf/Br

ROBERT BOSCH GMBH, 70442 StuttgartROBERT BOSCH GMBH, 70442 Stuttgart

Elektrisches Gerät
15 Electric device
15

Stand der TechnikState of the art

Die Erfindung geht aus von einem elektrischen Gerät nach der Gattung des Anspruchs 1. Durch die DE 33 10 477 Al ist ein gattungsgemäßes elektrisches Gerät bekannt. In diesem ist eine mit elektrischen Bauelementen bestückte Leiterplatte und eine, Kontaktelemente lagernde Kontaktleiste enthalten. Die Leiterplatte weist Bohrungen auf, durch die von einer Vorderseite der Leiterplatte her die Anschlußdrähte der Bauelemente und die Anschlußabschnitte der Kontaktelemente hindurchgeführt und auf der mit Leiterbahnen versehenen Rückseite der Leiterplatte über eine Wellenlöteinrichtung verlötet werden, indem die Rückseite der Leiterplatte über ein streifenförmig angeordnetes Lötbad gezogen wird und dabei in Kontakt mit flüssigen Lot kommt.The invention is based on an electrical device according to the preamble of claim 1. DE 33 10 477 A1 discloses an electrical device of the generic type. This contains a circuit board equipped with electrical components and a contact strip supporting contact elements. The circuit board has holes through which the connecting wires of the components and the connecting sections of the contact elements are led from the front of the circuit board and are soldered to the back of the circuit board provided with conductor tracks using a wave soldering device, in that the back of the circuit board is pulled over a strip-shaped solder bath and in the process comes into contact with liquid solder.

Dadurch ist in nachteiliger Weise eine Bestückung der Rückseite der Leiterplatte mit Bauelementen nicht möglich, so daß bei vorgegebenen Außenabmessungen des Geräts eine Funktionsauswertung, die eine Zunahme der elektrischen Bauelemente und der Kontaktelemente der Kontaktleiste erfordert, nicht möglich ist.This has the disadvantage that it is not possible to equip the back of the circuit board with components, so that with given external dimensions of the device, a functional evaluation that requires an increase in the number of electrical components and contact elements of the contact strip is not possible.

R. 29683R.29683

Zudem ist die beschriebene Bestückungsmethode der Leiterplatte und damit die Herstellkosten des Geräts kostenintensiv.In addition, the described method of assembling the circuit board and thus the manufacturing costs of the device are cost-intensive.

Vorteile der ErfindungAdvantages of the invention

Das erfindungsgemäße elektrische Gerät mit den kennzeichnenden Merkmalen des Anspruchs 1 hat dem gegenüber den Vorteil, daß die zuvor erwähnten Unzulänglichkeiten in zufriedenstellendem Maß vermieden werden. Dazu ist die Leiterplatte für die SMD-Technik zum Aufbringen von oberf1ächenmontierbaren Bauelementen ausgebildet. Dies ermöglicht eine beidseitige Montage dieser Bauelemente auf der Leiterplatte, wobei die Bauelemente zur Vorfixierung auf, mit Lot versehenen Anschlüssen der Leiterplatte geklebt und danach, nur unter Zuführung von Wärme, verlötet werden. Da dabei keine Bohrungen und kein Hindurchfädeln von Anschlußdrähten erforderlich ist, fallen infolge kürzerer Bestückungszeiten der Leiterplatte als beim Stand der 0 Technik geringere Fertigungskosten an.The electrical device according to the invention with the characterizing features of claim 1 has the advantage that the previously mentioned deficiencies are avoided to a satisfactory extent. For this purpose, the circuit board is designed for SMD technology for the application of surface-mountable components. This enables these components to be mounted on both sides of the circuit board, whereby the components are glued to soldered connections on the circuit board for pre-fixing and then soldered using only heat. Since no drilling or threading of connecting wires is required, lower production costs are incurred due to shorter assembly times for the circuit board than with the prior art.

Die Anschlußabschnitte der Kontaktelemente der Kontaktleiste, die weiterhin aus Stabilitätsgründen durch Bohrungen der Leiterplatte geführt sind, sind mit Anschlüssen der Leiterplatte umgeben, die auf zusätzlichen Ablageflächen jeweils ein Lotdepot aufweisen, so daß diese Anschlußabschnitte der Kontaktelemente im gleichen Lötprozeß wie die Bauelemente gelötet und dabei mit dem Lot aus dem Lotdepot versorgt werden. Dies erspart einen separaten 0 Lötprozeß für die Anschlußelemente der Kontaktleiste und trägt zur kostengünstigen Fertigung des elektrischen Geräts bei.The connection sections of the contact elements of the contact strip, which are also guided through holes in the circuit board for stability reasons, are surrounded by connections on the circuit board, each of which has a solder deposit on additional storage areas, so that these connection sections of the contact elements are soldered in the same soldering process as the components and are supplied with solder from the solder deposit. This saves a separate soldering process for the connection elements of the contact strip and contributes to the cost-effective production of the electrical device.

· · &idigr;&idigr;·.· · &idgr;&idgr;·.

R. 29683R.29683

Durch die in den Unteranspüchen aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen des im Anspruch 1 angegebenen elektrischen Geräts möglich.The measures listed in the subclaims enable advantageous further developments of the electrical device specified in claim 1.

Zeichnungdrawing

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Jeweils im Teilschnitt zeigt die Figur 1 die Leiterplatte mit elektrischen Bauelementen und einem Anschlußelement der Kontaktleiste und Figur 2 Leiterplatte und Kontaktleiste mit Zentriermittel und Halteelement.An embodiment of the invention is shown in the drawing and explained in more detail in the following description. Figure 1 shows the circuit board with electrical components and a connection element of the contact strip in partial section and Figure 2 shows the circuit board and contact strip with centering means and holding element.

Beschreibung des AusführungsbeispielsDescription of the embodiment

Ein elektrisches Gerät 11, insbesondere ein Schalt- und Steuergerät für ein Kraftfahrzeug, enthält nach der Figur 1 als wesentliche Teile eine Leiterplatte 12, die mit elektrischen Bauelementen 13 bestückt ist und eine Kontaktleiste 14, über die das Gerät 11 mit anderen Komponenten des Kraftfahrzeugs verbindbar ist.An electrical device 11, in particular a switching and control device for a motor vehicle, contains, according to Figure 1, as essential parts a circuit board 12, which is equipped with electrical components 13 and a contact strip 14, via which the device 11 can be connected to other components of the motor vehicle.

Die Leiterplatte 12 ist für die SMD-Technik ausgebildet. Dazu wird auf einen, aus elektrischem Isolierstoff bestehenden Grundkörper 16 im Siebdruckverfahren als flächige Anschlüsse 17 auf einer Vorderseite 18 und einer Rückseite 19 des Grundkörpers 16 dickschichtig Lot 21 in Pastenform festhaftend aufgetragen. Auf die Anschlüsse 17 werden elektrische Bauelemente 22 mit an ihnen 0 ausgebildeten, verzinnten Kontaktflächen 23 zur Vorfixierung aufgeklebt.The circuit board 12 is designed for SMD technology. For this purpose, a thick layer of solder 21 in paste form is applied to a base body 16 made of electrical insulating material using a screen printing process as flat connections 17 on a front side 18 and a back side 19 of the base body 16. Electrical components 22 with tinned contact surfaces 23 formed on them are glued to the connections 17 for pre-fixing.

Die Leiterplatte 12 weist ferner reihenförmig angeordnete, die Vorderseite 18 mit der Rückseite 19 verbindende 5 Bohrungen 24 auf. Die Wandung einer jeden der Bohrung 24 istThe circuit board 12 also has 5 holes 24 arranged in rows connecting the front 18 with the back 19. The wall of each of the holes 24 is

R. 29683R.29683

mit Lot 21 dünnschichtig ausgekleidet. Auf der Rückseite 19 des Grundkörpers 16 münden die Bohrungen 24 in Anschlüsse 17, die jeweils um eine Ablagefläche 2 6 für ein Lotdepot 27 erweitert sind.
5lined with a thin layer of solder 21. On the rear side 19 of the base body 16, the bores 24 open into connections 17, each of which is extended by a storage area 26 for a solder depot 27.
5

Die Kontaktleiste 14 besteht aus einem Isolierstoffkörper 28, in dem eine Vielzahl von Kontaktelementen 29 abgedichtet eingebettet sind. Die in Reihen angeordneten Kontaktelemente 29 weisen jeweils einen nicht mehr dargestellten Kontaktabschnitt und einen abgewinkelten Anschlußabschnitt 31 auf. Das abgewinkelte Endstück des Anschlußabschnitts 31 wird bei der Montage der Kontaktleiste 14 auf der Leiterplatte 12 durch die zugeordnete Bohrung 24 geführt und ragt mit seinem freien Ende 32 in den um die Ablagefläche 26 erweiterten Anschluß 17.The contact strip 14 consists of an insulating body 28 in which a large number of contact elements 29 are embedded in a sealed manner. The contact elements 29 arranged in rows each have a contact section (no longer shown) and an angled connection section 31. The angled end piece of the connection section 31 is guided through the associated hole 24 when the contact strip 14 is mounted on the circuit board 12 and protrudes with its free end 32 into the connection 17 extended by the storage area 26.

Entsprechend Figur 2 ragen an einem, der Leiterplatte 12 zugewandten Boden 33 der Kontaktleiste 14 Zentriermittel 34 in Zapfenform hervor, die beim lagerichtigen Aufsetzen der Kontaktleiste 14 auf die Vorderseite 18 des Grundkörpers 16 der Leiterplatte 12 in zugeordnete Ausnehmungen 36 unter Bildung einer Klemmpressung eingreifen. Dadurch ist die Kontaktleiste 14 auf der Leiterplatte 12 vorfixiert. In dieser Stellung kommen verlötfähige Halteelemente 37, bestehend aus Metallwinkeln, die einerseits in dem Isolierkörper 28 verankert sind und die andererseits verzinnt seitlich aus der Kontaktleiste 14, bündig mit dem Boden 33, hervorstehen, an Anschlüssen 17 zur Anlage.According to Figure 2, centering means 34 in the form of pins protrude from a base 33 of the contact strip 14 facing the circuit board 12, which engage in associated recesses 36 to form a clamping pressure when the contact strip 14 is placed in the correct position on the front side 18 of the base body 16 of the circuit board 12. The contact strip 14 is thus pre-fixed on the circuit board 12. In this position, solderable holding elements 37, consisting of metal angles which are anchored on the one hand in the insulating body 28 and which on the other hand protrude laterally from the contact strip 14, flush with the base 33, are placed on connections 17.

0 Die so bestückte Leiterplatte 12 wird, mit der Rückseite 14 nach oben gerichtet, in einem, mit einer Rotlichtlampe ausgerüsteten Reflow-Ofen einer das Lot 21 aufschmelzenden Wärmebehandlung unterzogen, so daß Lötverbindungen der Anschlüsse 17 mit den Kontaktflächen 23 der Bauelemente 22 5 und mit den Halteelementen 3 7 der Kontaktleiste 140 The printed circuit board 12 thus assembled is subjected to a heat treatment in a reflow oven equipped with a red light lamp, with the rear side 14 facing upwards, to melt the solder 21, so that soldered connections of the connections 17 with the contact surfaces 23 of the components 22 5 and with the holding elements 3 7 of the contact strip 14

R. 29683R.29683

entstehen. Zugleich kommt es durch die Verflüssigung der Lotdepots 27, deren Lot 21 zu den freien Enden 32 der Anschlußabschnitte 31 und in die Bohrungen 24 fließt, zu Lötverbindungen zwischen dem jeweiligen Anschluß 17 und dem zugeordneten Anschlußabschnitt 31 der Kontaktelemente 29. Durch diese stoffschlüssige Verankerung der Anschlußabschnitte 31 der Kontaktelemente 29 in den Bohrungen 24 und durch die zusätzliche Fixierung des Isolierstoffkörpers 28 über die Halteelemente 37 an Anschlüssen 17 der Leiterplatte 12 ist die Kontaktleiste 14 besonders stabil auf der Leiterplatte 12 befestigt.At the same time, the liquefaction of the solder deposits 27, the solder 21 of which flows to the free ends 32 of the connection sections 31 and into the holes 24, results in soldered connections between the respective connection 17 and the associated connection section 31 of the contact elements 29. This material-locking anchoring of the connection sections 31 of the contact elements 29 in the holes 24 and the additional fixation of the insulating body 28 via the holding elements 37 to connections 17 of the circuit board 12 means that the contact strip 14 is particularly securely attached to the circuit board 12.

Somit ist ein elektrisches Gerät 11 verwirklicht, das durch eine beidseitig mit Bauelementen 13 bestückten Leiterplatte 12 eine hohe Packungsdichte für einen großen Funktionsumfang aufweist. In fertigungstechnisch günstiger Weise sind die Bauelemente 13 in SMD-Technik angebracht und obgleich die Kontaktleiste 14, deren Kontaktelemente 2 9 aus Stabilitätsgründen noch in herkömmlicher Technik durch Bohrungen 24 der Leiterplatte 12 geführt sind, ist bei der Fertigstellung der Leiterplatte 12 nur ein einziger, auf die SMD-Technik abgestimmter Lötprozeß erforderlich.An electrical device 11 is thus created which has a high packing density for a wide range of functions thanks to a circuit board 12 equipped with components 13 on both sides. In a manner that is advantageous in terms of production technology, the components 13 are attached using SMD technology and although the contact strip 14, whose contact elements 29 are still guided through holes 24 in the circuit board 12 using conventional technology for reasons of stability, only a single soldering process tailored to the SMD technology is required when completing the circuit board 12.

Claims (3)

• · · ■ R. 29683 01.12.95 Gf/Br ROBERT BOSCH GMBH, 70442 Stuttgart Ansprüche• · · ■ R. 29683 01.12.95 Gf/Br ROBERT BOSCH GMBH, 70442 Stuttgart Claims 1. Elektrisches Gerät, insbesondere Schalt- und Steuergerät für Kraftfahrzeuge, in dem wenigstens eine, mit elektrischen Bauelementen (13) bestückte Leiterplatte {12), sowie mindestens eine Kontaktleiste (14) enthalten ist, welche Kontaktleiste (14) Kontaktelemente {29) mit je einem Anschlußabschnitt (17) aufweist, welche Anschlußabschnitte (17) durch Bohrungen (24), die jeweils eine Vorderseite (18) mit einer Rückseite (19) der Leiterplatte (12) verbinden, steckbar und an der Rückseite (19) mit Anschlüssen (17) der Leiterplatte (12) verlötbar sind, dadurch gekennzeichnet, daß die Leiterplatte (12) für die SMD-Technik zum Aufbringen von oberflächenmontierten Bauelementen (13) ausgebildet ist und an der Vorderseite (18) und der Rückseite {19) als Anschlüsse (17) mit Lot (21) versehene Anschlußfelder aufweist, auf die einerseits die Bauelemente (13) an Kontaktflächen (23) aufgeklebt werden und die andererseits, die Bohrungen (24) an der Rückseite (19) umschließend, hier durch je eine zusätzliche Ablagefläche (26) für ein Lotdepot (27) erweitert sind, und bei einer, das Lot (21) aufschmelzender Wärmeeinwirkung, einerseits die Kontaktflächen (23) der Bauelemente (22) mit den gegenüberliegenden Anschlüssen (17) verlöten und andererseits das Lot (21) aus dem Lotdepot (27) in die zugeordnete Bohrung (24) einfließt, den jeweiligen Anschlußabscnnitt (31) mit dem zugeordneten Anschluß (17)1. Electrical device, in particular switching and control device for motor vehicles, in which at least one circuit board (12) equipped with electrical components (13) and at least one contact strip (14) are contained, which contact strip (14) has contact elements (29) each with a connection section (17), which connection sections (17) can be plugged through holes (24) which each connect a front side (18) to a back side (19) of the circuit board (12) and can be soldered to connections (17) of the circuit board (12) on the back side (19), characterized in that the circuit board (12) is designed for SMD technology for applying surface-mounted components (13) and has connection fields on the front side (18) and the back side (19) as connections (17) provided with solder (21), onto which the components (13) are glued on contact surfaces (23). and which, on the other hand, enclosing the holes (24) on the back (19), are here extended by an additional storage area (26) for a solder deposit (27), and when the solder (21) is melted by heat, on the one hand solder the contact surfaces (23) of the components (22) to the opposite connections (17) and on the other hand the solder (21) flows from the solder deposit (27) into the associated hole (24), connecting the respective connection section (31) to the associated connection (17) R. 29683R.29683 durch eine Lötverbindung stoffschlüssig verbindet und die Kontaktleiste (14) auf der Leiterplatte (12) fixiert.by means of a solder joint and fixes the contact strip (14) on the circuit board (12). 2. Elektrisches Gerät nach Anspruch 1, dadurch2. Electrical device according to claim 1, characterized gekennzeichnet, daß an der Kontaktleiste (14) Zentriermittel (34) vorgesehen sind, die beim lagerichtigen Aufsetzen der Kontaktleiste (14) auf die Vorderseite (18) der Leiterplatte (12) in zugeordnete Ausnehmungen (36) der Leiterplatte (12) mit Klemmpressung zur Vorfixierung der Kontaktleiste (14) auf der Leiterplatte (12) eingreifen.characterized in that centering means (34) are provided on the contact strip (14) which, when the contact strip (14) is placed in the correct position on the front side (18) of the circuit board (12), engage in associated recesses (36) of the circuit board (12) with clamping pressure for pre-fixing the contact strip (14) on the circuit board (12). 3. Elektrisches Gerät nach Anspruch 2, dadurch gekennzeichnet, daß an der Kontaktleiste (14) verlötfähige Halteelemente (37) angebracht sind, die bei auf der Leiterplatte (12) vorfixierter Kontaktleiste (14) an Anschlüssen (17) der Leiterplatte (12) anliegen und hier nach einer das Lot (21) aufschmelzenden Wärmeeinwirkung die Kontaktleiste (14) auf der Leiterplatte (12) fixieren.3. Electrical device according to claim 2, characterized in that solderable holding elements (37) are attached to the contact strip (14), which, when the contact strip (14) is pre-fixed to the circuit board (12), rest against connections (17) of the circuit board (12) and, after the application of heat which melts the solder (21), fix the contact strip (14) to the circuit board (12).
DE29519294U 1995-12-06 1995-12-06 Electric device Expired - Lifetime DE29519294U1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE29519294U DE29519294U1 (en) 1995-12-06 1995-12-06 Electric device
IT1996MI000773U IT241029Y1 (en) 1995-12-06 1996-11-26 ELECTRIC APPLIANCE
FR9614753A FR2742295B3 (en) 1995-12-06 1996-12-02 ELECTRICAL APPLIANCE
GB9625027A GB2308015A (en) 1995-12-06 1996-12-02 Soldering surface-mounted and lead-in-hole components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29519294U DE29519294U1 (en) 1995-12-06 1995-12-06 Electric device

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DE29519294U Expired - Lifetime DE29519294U1 (en) 1995-12-06 1995-12-06 Electric device

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FR (1) FR2742295B3 (en)
GB (1) GB2308015A (en)
IT (1) IT241029Y1 (en)

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DE19822811C1 (en) * 1998-05-20 2000-03-09 Amphenol Tuchel Elect Contact carrier for circuit board device has insulating body provided with projecting contacts for connection to circuit board contact sections and solder contacts for attachment to circuit board
DE10201209A1 (en) * 2002-01-14 2003-07-24 Endress & Hauser Gmbh & Co Kg solder preform
DE102005043279A1 (en) * 2005-09-09 2007-03-15 Endress + Hauser Gmbh + Co. Kg Circuit board for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface for a connecting pin of a wired component
DE102008035405A1 (en) * 2008-07-29 2010-02-04 Endress + Hauser Gmbh + Co. Kg Mixed printed circuit board manufacturing method for use in electronic device i.e. measuring device, involves soldering connection on through hole technical parts arranged on former side of printed circuit board by reflow-soldering machine
DE102009002288A1 (en) * 2009-04-08 2010-10-14 Endress + Hauser Gmbh + Co. Kg Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components
EP2909923A1 (en) * 2012-10-16 2015-08-26 Robert Bosch GmbH Connection element for a drive arrangement and a drive arrangement having a connection part

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US6692269B2 (en) * 2000-12-15 2004-02-17 Di/Dt, Inc. Circuit module with universal connectivity
DE10211647B4 (en) * 2002-03-15 2014-02-13 Endress + Hauser Gmbh + Co. Kg Method for loading and soldering a printed circuit board
CN101238764A (en) * 2005-03-15 2008-08-06 麦德康内克斯公司 Small wave soldering system and method for soldering wire and pin configurations
US7718927B2 (en) * 2005-03-15 2010-05-18 Medconx, Inc. Micro solder pot
CN108747010B (en) * 2018-06-21 2023-11-03 深圳光韵达光电科技股份有限公司 SMT ladder template and manufacturing method thereof

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JP2844778B2 (en) * 1989-12-28 1999-01-06 ソニー株式会社 How to solder two types of parts to a single-sided printed circuit board
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19822811C1 (en) * 1998-05-20 2000-03-09 Amphenol Tuchel Elect Contact carrier for circuit board device has insulating body provided with projecting contacts for connection to circuit board contact sections and solder contacts for attachment to circuit board
DE10201209A1 (en) * 2002-01-14 2003-07-24 Endress & Hauser Gmbh & Co Kg solder preform
DE10201209B4 (en) * 2002-01-14 2005-12-01 Endress + Hauser Gmbh + Co. Kg Lotformteil and method for equipping the same
DE102005043279A1 (en) * 2005-09-09 2007-03-15 Endress + Hauser Gmbh + Co. Kg Circuit board for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface for a connecting pin of a wired component
DE102005043279B4 (en) * 2005-09-09 2009-03-26 Endress + Hauser Gmbh + Co. Kg Printed circuit board and method for soldering SMD components in a reflow soldering oven and subsequent selective soldering of at least one leaded component
DE102008035405A1 (en) * 2008-07-29 2010-02-04 Endress + Hauser Gmbh + Co. Kg Mixed printed circuit board manufacturing method for use in electronic device i.e. measuring device, involves soldering connection on through hole technical parts arranged on former side of printed circuit board by reflow-soldering machine
DE102008035405B4 (en) * 2008-07-29 2016-09-01 Endress + Hauser Gmbh + Co. Kg Method for producing a printed circuit board and production line for carrying out the same
DE102009002288A1 (en) * 2009-04-08 2010-10-14 Endress + Hauser Gmbh + Co. Kg Method for fixing through hole technology component on side of printed circuit board, involves applying molded part made from hot glue on adhesive area provided on printed circuit board for fixing through hole technology components
EP2909923A1 (en) * 2012-10-16 2015-08-26 Robert Bosch GmbH Connection element for a drive arrangement and a drive arrangement having a connection part

Also Published As

Publication number Publication date
FR2742295A3 (en) 1997-06-13
FR2742295B3 (en) 1997-11-28
GB2308015A (en) 1997-06-11
ITMI960773V0 (en) 1996-11-26
ITMI960773U1 (en) 1998-05-26
IT241029Y1 (en) 2001-04-20
GB9625027D0 (en) 1997-01-15

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