[go: up one dir, main page]

DE2031285B2 - METHOD OF MANUFACTURING A NUMBER OF PLATE-SHAPED ELECTRONIC COMPONENTS WITH PLASTIC HOUSING - Google Patents

METHOD OF MANUFACTURING A NUMBER OF PLATE-SHAPED ELECTRONIC COMPONENTS WITH PLASTIC HOUSING

Info

Publication number
DE2031285B2
DE2031285B2 DE19702031285 DE2031285A DE2031285B2 DE 2031285 B2 DE2031285 B2 DE 2031285B2 DE 19702031285 DE19702031285 DE 19702031285 DE 2031285 A DE2031285 A DE 2031285A DE 2031285 B2 DE2031285 B2 DE 2031285B2
Authority
DE
Germany
Prior art keywords
manufacturing
plate
electronic components
plastic housing
shaped electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19702031285
Other languages
German (de)
Other versions
DE2031285A1 (en
DE2031285C3 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE2031285A1 publication Critical patent/DE2031285A1/en
Publication of DE2031285B2 publication Critical patent/DE2031285B2/en
Application granted granted Critical
Publication of DE2031285C3 publication Critical patent/DE2031285C3/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22—Electrodes
    • H01G11/30—Electrodes characterised by their material
    • H01G11/46—Metal oxides
    • H10W70/481—
    • H10W74/01—
    • H10W74/111—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H10W72/07336—
    • H10W74/00—
    • H10W90/766—

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE2031285A 1969-06-24 1970-06-24 Process for the production of a number of plate-shaped electronic components with a plastic housing Expired DE2031285C3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4950169 1969-06-24

Publications (3)

Publication Number Publication Date
DE2031285A1 DE2031285A1 (en) 1971-01-07
DE2031285B2 true DE2031285B2 (en) 1971-11-11
DE2031285C3 DE2031285C3 (en) 1979-11-22

Family

ID=12832875

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2031285A Expired DE2031285C3 (en) 1969-06-24 1970-06-24 Process for the production of a number of plate-shaped electronic components with a plastic housing

Country Status (4)

Country Link
BE (1) BE750732A (en)
DE (1) DE2031285C3 (en)
FR (1) FR2052410A5 (en)
SE (1) SE352802B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2648979A1 (en) * 1975-10-31 1977-05-12 Western Electric Co LIGHT EMITTING DISPLAY DEVICE

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7203719A (en) * 1972-03-20 1973-09-24
DE202008005708U1 (en) 2008-04-24 2008-07-10 Vishay Semiconductor Gmbh Surface-mountable electronic component
DE102012222791A1 (en) * 2012-12-11 2014-06-12 Robert Bosch Gmbh Method for contacting a semiconductor and semiconductor device with increased stability to thermomechanical influences

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2648979A1 (en) * 1975-10-31 1977-05-12 Western Electric Co LIGHT EMITTING DISPLAY DEVICE

Also Published As

Publication number Publication date
FR2052410A5 (en) 1971-04-09
BE750732A (en) 1970-11-03
DE2031285A1 (en) 1971-01-07
DE2031285C3 (en) 1979-11-22
SE352802B (en) 1973-01-08

Similar Documents

Publication Publication Date Title
CH519789A (en) Method of manufacturing a semiconductor device
DE2004795B2 (en) PROCESS FOR MANUFACTURING CORRUGATED BOARD
CH505473A (en) Method of manufacturing a semiconductor device
AT330878B (en) METHOD OF MANUFACTURING A CONTACT-THROUGH CIRCUIT BOARD
CH533907A (en) Method for manufacturing a semiconductor device
DE1918845B2 (en) METHOD FOR MANUFACTURING SEMICONDUCTOR ARRANGEMENTS
CH512144A (en) Method for manufacturing a semiconductor device
DE1924775B2 (en) METHOD OF MANUFACTURING A CIRCUIT BOARD
CH448489A (en) Process for the manufacture of plastic strips that are smooth on one side
AT316956B (en) Process for metallizing plastic surfaces
AT307504B (en) Method for manufacturing a semiconductor component
CH520405A (en) Method for manufacturing a semiconductor device
DE2031285B2 (en) METHOD OF MANUFACTURING A NUMBER OF PLATE-SHAPED ELECTRONIC COMPONENTS WITH PLASTIC HOUSING
CH519790A (en) Method for manufacturing a semiconductor device
AT319182B (en) Method and device for manufacturing a brush
AT299309B (en) Method of manufacturing a semiconductor device
CH506178A (en) Method of manufacturing a luminous display device
AT294418B (en) METHOD FOR MANUFACTURING POLYOLEFINS
AT281957B (en) Process for the production of a board with extensive wiring
CH504147A (en) Process for making a printed circuit board
AT287810B (en) Process for manufacturing electronic components
DE2102377B2 (en) METHOD AND DEVICE FOR MANUFACTURING A MULTI-LAYER PLASTIC FILM
AT271570B (en) Method of manufacturing a semiconductor device
CH474859A (en) Method of manufacturing a semiconductor device
BR7016450D0 (en) COPPER COATED PLASTIC PANEL AND MANUFACTURING PROCESS

Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)