DE20301608U1 - Fan free panel computer with increased computing capacity in a protective sheet metal or plastic housing - Google Patents

Abstract

The computer has a one or more part operating unit with or without a covering and containing components such as a display, motherboard, back plane with slot central processing unit (CPU), all-in-one board, other boards with integrated processors. The boards is parallel or perpendicular to the display. The housing may also contain hard drives or CD ROM drives or memory etc. Cooling walls and/or cooling ribs are integrated in the side and/or back walls of the housing and/or in the top and/or bottom.. The processor is cooled by one or more fluid coolers without a fan. The part of the cooler which takes up the heat lies via a plate and/or adaptor system directly on the surface of the processor and is fastened to the cooling wall via adaptor plates.

Description

Richard Wöhr GmbH

Graefenau 58 - 60

75339 Hofen

Fanless panel computers with high computing power in sheet metal and/or plastic housings

high protection class

The invention relates to a fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection, in which the heat generated in the processor is transferred to a solid cooling wall by means of a liquid cooler, wherein the cooling wall is integrated as part in one and/or several housing walls and/or lid and/or base of the closed and in particular sealed housing and consists of a material that conducts heat well and the required internal power supply is integrated in the housing in such a way that the heat-generating power components of the power supply are attached to the cooling wall and/or have direct contact with the cooling wall by means of a passive cooling unit, wherein the heat transferred to the cooling wall is released to the environment by means of convection and the housing is designed in one and/or multiple parts as a sheet metal and/or plastic construction, and mainly consists of the partial housings and/or components front panel and/or display housing and/or rack housing and/or housing covers as well as the internal receptacles for the components and at least the electrical and/or electronic standard components such as motherboard and/or backplane with Slot CPU and/or all-in-one board and/or memory modules and/or hard disk drives and/or flash memory and/or power supply and/or converter and/or CD-ROM and/or floppy disk drive and/or the like, as well as a flat display and/or control unit are installed in the housing, wherein the motherboard and/or the backplane with the slot CPU and/or the all-in-one board is arranged parallel and/or at right angles and parallel and/or parallel and parallel to the display and/or control unit.

Industrial computers of this type are used in large numbers, for example in medical technology, automation technology, mechanical engineering and visualization. The devices are compact and have high computing power and limited operational reliability. Since the electrical and/or electronic components sometimes generate considerable heat, at least one heat sink with a fan is used to cool these components in order to dissipate the heat generated through suitable housing openings. The disadvantage of this design is that the housings do not have a high protection class in terms of contact, foreign body and water protection and are very loud due to the fans and do not have a long service life. There are also problems with shielding in terms of EMC. In addition, the pollutants emitted by the electrical and electronic components via the fans have a negative impact on the well-being, health and productivity of the people working there.

Computer cases are also known in which both the display and the rack housing are made of cast parts, but which have heat sinks with fans and/or convection cooling to cool the chips and/or processors. The disadvantage of these solutions is that when using a heat sink and fan, a high degree of protection against contact, foreign bodies and water is not achieved, and when using convection cooling, high performance of the processor is not possible. The power supplies used in these cases have an integrated fan. The disadvantage here is that a high degree of protection against contact, foreign bodies and water is not achieved, and that the fans are very loud.

Furthermore, industrial computers are known that have a specially developed CPU board with an integrated power supply attached to a cooling front frame, whereby the CPU board is designed in such a way that at least some of the heat-generating CPU board components are connected to the front frame. The disadvantage of this solution is that, on the one hand, no standard components such as motherboards and/or power supplies or similar can be used, which leads to a very high price, since the specially developed CPU board is not produced in such large quantities and, on the other hand, the latest, most powerful processors are not used. In addition, by using the front frame as a heat sink, only a small part of the housing is used for heat dissipation, which also does not allow for high processor performance.

The object of the invention is to provide a fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection of the type mentioned above, which

have an unlimited service life in terms of cooling, in which standard components can be installed, which are noiseless and have a high degree of protection with regard to contact, foreign body and water protection and whose housings are closed and sealed and in which the heat generated by the heat-generating components is transported to the cooling wall by means of a liquid cooler and/or by heat conduction through passive cooling units.

This task is solved with a fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection in that a closed and in particular sealed housing consisting of a front panel made of aluminum, a display housing attached to it and/or a display housing without a front panel with a rack housing and/or housing cover made of plastic and/or metal, the rack housing and/or the housing cover on the back and/or a side wall and/or lid and/or base has a recess in which the cooling wall with integrated cooling fins is mounted, wherein when the cooling wall is used on the back, the standard motherboard and/or the all-in-one board and/or the backplane with slot CPU with the heat-emitting processor and the heat-emitting components of the power supply are attached to the cooling wall, or these components of the power supply are connected to the cooling wall via a passive cooling unit via heat conduction and the processor is thermally coupled to the cooling wall via a liquid cooler, wherein the heat-absorbing end of the liquid cooler is connected by means of a heat absorption plate attached to it is attached to the processor and/or motherboard in such a way that the surface of the processor lies directly on the underside of the heat absorption plate and thus has direct contact with it and the heat-emitting end of the liquid cooler is attached to the cooling wall with an adapter plate and/or is soldered and/or glued, and at least the electrical and/or electronic standard components memory modules and/or hard disk drives and/or flash memory and/or converters and/or CD-ROM and/or floppy disk drive and/or the like, as well as a flat display and/or control unit are built into the housing, wherein the motherboard and/or the backplane with the slot CPU and/or the all-in-one board is arranged parallel and/or at right angles and parallel and/or parallel and parallel to the display and/or control unit.

A preferred embodiment of the invention has an aluminum front panel with a display housing attached to it and a metal housing cover, the multi-part housing being closed and sealed. The housing cover has a recess on the back for the required cooling wall with cooling fins. The motherboard with the cooling processor is attached to the cooling wall, as is the fanless power supply, with the heat-generating components being attached directly to the cooling wall. The heat-absorbing end of the liquid cooler is attached to a copper plate, the copper plate being attached to the attachment points for the cooler on the motherboard and resting directly on the surface of the processor. The heat-emitting end of the liquid cooler is attached to the cooling wall using an adapter plate. The display with the converters and the control electronics is integrated in the display housing, as well as the electrical and/or electronic standard components, memory modules and/or hard disk drives and/or flash memory and/or converters and/or CD-ROM and/or floppy disk drive and/or the like, within the housing cover. The motherboard with the cooling wall is arranged parallel to the display.

A further preferred embodiment of the invention has a one-piece metal housing with a cover attached to it, with an operating unit integrated into the front of the recess for the display. The cover in turn has a recess for the cooling wall with integrated cooling fins, with the structure of the computer unit being as follows: Fastening of a filter glass pane and/or touchscreen to the display housing using a mounting frame, with both the display with the converters etc. and the mounting plate for the standard motherboard being attached to the mounting frame. The electrical and/or electronic standard components memory modules and/or hard disk drives and/or flash memory and/or converters and/or CD-ROM and/or floppy disk drive and/or the like are arranged and attached to the mounting plate flat next to and/or above the motherboard, depending on the housing shape and dimensions. The power supply is attached to the cooling wall in such a way that the wall with the heat-generating components has direct contact with the cooling wall, with the cooling wall being connected and attached to the mounting plate over distances. The heat-absorbing end of the liquid cooler is attached to the motherboard processor by means of a plate and the heat-emitting end of the liquid cooler is attached to the cooling wall by means of an adapter plate. Because the heat-generating components are directly thermally coupled to the cooling wall, no fan and/or ventilation slots are required in the case. This solution has the advantage that the cooling wall has the optimal

size and releases a large amount of heat into the environment. This allows the use of very high performance processors.

Further preferred embodiments of the invention include single-part and/or multi-part housings made of plastic and/or metal, in which the side walls and/or lid and/or base of the housing cover and/or the housing also have recesses for cooling walls. This allows the surface area of the cooling walls that have to dissipate the heat to be significantly increased. This enables even higher performance of the processors. They also have different motherboards and/or slot CPUs with backplanes, with the liquid cooler being designed so that the heat-absorbing end is attached to the processor and the heat-emitting end is attached to and/or the cooling walls.

The invention is explained in more detail using an embodiment shown in the drawings.

Fig. 1: Fanless panel computer with high computing power in a one-piece sheet metal housing with high protection class

Fig. 2: Side and rear view of the housing with integrated cooling walls

In the figures, unless otherwise stated, like sources of supply refer to like parts with like meaning.

1 Housing 2 Back cover 3 Housing front 4 Display section 5 Recess 6 Cooling wall 7 Cooling fins 8th Filter glass pane 9 Display 10 power adapter 11 Heat-emitting components of the power supply 12 Motherboard 13 processor 14 Recording device 15 CD-ROM 16 Hard disk drive 17 Heat-absorbing part of the liquid cooler 18 Liquid cooler 19 Copper plate 20 Heat dissipating part of the liquid cooler 21 Adapter plate 22 Side wall 23 Back wall

Figure 1 shows the fanless panel computer with high computing power in a one-piece sheet metal housing with a high degree of protection. The housing 1 is a one-piece sheet metal construction with a rear cover 2. The housing front 3 has a display cutout 4 and the rear cover has a recess 5 for the cooling wall 6 with integrated cooling fins 7. A filter glass pane 8 and the display 9 are attached to the display cutout. The power supply unit 10 is attached to the rear cover 2, with the heat-emitting components 11 of the power supply unit 10 being attached directly to the cooling wall 6. The motherboard 12 with the processor 13 is attached to the holder 14 parallel to the display 9. The CD-ROM 15 and the hard disk drive 16 are also accommodated in the housing 1. The heat-absorbing part 17 of the liquid cooler 18, which is attached to a copper plate 19, lies directly on the surface of the processor 13 and is thus directly thermally coupled to the processor 13. The heat-emitting part 20 of the liquid cooler 18 is attached to the cooling wall 6 by means of an adapter plate 21. The shape of the liquid cooler 18 is adapted to the shape of the housing 1.

Figure 2 shows a schematic perspective view of the housing 1. The side wall 22 and rear wall 23 of the housing 1 have recesses 5 in which cooling walls 6 are integrated.

Claims (14)

1. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection with a one- and/or multi-part closed control unit with and/or without a cover and components arranged therein such as a display and/or motherboard and/or backplane with slot CPU and/or all-in-one board and/or other board with processors integrated therein, the board being arranged parallel and/or parallel and at right angles to the display, and/or hard disk drive and/or CD-ROM and/or RAM and similar components, characterized in that cooling walls and/or heat sinks are integrated into the side and/or rear walls and/or lid and/or base of the housing and/or the housing cover, and the processor is cooled by one and/or more liquid coolers without a fan, the heat-absorbing part of the liquid cooler resting directly on the surface of the processor by means of a plate and/or adapter system and the heat-emitting part of the liquid cooler being attached to the cooling wall by means of adapter plates. 2. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to claim 1, characterized in that the side and/or rear walls and/or lid and/or base of the housing and/or the housing cover have recesses in which the cooling walls and/or heat sinks are installed. 3. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the side and/or rear walls and/or lid and/or base of the housing and/or the housing cover have recesses for the direct thermal coupling of the liquid cooler with the cooling wall and/or heat sink. 4. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the housing walls and/or housing covers are used as cooling walls and/or heat sinks. 5. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the fanless power supply unit is attached to the cooling wall and/or heat sink, so that the direct heat transfer from the power supply unit heat sink to the cooling wall and/or heat sink takes place. 6. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the heat-emitting components of the fanless power supply are mounted directly on the cooling wall and/or heat sink. 7. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that a heat pipe is used as the liquid cooler. 8. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the plate and/or the adapter system and/or the adapter plates of the liquid cooler are made of copper and/or aluminum and/or their alloys. 9. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the cooling wall and/or cooling body have integrated cooling fins and/or cooling blades to enlarge the cooling surface. 10. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the shape of the liquid cooler is adapted to the installation arrangement of the components within the housing. 11. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that different fastening systems and options are used to fasten the plate and/or the adapter system of the heat-absorbing end of the liquid cooler, which depend on the choice of processor and processor socket. 12. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the CD-ROM and other drives are arranged so as to be accessible behind flaps. 13. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the connectors for the keyboard, Ethernet and power supply are arranged so as to be accessible behind a flap. 14. Fanless panel computer with high computing power in sheet metal and/or plastic housings with a high degree of protection according to one of the preceding claims, characterized in that the cables are led through an opening in the housing.