DE202010008806U1 - Flexible LED packaging arrangement - Google Patents

Abstract

Flexible LED packaging arrangement, comprising:
a first metal substrate (10);
an LED chip (30) mounted on the first metal substrate (10) via a current and heat conductive interconnect layer (50);
a second metal substrate (20) electrically connected to the LED chip (30) by wire bonding, with a gap (60) between the first metal substrate (10) and the second metal substrate (20); and
a package bulk body (40) made of a flexible material, wherein the LED chip (30) is completely enveloped by the package mass body (40) while the first metal substrate (10) and the second metal substrate (20) are partially wrapped thereby are that the chip carrier plate (1) and the second metal substrate (20) are exposed below.

Description

The The invention relates to an LED packaging arrangement, in particular a LED packaging arrangement in which metal substrates for increasing the Wärmeabführleistung and a flexible packing mass body are provided.

The Development of light emitting diode (LED) has matured and their applications are very wide and practical. For example, light-emitting diodes as a screen backlight, electronic billboards (both outside as well as inside) and directly as a lighting device used. In other words, the light-emitting diodes are very widespread.

All no matter in which area the light-emitting diode is used, it is common to use several Light emitting diodes simultaneously use the brightness of the light source to reinforce. While this can achieve the purpose directly and effectively, it does connected cooling problem occurs, however. About that In addition, in conventional LED lamps the printed circuit board as a support plate or substrate used. A disadvantage is the substrate whose material is not for heat dissipation provides. Therefore, you can the lighting elements due to high temperatures that are not properly dissipated, be defective or blown.

Next the use of multiple light emitting diodes, as in the state of Technique for light intensity is usually the case, is still disadvantageous that the entire Construction of the conventional LED bulbs is not flexible. To prevent this is a substrate made of flexible material. This allows the single LED lamps are bent. It is not possible, however LED lamp devices, all in one package mass, to bend. Under the operation that the individual LED bulbs separately are packed and do not come into contact with each other, the assembly is at the restricted Arrangement density difficult.

By The invention provides a flexible LED packaging arrangement in which the Material of the substrate to increase the heat removal performance changed is, wherein the packing mass body made of a flexible material, whereby the entire Construction of the LED lamp is flexible.

In addition, will created by the invention, a light emitting diode with high Wärmeabführleistung, wherein the conventional one rigid LED packaging arrangement by means of a flexible LED packaging arrangement is replaced. This means, that the light-emitting diode (LED) by a flexible packing mass body after the packing method is flexible, whereby the light-emitting diode according to the invention in Lamp devices of different types can be installed.

According to the invention, there is provided a flexible LED packaging device comprising:
a first metal substrate;
an LED chip mounted on the first metal substrate via a current and heat conductive interconnect layer;
a second metal substrate electrically connected to the LED chip by wire bonding, with a gap between the first metal substrate and the second metal substrate; and
a packing mass body made of a flexible material, wherein the LED chip is completely enveloped by the packing mass body, while the first metal substrate and the second metal substrate are partially enveloped therefrom so that the chip support plate and the second metal substrate are exposed underneath.

there is the current and heat conducting Bonding layer as soldering paste, Silver paste or eutectic. The flexible invention LED packaging arrangement also has two connection feet, electrically connected to the first and second metal substrates, respectively are.

In addition, according to the invention there is provided a flexible LED packaging device in parallel, comprising:
a chip carrier plate having at least one V-shaped recess, thereby resulting in a plurality of first metal substrates, wherein LED chips are arranged by means of a current and heat-conductive bonding layer on the respectively associated first metal substrates;
a second metal substrate electrically connected to the LED chips by wire bonding, with a gap between the chip support plate and the second metal substrate; and
a package mass body made of a flexible material, wherein the LED chips are completely enveloped by the package mass body, while the chip carrier plate and the second metal substrate are partially enveloped therefrom so that the chip carrier plate and the second metal substrate are exposed underneath.

Furthermore, according to the invention there is provided in series a flexible LED packaging device comprising a plurality of series-connected LED units, each comprising:
a first metal substrate;
an LED chip, which has a current and heat-conducting connection layer on the first metal substrate is appropriate;
a second metal substrate electrically connected to the LED chip by wire bonding, with a space between the first metal substrates and between the first metal substrate and the second metal substrate; and
a packing mass body made of a flexible material, wherein the light emitting diodes are completely enveloped by the packing mass body, while the first metal substrates and the second metal substrate are partially enveloped therefrom so that the first metal substrates and the second metal substrate are exposed underneath.

In addition, according to the invention there is provided a flexible LED packaging device in parallel, comprising:
a chip carrier plate having at least one V-shaped recess, thereby resulting in a plurality of first metal substrates, wherein LED chips are arranged by means of a current and heat-conductive bonding layer on the respectively associated first metal substrates;
a second metal substrate electrically connected to the LED chips by wire bonding, with a gap between the chip support plate and the second metal substrate; and
a package mass body made of a flexible material, wherein the LED chips are completely enveloped by the package mass body, while the chip carrier plate and the second metal substrate are partially enveloped therefrom so that the chip carrier plate and the second metal substrate are exposed underneath.

Moreover, according to the invention there is provided in series a flexible LED packaging device comprising a plurality of series connected LED units, each comprising:
a first metal substrate;
an LED chip mounted on the first metal substrate via a current and heat conductive interconnect layer;
a second metal substrate electrically connected to the LED chip by wire bonding, with a space between the first metal substrates and between the first metal substrate and the second metal substrate; and
a packing mass body made of a flexible material, wherein the LED chips are completely enveloped by the packing mass body, while the first metal substrates and the second metal substrate are partially enveloped therefrom so that the first metal substrates and the second metal substrate are exposed underneath.

Furthermore, the invention provides a flexible LED packaging arrangement comprising:
a first metal substrate;
an LED chip mounted on the first metal substrate via a current and heat conductive interconnect layer;
two second metal substrates electrically connected by wire bonding to the plus and minus poles of the LED chip, respectively, with a gap between the first metal substrate and the two second metal substrates; and
a packing mass body made of a flexible material, wherein the LED chip is completely enveloped by the packing mass body while the first metal substrate and the two second metal substrates are partially enveloped therefrom so that the first metal substrate and the two second metal substrates are exposed underneath.

Further provided by the invention is a flexible LED package assembly comprising:
a first metal substrate;
an LED chip, wherein one of the electrical poles of the LED chip is attached to the first metal substrate by means of the current and heat-conductive connection layer;
a second metal substrate, wherein the other pole of the LED chip is attached to the second metal substrate via the current and heat conductive interconnection layer, with a space between the first metal substrate and the second metal substrate; and
a packing mass body made of a flexible material, wherein the LED chip is completely enveloped by the packing mass body, while the first metal substrate and the second metal substrate are partially enveloped therefrom so that the first metal substrate and the second metal substrate are exposed underneath.

The flexible according to the invention LED packaging arrangement is characterized in that the metal substrate is used to carry the LED chip. In this way, the Wärmeabführleistung to a considerable extent elevated become. Thus, the flexible LED packaging arrangement according to the invention used in products that operate at high power or in which several LED lamps are used. With the packing mass body, the flexible according to the invention can be Bend LED packaging assembly after the packing process, causing these can be used in all types of lamp devices. This is ensures a wide field of application of the present invention. When series or parallel connection of the LED chips, the above-mentioned advantages also meet.

in the Below, the invention and its embodiments with reference to the Drawing closer explained. In the drawing shows:

1 a perspective view of a preferred embodiment according to the invention;

2A a schematic representation of the preferred embodiment according to the invention;

2 B a schematic representation of the preferred embodiment according to the invention in a bent position;

3A a plan view of the present invention with a plurality of parallel-connected LED chips;

3B a side view of the present invention with a plurality of parallel-connected LED chips;

4A a plan view of the present invention with a plurality of series-connected LED chips;

4B a side view of the present invention with a plurality of series-connected LED chips;

5 a side view of the LED packaging arrangement according to the invention, wherein the plus and minus pole of the LED chip are arranged frontally; and

6 a side view of the LED packaging arrangement according to the invention, wherein the plus and minus pole of the LED chip are arranged on the back side.

Like from the 1 . 2A and 2 B As can be seen, a flexible LED packaging arrangement according to the invention has a first metal substrate 10 , an LED chip 30 , a second metal substrate 20 and a packing mass body 40 on. On the first metal substrate 10 is the LED chip 30 on.

To securely lock the LED chip 30 to enable, is a current and heat-conducting compound layer 50 between the LED chip 30 and the first metal substrate 10 intended. The metal substrate is used to increase the heat dissipation performance of light emitting diodes. Therefore, the material is applicable if it has excellent heat conductivity. For example, the material may contain metal of aluminum or copper. The second metal substrate 20 is through wire bottom electrically with the LED chip 30 connected. The first metal substrate 10 and the second metal substrate 20 stand at a distance 60 to each other. In this way they can be independent of each other, if they are used as plus or minus pole. In addition, the packing mass body 40 made of flexible material. This results in a bending over by the distance 60 when the first and second metal substrates 10 . 20 through the packing mass body 40 are closed.

In order to improve the cooling effect, the first and the second metal substrate 10 . 20 not completely from the packing mass body 40 wrapped. That is, the lower side of the first and second metal substrates 10 exposed and thus comes into direct contact with the environment or with external cooling fins. In this way, an increased Wärmeabführleistung is achieved. On the other hand, the LED chip 30 completely in the packing mass body 40 closed to provide optimum protection.

Taking into account the heat dissipation ability, the current and heat-conducting compound layer 50 be applied using the solder, silver paste or eutectic mixture to secure anchoring of the LED chip 30 and effective heat dissipation to the first metal substrate 10 to ensure.

In addition to the arrangement in which the first and the second metal substrate 10 . 20 can be used as a plus or minus pole, also two connecting feet 70 be provided, which electrically to the first and the second metal substrate 10 . 20 are connected. Thereupon, the construction mentioned above becomes over the two connecting feet 70 soldered to a circuit board.

It will then open 3A and 3B Referenced. Based on the structural principle of the previous embodiment, the embodiment according to 3A and 3B a chip carrier plate 1 , a second metal substrate 20 and a packing mass body 40 on. On the chip carrier plate 1 are several parallel LED chips 30 arranged. Structurally, the chip carrier plate 1 at least one V-shaped recess, resulting in a plurality of first metal substrates 10 result. Thereupon the LED chips are 30 by means of the current and heat-conducting connection layer 50 at the respectively assigned first metal substrates 10 glued. On the other hand, the LED chips 30 by wire bonding electrically to the second metal substrate 20 connected. Between the chip carrier plate 1 and the second metal substrate 20 there is a gap 60 in front. As in the above-mentioned embodiment, the packing mass body is 40 For practical bending made of a flexible material, the LED chips 30 completely from the packing mass body 40 are shrouded while the chip support plate 1 and the second metal substrate 20 partly from this so ge Wraps are that the chip support plate 1 and the second metal substrate 20 below. Thus, the heat dissipation performance can be increased to a considerable extent. At the same time, the purpose for bending is fulfilled.

Furthermore, it will open 4A and 4B Referenced. In the embodiment according to 4A and 4B are several LED units 2 , a second metal substrate 20 and a packing mass body 40 intended. The LED units 2 are connected in series. Each of the LED units 2 includes a first metal substrate 10 and an LED chip 30 , As in the previous embodiments, the LED chips 30 via a current and heat-conducting connection layer 50 at the respectively assigned first metal substrates 10 attached, with the LED units 2 by wire bonding electrically to the second metal substrate 20 are connected. Between the respective first metal substrates 10 and between the first and second metal substrates 10 . 20 there is a gap 60 in front. The purpose is the same as in the previous embodiments. In addition to the separation of the electrical poles, the distance serves 60 especially the flexibility. It should be noted that the flexible LED packaging device according to the invention is suitable for cases when a DC or AC voltage is applied. Different are only the design and arrangement of the electrical poles. When applying the DC voltage all electrical poles remain, the electric poles are removed when applying the AC voltage. The packing mass body 40 is made of a flexible material and thus flexible according to the packing method. Besides, the LED chips are 30 completely from the packing mass body 40 wrapped, wherein the first metal substrates 10 and the second metal substrate 20 are partially wrapped by this, such that the first metal substrates 10 and the second metal substrate 20 below. Thus, the heat dissipation performance can be increased to a considerable extent.

According to 5 The flexible LED packaging arrangement according to the invention has a first metal substrate 10 , an LED chip 30 , two second metal substrates 20 and a packing mass body 40 on. The LED chip 30 is via a current and heat conducting compound layer 50 on the first metal substrate 10 appropriate. Since the at both ends of the LED chip 30 located plus or minus pole both on the front side of the LED chip 30 are arranged, the first metal substrate is used 10 just to carry the LED chip 30 , The plus and the minus pole of the LED chip 30 are electrically connected by wire bonding to the respectively associated second metal substrates 20 connected. In order to separate the plus and minus poles, there is a gap between them 60 between the first metal substrate 10 and the two second metal substrates 20 in front. As in the previous embodiments, the packing mass body 40 made of a flexible material and thus is flexible according to the packing method. In addition, the LED chip 30 completely from the packing mass body 40 wrapped, wherein the first metal substrate 10 and the two second metal substrates 20 are partially wrapped by this, that the first metal substrate 10 and the two second metal substrates 20 below. For an increased heat dissipation performance can be achieved.

According to 6 The flexible LED packaging arrangement according to the invention has a first metal substrate 10 , an LED chip 30 , a second metal substrate 20 and a packing mass body 40 on. Since the plus and the negative pole both at the back of the LED chip 30 are arranged, one of the electrical poles by means of the conductive adhesive on the first metal substrate 10 attached, while the other pole on the current and heat-conducting compound layer 50 on the second metal substrate 20 is appropriate. There is a gap to separate the plus and minus poles 60 between the first metal substrate 10 and the second metal substrate 20 in front. As in the previous embodiments, the packing mass body 40 made of a flexible material and thus is flexible according to the packing method. In addition, the LED chip 30 completely from the packing mass body 40 wrapped, wherein the first metal substrate 10 and the two second metal substrates 20 are partially wrapped by this, that the first metal substrate 10 and the two second metal substrates 20 below. For an increased heat dissipation performance can be achieved.

The flexible LED packaging arrangement according to the invention is characterized in that the metal substrate is used to support the LED chip. In this way, the Wärmeabführleistung can be increased significantly. Thus, the flexible LED packaging arrangement according to the invention can be used in products which are operated at high power or in which a plurality of LED lamps are used. With the packing mass body 40 The flexible LED packaging arrangement according to the invention can be bent according to the packaging method, whereby it can be used in all types of lamp devices. This ensures a wide field of application of the present invention. For serial or parallel connection of the LED chips 30 the above-mentioned advantages can also be fulfilled. A further advantage is that the inventive flexible LED packaging arrangement can be used when applying DC or AC voltage. This considerably extends the field of application.

The present invention thus relates to a flexible LED packaging device comprising: a first metal substrate 10 ; an LED chip 30 , which has a current and heat conducting connection layer 50 on the first metal substrate 10 is appropriate; a second metal substrate 20 that is electrically wired to the LED chip by wire bonding 30 is connected, with a distance 60 between the first metal substrate 10 and the second metal substrate 20 is present; and a packing mass body 40 which is made of a flexible material, the LED chip 30 completely from the packing mass body 40 is wrapped while the first metal substrate 10 and the second metal substrate 20 partly so wrapped by this, that the chip carrying plate 1 and the second metal substrate 20 below. By the above-mentioned structural principle, the LEDs may be arranged in series or in parallel. Due to the metal substrates, the Wärmeabführleistung can be increased significantly. Due to the flexible property, the LED packaging arrangement according to the invention can be used in numerous types of lamp devices.

The The above description presents the embodiments of the invention and should not be the claims restrict. All equivalent changes and modifications as described and the drawings of the invention made by a person skilled in the art can be belong to Protection of the present invention.

LIST OF REFERENCE NUMBERS

1

Chip-supporting plate

10

first metal substrate

2

LED unit

20

second metal substrate

30

LED chip

40

Packing mass body

50

electricity- and thermally conductive link layer

60

distance

70

Linking foot

Claims (9)

A flexible LED package assembly comprising: a first metal substrate ( 10 ); an LED chip ( 30 ), which via a current and heat conductive connection layer ( 50 ) on the first metal substrate ( 10 ) is attached; a second metal substrate ( 20 ), which by wire bonding electrically with the LED chip ( 30 ), where a distance ( 60 ) between the first metal substrate ( 10 ) and the second metal substrate ( 20 ) is present; and a packing mass body ( 40 ), which is made of a flexible material, wherein the LED chip ( 30 ) completely from the packing mass body ( 40 ), while the first metal substrate ( 10 ) and the second metal substrate ( 20 ) are partially wrapped by this so that the chip support plate ( 1 ) and the second metal substrate ( 20 ) below. LED packing arrangement according to claim 1, characterized in that the current and heat-conducting connecting layer ( 50 ) is designed as a solder paste. LED packing arrangement according to claim 1, characterized in that the current and heat-conducting connecting layer ( 50 ) is designed as a silver paste. LED packing arrangement according to claim 1, characterized in that the current and heat-conducting connecting layer ( 50 ) is designed as a eutectic. LED packaging arrangement according to one of claims 1 to 4, further comprising two connecting feet ( 70 ) electrically connected to the first and the second metal substrate ( 10 . 20 ) are connected. Flexible LED packaging arrangement in parallel, comprising: a chip carrier plate ( 1 ) having at least one V-shaped recess, whereby a plurality of first metal substrates ( 10 ), with LED chips ( 30 ) by means of a current and heat-conducting connecting layer ( 50 ) at the respectively assigned first metal substrates ( 10 ) are arranged; a second metal substrate ( 20 ), which is wire-bonded electrically to the LED chips ( 30 ), where a distance ( 60 ) between the chip carrier plate ( 1 ) and the second metal substrate ( 20 ) is present; and a packing mass body ( 40 ), which is made of a flexible material, wherein the LED chips ( 30 ) completely from the packing mass body ( 40 ) while the chip carrier plate (FIG. 1 ) and the second metal substrate ( 20 ) are partially wrapped by this so that the chip support plate ( 1 ) and the second metal substrate ( 20 ) below. Flexible LED packaging device in series, comprising a plurality of series connected LED units ( 2 ), each of which comprises: a first metal substrate ( 10 ); an LED chip ( 30 ), which via a current and heat conductive connection layer ( 50 ) on the first metal substrate ( 10 ) is attached; a second metal substrate ( 20 ), which by wire bonding electrically with the LED chip ( 30 ), where a distance ( 60 ) between the first metal substrates ( 10 ) and between the first metal substrate ( 10 ) and the second metal substrate ( 20 ) is present; and a packing mass body ( 40 ), which is made of a flexible material, wherein the LED chips ( 30 ) completely from the packing mass body ( 40 ) while the first metal substrates ( 10 ) and the second metal substrate ( 20 ) are partially wrapped by this, that the first metal substrates ( 10 ) and the second metal substrate ( 20 ) below. A flexible LED package assembly comprising: a first metal substrate ( 10 ); an LED chip ( 30 ), which via a current and heat conductive connection layer ( 50 ) on the first metal substrate ( 10 ) is attached; two second metal substrates ( 20 ), which are wire-bonded electrically to the plus or minus pole of the LED chip ( 30 ), where a distance ( 60 ) between the first metal substrate ( 10 ) and the two second metal substrates ( 20 ) is present; and a packing mass body ( 40 ), which is made of a flexible material, wherein the LED chip ( 30 ) completely from the packing mass body ( 40 ), while the first metal substrate ( 10 ) and the two second metal substrates ( 20 ) are partially wrapped by this, that the first metal substrate ( 10 ) and the two second metal substrates ( 20 ) below. A flexible LED package assembly comprising: a first metal substrate ( 10 ); an LED chip ( 30 ), wherein one of the electrical poles of the LED chip ( 30 ) by means of the current and heat-conducting connecting layer ( 50 ) on the first metal substrate ( 10 ) is attached; a second metal substrate ( 20 ), the other pole of the LED chip ( 30 ) via the current and heat-conducting connecting layer ( 50 ) on the second metal substrate ( 20 ), wherein a distance ( 60 ) between the first metal substrate ( 10 ) and the second metal substrate ( 20 ) is present; and a packing mass body ( 40 ), which is made of a flexible material, wherein the LED chip ( 30 ) completely from the packing mass body ( 40 ), while the first metal substrate ( 10 ) and the second metal substrate ( 20 ) are partially wrapped by this, that the first metal substrate ( 10 ) and the second metal substrate ( 20 ) below.

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